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    • 4. 发明授权
    • Method for producing an amorphous silicon semiconductor device using a
multichamber PECVD apparatus
    • 使用多室PECVD装置制造非晶硅半导体器件的方法
    • US4800174A
    • 1989-01-24
    • US50699
    • 1987-05-18
    • Shinichiro IshiharaMasatoshi KitagawaTakashi Hirao
    • Shinichiro IshiharaMasatoshi KitagawaTakashi Hirao
    • H01L21/205C23C16/24C23C16/54H01L31/04
    • C23C16/54C23C16/24Y10S148/025Y10S148/045Y10S148/072Y10S438/908
    • A method of producing an amorphous silicon semiconductor device makes use of a capacitance-coupled high-frequency glow-discharge semiconductor production apparatus which is equipped with a plurality of glow-discharge chambers each having a high-frequency electrode and a substrate holder opposing each other and means for supplying material gases to the glow-discharge chambers. A reaction of a material gas is effected in a first glow-discharge chamber, so as to form a semiconductor layer having a first conductivity type on a substrate introduced into the first glow-discharge chamber, and, after moving the substrate into a second glow-discharge chamber, a reaction of a material gas different from the material gas used in the first glow-discharge chamber is effected, thereby forming a semiconductor layer having a second conductivity type on the semiconductor layer of the first conductivity type. The substrate with the semiconductor layer of the first conductivity formed thereon is moved from the first glow-discharge chamber to the second glow-discharge chamber after a predetermined gas atmosphere is formed in the first glow-discharge chamber. The distance between the electrode and the substrate holder is made smaller in one of the first and second glow-discharge chambers which is designed for forming the thicker one of the semiconductor layers of the first and second conductivity types than in the other of the first and second glow-discharge chambers. The temperature of the substrate is set higher in one of the first and second glow-discharge chambers which is designed for forming the thicker one of the semiconductor layers of the first and second conductivity types than in the other of the first and second glow-discharge chambers.
    • 一种非晶硅半导体器件的制造方法采用电容耦合高频辉光放电半导体制造装置,该装置配备有多个辉光放电室,每个辉光放电室具有彼此相对的高频电极和衬底保持器 以及用于将材料气体供应到辉光放电室的装置。 在第一辉光放电室中进行材料气体的反应,以便在引入第一辉光放电室的衬底上形成具有第一导电类型的半导体层,并且在将衬底移动到第二发光 进行与第一辉光放电室中使用的材料气体不同的原料气体的反应,由此在第一导电型半导体层上形成具有第二导电类型的半导体层。 在第一辉光放电室中形成规定的气体气氛之后,将形成有第一导电性的半导体层的基板从第一辉光放电室向第二辉光放电室移动。 在第一和第二辉光放电室之一中,电极和衬底保持器之间的距离较小,被设计用于形成第一和第二导电类型的较厚的一个半导体层,而不是第一和第二导电类型中的另一个, 第二个辉光放电室。 第一和第二辉光放电室之一的衬底的温度被设定为高于在第一和第二辉光放电中的另一个中形成第一和第二导电类型的较厚的一个半导体层的第一和第二辉光放电室 房间。
    • 6. 发明授权
    • High-frequency power amplifier and communication device
    • 高频功率放大器和通讯装置
    • US07872532B2
    • 2011-01-18
    • US12420955
    • 2009-04-09
    • Shinichiro IshiharaMotoyoshi IwataShingo Enomoto
    • Shinichiro IshiharaMotoyoshi IwataShingo Enomoto
    • H03F3/04
    • H03F1/302
    • It is an object of the present invention to provide a high-frequency power amplifier capable of improving the linearity at the time of high output by preventing decrease in power of bias supply transistor. The high-frequency power amplifier is a high-frequency power amplifier including high-frequency power amplifier transistors and connected in multiple stages and bias supply transistors and each of which supplies bias current to a base of a corresponding one of said high-frequency power amplifier transistors, and each of which is connected to a common power supply terminal which is further connected to a collector of the high-frequency power amplifier transistor at a first stage among said high-frequency power amplifier transistors, and a passive element connected between the common supply terminal and a collector of the corresponding one of said bias supply transistors connected to the high-frequency power amplifier transistor at the first stage.
    • 本发明的目的是提供一种能够通过防止偏置电源晶体管的功率降低来提高高输出时的线性度的高频功率放大器。 高频功率放大器是一种高频功率放大器,包括高频功率放大器晶体管,并连接多级和偏置电源晶体管,并且每个都向所述高频功率放大器的相应一个的基极提供偏置电流 晶体管,并且其中的每一个连接到公共电源端子,该公共电源端子在所述高频功率放大器晶体管中的第一级进一步连接到高频功率放大器晶体管的集电极,以及连接在所述高频功率放大器晶体管之间的无源元件 电源端子和在第一级连接到高频功率放大器晶体管的相应一个所述偏置电源晶体管的集电极。