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    • 1. 发明授权
    • Image recording apparatus using microcapsules to form a color image
    • 使用微胶囊形成彩色图像的图像记录装置
    • US4933708A
    • 1990-06-12
    • US177698
    • 1988-04-05
    • Yuji AsanoIsao Kawano
    • Yuji AsanoIsao Kawano
    • G03F7/00G03G15/22
    • G03F7/0022G03G15/228G03B2227/325
    • An image recording apparatus which eliminates a positive film for carrying photomasks. The apparatus for recording an image on a recording medium uses a recording media including first and second recording mediums. The first recording medium has first and second surfaces and is provided with a first material whose phase is changeable upon light exposure, and the second recording medium is provided with a second material reactable with the first material for forming a final output image thereon. The image recording apparatus forms light-shieldable masks on the first surface of the first recording medium. A light exposure arrangement confronts the first surface of the first recording medium for irradiating light toward the mask and the first surface. A pressure-developing arrangement provides the output image on the second recording medium. The second surface of the first recording medium carries the first material, and the second material of the second recording medium confronts the second surface of the first recording medium at the pressure-developing means.
    • 一种消除携带光掩模的正片的图像记录装置。 用于在记录介质上记录图像的设备使用包括第一和第二记录介质的记录介质。 第一记录介质具有第一和第二表面,并且设置有第一材料,其相位可在曝光时改变,并且第二记录介质设置有可与第一材料反应的第二材料,用于在其上形成最终输出图像。 图像记录装置在第一记录介质的第一表面上形成可遮光掩模。 曝光装置面对第一记录介质的第一表面,用于向掩模和第一表面照射光。 压力显影装置在第二记录介质上提供输出图像。 第一记录介质的第二表面承载第一材料,第二记录介质的第二材料在压力显影装置处面对第一记录介质的第二表面。
    • 10. 发明授权
    • Semiconductor device fabrication method and semiconductor device
    • 半导体器件制造方法和半导体器件
    • US07659135B2
    • 2010-02-09
    • US11327483
    • 2006-01-09
    • Yuji AsanoMorio Kato
    • Yuji AsanoMorio Kato
    • H01L21/00
    • H01L31/0216
    • A semiconductor device fabrication method in which when a semiconductor device with a built-in light receiving element is fabricated, a section for dividing the light receiving element is protected from damage caused by, for example, etching. An antireflection coating is formed not only on a light receiving area in a divided photodiode area but on a division area including a junction area between a division section outside the light receiving area for dividing a photodiode and a cathode. A polycrystalline silicon film is formed so as to cover the antireflection coating. Accordingly, the antireflection coating on the junction area between the division section outside the light receiving area and the cathode is protected against, for example, etching by the polycrystalline silicon film. As a result, the appearance of a crystal defect, a change in impurity concentration, or the like is suppressed in this area. Therefore, a high-performance high-quality semiconductor device with a built-in photodiode can be fabricated.
    • 一种半导体器件制造方法,其中当制造具有内置光接收元件的半导体器件时,用于分割光接收元件的部分被保护免受例如蚀刻引起的损坏。 防反射涂层不仅形成在分光电二极管区域的光接收区域上,而且形成在包含用于分割光电二极管的光接收区域外的分割部分与阴极之间的接合区域的分割区域上。 形成多晶硅膜以覆盖抗反射涂层。 因此,防止在光接收区域外的分割部分与阴极之间的接合区域上的抗反射涂层被防止例如多晶硅膜的蚀刻。 结果,在该区域中抑制了晶体缺陷的出现,杂质浓度的变化等。 因此,可以制造具有内置光电二极管的高性能高品质半导体器件。