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    • 3. 发明授权
    • Optical connection method and optical transmission apparatus
    • 光连接方法和光传输装置
    • US07429138B2
    • 2008-09-30
    • US11660648
    • 2005-08-19
    • Yoshisada NakamuraHiroki TakahashiTakanori SatoKenji MatsumotoHiroyuki Hiiro
    • Yoshisada NakamuraHiroki TakahashiTakanori SatoKenji MatsumotoHiroyuki Hiiro
    • G02B6/36
    • G02B6/02038G02B6/03633G02B6/3878
    • A plastic optical fiber (11) has a core (12) and a clad (13). The clad (13) is composed of an outer clad (14) and an inner clad (15). The refractive index in the core (12) gradually increases as the distance from the center thereof decreases. The refractive index in the inner clad (15) is equal to the minimum value of the refractive index in the core (12), and the refractive index in the outer clad (14) is smaller than that in the inner clad (15). For the purpose of decreasing the transmission loss between the plastic optical fiber (11) and a light emission device or the light receiving device, the diameter d1 of the core (12) and the outer diameter d2 of the inner clad (15) satisfy the following conditions; 100(μm)≦d1≦700(μm) 200(μm)≦d1≦1000(μm) d1
    • 塑料光纤(11)具有芯(12)和包层(13)。 包层(13)由外包层(14)和内包层(15)组成。 芯部(12)的折射率随着距离其中心的距离减小而逐渐增加。 内包层(15)中的折射率等于芯(12)中的折射率的最小值,并且外包层(14)中的折射率小于内包层(15)中的折射率。 为了降低塑料光纤(11)与发光装置或光接收装置之间的传输损耗,芯(12)的直径d 1和内包层(15)的外径d 2, 满足以下条件; <?in-line-formula description =“In-line formula”end =“lead”?> 100(mum)<= d 1 <= 700(mum)<?in-line-formula description = “end =”tail“?> <?in-line-formula description =”In-line formula“end =”lead“?> 200(mum)<= d 1 <= 1000(mum)<?in-line- 公式描述=“内联公式”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead”?> d 1
    • 4. 发明申请
    • Optical Connection Method And Optical Transmission Apparatus
    • 光学连接方法和光传输设备
    • US20070286560A1
    • 2007-12-13
    • US11660648
    • 2005-08-19
    • Yoshisada NakamuraHiroki TakahashiTakanori SatoKenji MatsumotoHiroyuki Hiiro
    • Yoshisada NakamuraHiroki TakahashiTakanori SatoKenji MatsumotoHiroyuki Hiiro
    • G02B6/028
    • G02B6/02038G02B6/03633G02B6/3878
    • A plastic optical fiber (11) has a core (12) and a clad (13). The clad (13) is composed of an outer clad (14) and an inner clad (15). The refractive index in the core (12) gradually increases as the distance from the center thereof decreases. The refractive index in the inner clad (15) is equal to the minimum value of the refractive index in the core (12), and the refractive index in the outer clad (14) is smaller than that in the inner clad (15). For the purpose of decreasing the transmission loss between the plastic optical fiber (11) and a light emission device or the light receiving device, the diameter d1 of the core (12) and the outer diameter d2 of the inner clad (15) satisfy the following conditions; 100(μm)≦d1≦700(μm) 200(μm)≦d1≦1000(μm) d1
    • 塑料光纤(11)具有芯(12)和包层(13)。 包层(13)由外包层(14)和内包层(15)组成。 芯部(12)的折射率随着距离其中心的距离减小而逐渐增加。 内包层(15)中的折射率等于芯(12)中的折射率的最小值,并且外包层(14)中的折射率小于内包层(15)中的折射率。 为了降低塑料光纤(11)与发光装置或光接收装置之间的传输损耗,芯(12)的直径d 1和内包层(15)的外径d 2, 满足以下条件; <?in-line-formula description =“In-line formula”end =“lead”?> 100(mum)<= d1 <= 700(mum)<?in-line-formula description =“In-line Formulas end =“tail”?> <?in-line-formula description =“In-line formula”end =“lead”?> 200(mum)<= d1 <= 1000(mum)<? =“内联公式”end =“tail”?> <?in-line-formula description =“In-line formula”end =“lead”?> d1
    • 6. 发明授权
    • Metalannular gasket
    • 金属衬垫
    • US08955851B2
    • 2015-02-17
    • US12312668
    • 2007-11-05
    • Kenji MatsumotoKazuhiro Takahashi
    • Kenji MatsumotoKazuhiro Takahashi
    • F16J15/10F16B43/00F16B41/00
    • F16B43/001F16B41/002F16J15/104Y10S277/937
    • A metal annular gasket comprising an annular metal base plate; a compound layer integrally laminated on both surfaces of the annular metal base plate, the compound layer being made of synthetic resin or a rubber material mixed with a fiber material; and an annular seal layer having a circumferential covering portion which covers the inner circumferential edge of the annular metal plate and the inner circumferential edge of both compound layers, the compound layer being made of synthetic resin or a rubber material. The annular seal layer is formed such that the surface of the annular seal layer is so connected to the surfaces of the compound layer as to provide smooth transition in its thickness direction.
