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    • 10. 发明授权
    • Semiconductor device fabrication method and semiconductor device
    • 半导体器件制造方法和半导体器件
    • US07659135B2
    • 2010-02-09
    • US11327483
    • 2006-01-09
    • Yuji AsanoMorio Kato
    • Yuji AsanoMorio Kato
    • H01L21/00
    • H01L31/0216
    • A semiconductor device fabrication method in which when a semiconductor device with a built-in light receiving element is fabricated, a section for dividing the light receiving element is protected from damage caused by, for example, etching. An antireflection coating is formed not only on a light receiving area in a divided photodiode area but on a division area including a junction area between a division section outside the light receiving area for dividing a photodiode and a cathode. A polycrystalline silicon film is formed so as to cover the antireflection coating. Accordingly, the antireflection coating on the junction area between the division section outside the light receiving area and the cathode is protected against, for example, etching by the polycrystalline silicon film. As a result, the appearance of a crystal defect, a change in impurity concentration, or the like is suppressed in this area. Therefore, a high-performance high-quality semiconductor device with a built-in photodiode can be fabricated.
    • 一种半导体器件制造方法,其中当制造具有内置光接收元件的半导体器件时,用于分割光接收元件的部分被保护免受例如蚀刻引起的损坏。 防反射涂层不仅形成在分光电二极管区域的光接收区域上,而且形成在包含用于分割光电二极管的光接收区域外的分割部分与阴极之间的接合区域的分割区域上。 形成多晶硅膜以覆盖抗反射涂层。 因此,防止在光接收区域外的分割部分与阴极之间的接合区域上的抗反射涂层被防止例如多晶硅膜的蚀刻。 结果,在该区域中抑制了晶体缺陷的出现,杂质浓度的变化等。 因此,可以制造具有内置光电二极管的高性能高品质半导体器件。