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1. 发明申请

US20110217501A1 DICING DIE-BONDING FILM 审中-公开
标题翻译：定制电影胶片
公开(公告)号：US20110217501A1
公开(公告)日：2011-09-08
申请号：US13041086
申请日：2011-03-04
申请人： Yuichiro Shishido , Takeshi Matsumura , Shuhei Murata
发明人： Yuichiro Shishido , Takeshi Matsumura , Shuhei Murata
IPC分类号： B32B33/00
CPC分类号： H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/85207 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , Y10T428/1476 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： A dicing die-bonding film with excellent peeling property when a diced semiconductor chip and its die-bonding film are, without deteriorating a holding force during dicing a semiconductor wafer even if it is thin. A dicing die-bonding film, comprising a dicing film having at least a pressure-sensitive adhesive layer formed on a supporting base material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the thickness of the pressure-sensitive adhesive layer is 5 to 80 μm, and when the dicing film is peeled off from the die-bonding film after dicing from the side of the die-bonding film to a part of the pressure-sensitive adhesive layer, the maximum value of a peeling force in the vicinity of the cut surface is 0.7 N/10 mm or less under the conditions of a temperature of 23° C., a peeling angle of 180°, and a peeling point moving rate of 10 mm/min.
摘要翻译：当切割的半导体芯片和芯片接合薄膜即使在薄的半导体晶片的切割时也不会使保持力变差，因此具有优异的剥离性能的切割芯片接合薄膜。一种切割芯片接合薄膜，包括至少形成在支撑基材上的压敏粘合剂层的切割薄膜和形成在压敏粘合剂层上的芯片接合薄膜，其中压敏粘合剂的厚度粘合剂层为5〜80μm，从芯片接合膜侧到粘合剂层的一部分切割后将切割膜从芯片接合薄膜剥离后，剥离的最大值在23℃，剥离角度180°，剥离移动速度为10mm / min的条件下，切割面附近的力为0.7N / 10mm以下。

2. 发明授权

US08614139B2 Dicing film with protecting film 失效
标题翻译：带保护膜的切片膜
公开(公告)号：US08614139B2
公开(公告)日：2013-12-24
申请号：US13415524
申请日：2012-03-08
申请人： Yuichiro Shishido , Takeshi Matsumura
发明人： Yuichiro Shishido , Takeshi Matsumura
IPC分类号： H01L21/46
CPC分类号： H01L21/6836 , B32B7/02 , B32B7/12 , B32B27/20 , B32B27/281 , B32B27/36 , B32B27/365 , B32B2457/14 , C09J7/385 , C09J2203/326 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2221/68327 , H01L2221/68377 , H01L2221/68381 , H01L2224/27436 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29388 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/8385 , H01L2224/83862 , H01L2224/85 , H01L2224/9205 , H01L2224/92247 , H01L2224/94 , H01L2924/00013 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , Y10T428/1467 , Y10T428/1471 , Y10T428/24802 , Y10T428/24942 , H01L2224/27 , H01L2924/00014 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00012
摘要： The present invention provides a dicing film with a protecting film that enables to paste a dicing film to a semiconductor wafer without a shift in position while reducing a downtime. There is provided a dicing film with a protecting film in which a dicing film and a protecting film are laminated, wherein the difference between the transmittance of the protecting film and the transmittance of the dicing film with a protecting film at a portion of the dicing film where light for detecting a film transmits first is 20% or more in a wavelength of 600 to 700 nm.
摘要翻译：本发明提供一种具有保护膜的切割膜，其能够将切割膜粘贴到半导体晶片而不会发生位置偏移，同时减少停机时间。提供了一种具有保护膜的切割膜，其中层压有切割膜和保护膜，其中保护膜的透射率与切割膜部分之间的保护膜的切割膜的透射率之间的差异其中首先检测膜的光在600〜700nm的波长下为20％以上。