    • 一种金属环形垫片,包括环形金属基板; 在环状金属基板的两面一体层叠的复合层,由合成树脂制成的复合层或与纤维材料混合的橡胶材料; 以及环状密封层,其具有覆盖环状金属板的内周缘和两个复合层的内周边缘的周向覆盖部分,复合层由合成树脂或橡胶材料制成。 环形密封层形成为使得环形密封层的表面与化合物层的表面连接,以在其厚度方向上提供平滑的过渡。
    • 10. 发明授权
    • Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and storage medium
    • 制造半导体器件,半导体制造装置和存储介质的方法
    • US08349725B2
    • 2013-01-08
    • US12920701
    • 2009-02-20
    • Hiroshi SatoHitoshi ItohKenji Matsumoto
    • Hiroshi SatoHitoshi ItohKenji Matsumoto
    • H01L21/4763
    • H01L21/67207H01L21/02063H01L21/02068H01L21/67253H01L21/67742H01L21/76814H01L21/76831H01L21/76834H01L21/76843H01L21/76858H01L21/76861H01L21/76865H01L21/76873H01L21/76877H01L23/53238H01L23/53295H01L2924/0002H01L2924/12044H01L2924/00
    • The present invention is a method of manufacturing a semiconductor device comprising: forming a recess in an interlayer insulating film formed on a substrate surface, the recess being configured to be embedded with an upper conductive channel mainly made of copper to be electrically connected to a lower conductive channel; supplying a gas containing an organic compound of manganese, and forming a barrier layer made of a compound of manganese for preventing diffusion of copper to the interlayer insulating film, such that the barrier layer covers an exposed surface of the interlayer insulating film; after the formation of the barrier layer, supplying organic acid to the barrier layer in order to increase a ratio of manganese in the compound of manganese forming the barrier layer; after the supply of the organic acid, forming a seed layer mainly made of copper on a surface of the barrier layer; after the formation of the seed-layer, heating the substrate in order to separate out manganese from on the surface of the barrier layer or from in the barrier layer onto a surface of the seed layer; supplying a cleaning liquid to the seed layer in order to remove the manganese separated out on the surface of the seed layer by the heating; and after the supply of the cleaning liquid, forming the upper conductive channel mainly made of copper in the recess.
    • 本发明是一种制造半导体器件的方法,包括:在形成在衬底表面上的层间绝缘膜中形成凹部,所述凹部被构造成嵌入有主要由铜制成的上部导电沟道,以与下部电连接 导电通道; 提供含锰有机化合物的气体,形成由锰化合物制成的阻挡层,以防止铜向层间绝缘膜扩散,使得阻挡层覆盖层间绝缘膜的暴露表面; 在形成阻挡层之后,向阻挡层供给有机酸,以增加形成阻挡层的锰化合物中的锰的比例; 在供给有机酸之后,在阻挡层的表面上形成主要由铜制成的种子层; 在形成种子层之后,加热衬底以将锰从阻挡层的表面或阻挡层中分离出到种子层的表面上; 向种子层供应清洗液,以便通过加热去除种子层表面上分离的锰; 并且在供应清洁液之后,在凹槽中形成主要由铜制成的上导电通道。