3. 发明授权

US08278151B2 Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip 失效
标题翻译：用于保持芯片的带状物，保持芯片状工件的方法，使用用于保持芯片的带状半导体器件的制造方法以及用于保持芯片的带的制造方法
公开(公告)号：US08278151B2
公开(公告)日：2012-10-02
申请号：US12969959
申请日：2010-12-16
申请人： Shuhei Murata , Takeshi Matsumura , Koji Mizuno , Fumiteru Asai
发明人： Shuhei Murata , Takeshi Matsumura , Koji Mizuno , Fumiteru Asai
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , B32B7/12 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , H01L24/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/3025 , Y10T428/24331 , Y10T428/24777 , Y10T428/24802 , H01L2924/00014 , H01L2924/00
摘要： The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region.
摘要翻译：本发明的目的在于提供一种用于保持芯片的带状物，其使得片状工件的粘贴和剥离变得容易。用于保持具有在基材上形成压敏粘合剂层的构造的芯片的胶带，其中粘合剂层具有将片状工件粘贴到其上的切屑状工件粘贴区域以及粘贴安装框架的框架粘贴区域，并且通过将安装框架粘贴到框架粘贴区域来使用，其中压敏粘合剂层的180度剥离粘合力到硅镜晶片框状粘贴区域是片状工件粘贴区域的粘合剂层向硅镜面晶片的180度剥离粘合力的5倍以上。

4. 发明申请

US20110159642A1 TAPE FOR HOLDING CHIP, METHOD OF HOLDING CHIP-SHAPED WORKPIECE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING TAPE FOR HOLDING CHIP, AND METHOD OF MANUFACTURING TAPE FOR HOLDING CHIP 失效
标题翻译：用于控股芯片的胶带，保持芯片形成的工件的方法，使用用于控制芯片的带的半导体器件的制造方法以及用于保持芯片的制造带的方法
公开(公告)号：US20110159642A1
公开(公告)日：2011-06-30
申请号：US12969959
申请日：2010-12-16
申请人： Shuhei Murata , Takeshi Matsumura , Koji Mizuno , Fumiteru Asai
发明人： Shuhei Murata , Takeshi Matsumura , Koji Mizuno , Fumiteru Asai
IPC分类号： H01L21/301 , B32B3/10 , C09J7/02
CPC分类号： H01L21/67132 , B32B7/12 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , H01L24/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/3025 , Y10T428/24331 , Y10T428/24777 , Y10T428/24802 , H01L2924/00014 , H01L2924/00
摘要： The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region.
摘要翻译：本发明的目的在于提供一种用于保持芯片的带状物，其使得片状工件的粘贴和剥离变得容易。用于保持具有在基材上形成压敏粘合剂层的构造的芯片的胶带，其中粘合剂层具有将片状工件粘贴到其上的切屑状工件粘贴区域以及粘贴安装框架的框架粘贴区域，并且通过将安装框架粘贴到框架粘贴区域来使用，其中压敏粘合剂层的180度剥离粘合力到硅镜晶片框状粘贴区域是片状工件粘贴区域的粘合剂层向硅镜面晶片的180度剥离粘合力的5倍以上。

5. 发明授权

US09177425B2 Vehicle data analysis apparatus, vehicle data analysis method, and defect diagnosis apparatus 有权
标题翻译：车辆数据分析装置，车辆数据分析方法和缺陷诊断装置
公开(公告)号：US09177425B2
公开(公告)日：2015-11-03
申请号：US14005838
申请日：2012-03-19
申请人： Hideaki Suganuma , Takeshi Matsumura , Toshiro Hikita
发明人： Hideaki Suganuma , Takeshi Matsumura , Toshiro Hikita
IPC分类号： G07C5/00 , G06F15/00 , G05B23/02
CPC分类号： G07C5/00 , G05B23/0221 , G06F15/00
摘要： A vehicle data analysis apparatus analyzes vehicle data that indicates chronological change of a vehicle state. The vehicle data analysis apparatus is provided with a computing unit and a recognition unit. The computing unit is configured to make obvious data fluctuation accompanying the development, in the vehicle data, of mechanical or control-related fault in a vehicle control system. The recognition unit is configured to recognize the vehicle data to be considered during vehicle fault diagnosis on the basis of a result of computation by the computing unit.
摘要翻译：车辆数据分析装置分析指示车辆状态的时间变化的车辆数据。车辆数据分析装置具有计算单元和识别单元。计算单元被配置为伴随车辆控制系统中的机械或控制相关故障的车辆数据的开发中的明显的数据波动。识别单元被配置为基于计算单元的计算结果来识别在车辆故障诊断期间要考虑的车辆数据。

6. 发明授权

US09154487B2 Registration server, gateway apparatus and method for providing a secret value to devices 有权
标题翻译：注册服务器，网关设备和用于向设备提供秘密值的方法
公开(公告)号：US09154487B2
公开(公告)日：2015-10-06
申请号：US13883233
申请日：2010-11-05
申请人： Shingo Murakami , Johan Hjelm , Takeshi Matsumura , Toshikane Oda , Kenta Yasukawa
发明人： Shingo Murakami , Johan Hjelm , Takeshi Matsumura , Toshikane Oda , Kenta Yasukawa
IPC分类号： H04L29/06
CPC分类号： H04L63/08 , H04L63/0281 , H04L63/062 , H04L63/0807 , H04W12/04
摘要： The present invention relates to auto-provisioning of authentication data for client devices. A registration server includes a gateway determination unit, which is configured to determine a gateway apparatus transferring a request signal from a device, and a processing unit. The processing unit is configured to transmit a first signal including a token and first access information of the gateway apparatus to the device if an identifier of the gateway apparatus is stored on the server, and to transmit a second signal indicating a positive response to the gateway apparatus when it obtains the token and the identifier based on a third signal received in response to the first signal. The gateway apparatus sends the secret value to the device when it receives the second signal.
摘要翻译：本发明涉及自动提供客户端设备的认证数据。注册服务器包括网关确定单元，其被配置为确定从设备传送请求信号的网关装置和处理单元。处理单元被配置为如果网关装置的标识符存储在服务器上，则将包括令牌的第一信号和网关装置的第一访问信息发送到设备，并且向网关发送指示肯定响应的第二信号当其基于响应于第一信号接收的第三信号获得令牌和标识符时的装置。当接收到第二信号时，网关装置向设备发送秘密值。

7. 发明授权

US09153556B2 Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method 有权
标题翻译：用于制造半导体器件的粘合片，使用该片的半导体器件的制造方法以及通过该方法获得的半导体器件
公开(公告)号：US09153556B2
公开(公告)日：2015-10-06
申请号：US12759470
申请日：2010-04-13
申请人： Takeshi Matsumura , Sadahito Misumi , Kazuhito Hosokawa , Hiroyuki Kondo
发明人： Takeshi Matsumura , Sadahito Misumi , Kazuhito Hosokawa , Hiroyuki Kondo
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/00 , H01L23/00 , H01L23/31 , H01L25/065 , H01L25/00
CPC分类号： H01L24/83 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/98 , H01L25/0657 , H01L25/50 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29371 , H01L2224/29386 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/8388 , H01L2224/83885 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/3011 , H01L2924/0635 , H01L2924/066 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/0532 , H01L2924/04642 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less.
摘要翻译：用于制造半导体器件的粘合片是用于制造半导体器件的粘合片，当将半导体元件粘合到被粘物并且半导体元件被引线接合时使用，并且是可剥离的粘合片，其中180度剥离粘合强度相对于硅晶片为5（N / 25mm宽）或更小。

8. 发明授权

US08845538B2 Ultrasonic diagnostic apparatus 有权
标题翻译：超声波诊断仪
公开(公告)号：US08845538B2
公开(公告)日：2014-09-30
申请号：US12989546
申请日：2009-04-14
申请人： Takeshi Matsumura
发明人： Takeshi Matsumura
IPC分类号： A61B8/00 , A61B5/00 , A61B8/08 , A61B8/13 , A61B8/06
CPC分类号： A61B8/485 , A61B5/6843 , A61B8/06 , A61B8/13 , A61B8/4281 , A61B8/488
摘要： The invention was made to simplify the operation relating to the detection of an absolute pressure applied to a test body by an ultrasonic probe and thereby to enhance usability. The fact that an elastic coupler has been attached to the ultrasonic wave transmitter/receiver surface and the fact that the elastic coupler is in an initial state with no pressure are detected (S2, S3), an initial thickness of the elastic coupler in the initial state is obtained (S6), the fact that the elastic coupler is in the pressurized state is detected based on the disappearance of a multiple echo which is included in an RF signal and caused due to the elastic coupler, the thickness of the elastic coupler in the pressurized state is obtained by detecting the boundary between the test body and the elastic coupler in the pressurized state, the thickness change is obtained based on the thickness in the pressurized state and the initial thickness (S7), and the absolute pressure applied to the test object is evaluated based on the thickness change and the pre-set elasticity property of the elastic coupler (S8).
摘要翻译：本发明是为了简化与通过超声波探头对被检体施加的绝对压力的检测相关的操作，从而提高了可用性。检测到弹性耦合器已经附着到超声波发射器/接收器表面以及弹性耦合器处于初始状态而没有压力的事实（S2，S3），初始的弹性耦合器的初始厚度获得状态（S6），弹性耦合器处于加压状态的事实是基于包含在RF信号中并由弹性耦合器引起的多重回波的消失，弹性耦合器的厚度通过在加压状态下检测试验体与弹性联轴器之间的边界来获得加压状态，基于加压状态下的厚度和初始厚度（S7）获得厚度变化，并且施加到基于弹性联轴器的厚度变化和预设弹性特性来评价试验对象（S8）。

9. 发明授权

US08704382B2 Film for flip chip type semiconductor back surface 有权
标题翻译：倒装芯片型半导体背面薄膜
公开(公告)号：US08704382B2
公开(公告)日：2014-04-22
申请号：US12975893
申请日：2010-12-22
申请人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
发明人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L21/6836 , H01L21/561 , H01L23/3164 , H01L23/544 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/73204 , H01L2224/8101 , H01L2224/81193 , H01L2224/81203 , H01L2224/814 , H01L2224/831 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01079 , H01L2924/3025 , Y10T428/28 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm.
摘要翻译：本发明提供了一种用于倒装芯片型半导体背表面的薄膜，其将形成在连接在被粘物上的半导体元件倒装芯片的背面上，该薄膜包括晶片粘合层和激光标记层，其中晶片粘合层的波长为532nm的光的透光率为40％以上，激光标记层的波长为532nm的光的透光率为40％以下。

10. 发明授权

US08692389B2 Dicing tape-integrated film for semiconductor back surface 有权
标题翻译：用于半导体背面的切割胶带一体化膜
公开(公告)号：US08692389B2
公开(公告)日：2014-04-08
申请号：US12976112
申请日：2010-12-22
申请人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
发明人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/562 , H01L21/6836 , H01L21/78 , H01L23/3164 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/81 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16221 , H01L2224/274 , H01L2224/73204 , H01L2224/81007 , H01L2224/81097 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/831 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/3025 , Y10T428/1476 , Y10T428/28 , H01L2924/01082 , H01L2924/01047 , H01L2924/0103 , H01L2924/01083 , H01L2924/00014 , H01L2924/014 , H01L2924/3512 , H01L2924/00
摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.
摘要翻译：本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及设置在压敏粘合剂层上的倒装芯片型半导体背面的膜，其中压敏粘合剂层之间的剥离力（温度：23℃，剥离角度：180°，拉伸速度：300mm / min）切割带的粘合剂层和倒装芯片型半导体背面的膜的厚度为0.05N / 20mm至1.5N / 20mm。

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