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    • 1. 发明授权
    • Photo-curable resin composition and process for preparing resin-basedmold
    • 光固化树脂组合物和树脂基模制品的制备方法
    • US5932625A
    • 1999-08-03
    • US865676
    • 1997-05-30
    • Tsuyoshi WatanabeAyao MatsumuraYuichi HarutaTakashi Ukachi
    • Tsuyoshi WatanabeAyao MatsumuraYuichi HarutaTakashi Ukachi
    • C08F2/44C08F2/46C08F2/48C08F222/10C08F226/06B27N3/08
    • C08F226/06C08F2/44C08F2/48C08F222/1006
    • A photo-curable resin composition suitable as a material for photo-fabricating and capable of producing cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The resin composition contains a monomer component containing (A) 30-70 wt % of a polyfunctional unsaturated monomer having a cyclic structure and (B) 70-30 wt % of a monofunctional unsaturated monomer having a cyclic structure of which the homopolymer has a glass transition temperature (Tg) of 70.degree. C. or higher; (C) a photo-initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler to 100 parts by volume of the monomer components and the photo-initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 100.degree. C. or higher.
    • 适合作为光致制造材料的光固化性树脂组合物,能够制造具有优异的机械强度和高耐热性的固化物。 进一步公开了一种树脂基模具的成型方法,其提供优异的成型尺寸精度和极好的重复耐久性。 树脂组合物含有含有(A)30-70重量%的具有环状结构的多官能不饱和单体的单体成分,(B)70-30重量%具有均聚物具有玻璃的环状结构的单官能不饱和单体 转变温度(Tg)为70℃以上; (C)光引发剂; 和(D)平均粒径或平均纤维长度为1-50μm的无机填料,其中无机填料与100体积份单体组分和光引发剂的比例为100-160份 ,由光固化性树脂组合物制造的固化树脂的热变形温度为100℃以上。
    • 2. 发明授权
    • Photo-curable resin composition and process for preparing resin-based
mold
    • 光固化树脂组合物和树脂基模具的制备方法
    • US5874041A
    • 1999-02-23
    • US865781
    • 1997-05-30
    • Ayao MatsumuraYuichi HarutaTsuyoshi WatanabeTakashi Ukachi
    • Ayao MatsumuraYuichi HarutaTsuyoshi WatanabeTakashi Ukachi
    • G03F7/004B29C33/40B29K33/04C08F2/44C08F2/48C08F20/34C08F20/36C08F220/10C08F222/10C09D4/00C09D4/02G03F7/027B29C35/08B29C41/02
    • C08F222/1006
    • A photo-curable resin composition suitable as a material for optical molding. The composition can produce cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The composition contains a monomer component which contains (A) 20-80 wt % of a urethane-bond polyfunctional (meth)acrylate having a number average molecular weight of 1,000 or less and (B) 80-20 wt % of an ethylenically unsaturated monomer containing a cyclic structure and at least one ethylenically unsaturated bond in the molecule and of which the homopolymer has a glass transition temperature of 50.degree. C. or higher; (C) a photopolymerization initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler for 100 parts by volume of said monomer components and the photopolymerization initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 80.degree. C. or higher.
    • 适合作为光学成型用材料的光固化性树脂组合物。 该组合物可以产生具有优异的机械强度和高耐热性的固化产物。 进一步公开了一种树脂基模具的成型方法,其提供优异的成型尺寸精度和极好的重复耐久性。 该组合物含有(A)20〜80重量%的数均分子量为1000以下的氨基甲酸酯键多官能(甲基)丙烯酸酯,(B)80〜20重量%的烯属不饱和单体 在分子中含有环状结构和至少一个烯属不饱和键,其均聚物的玻璃化转变温度为50℃以上; (C)光聚合引发剂; 和(D)平均粒径或平均纤维长度为1-50μm的无机填料,其中100体积份的所述单体成分和光聚合引发剂的无机填料的比例为100〜160份 由光固化型树脂组合物制造的固化树脂的体积,热变形温度为80℃以上。
    • 9. 发明授权
    • Reversible thermosensitive recording medium, and image forming and erasing method
    • 可逆热敏记录介质,以及成像和擦除方法
    • US06177383B1
    • 2001-01-23
    • US09274799
    • 1999-03-23
    • Tetsuya AmanoKazumi SuzukiAtsushi KutamiYoshihiko HottaTsuyoshi WatanabeRyouji FurutaTakashi Ukachi
    • Tetsuya AmanoKazumi SuzukiAtsushi KutamiYoshihiko HottaTsuyoshi WatanabeRyouji FurutaTakashi Ukachi
    • B41M540
    • B41M5/42B41M5/363B41M5/41
    • A reversible thermosensitive recording medium is provided, comprising a supporting substrate, a reversible thermosensitive recording layer and an overcoat layer, formed in the order recited, in which the recording layer changes transparency or color tone reversibly with temperature. The overcoat layer is formed to have a peak temperature of at most 155° C. in a tan &dgr; vs. temperature curve, wherein tan &dgr; is defined by G′/G″, with dynamic modulus of elasticity represented by G′ and dynamic elastic loss represented by G″. This thermosensitive recording medium is capable of satisfactorily carrying out the formation and erasure of images with a heating device, such as a thermal printhead, and overcoming difficulties such as the occurrence of cracks and portions of the overcoat layer being removed therefrom and then sticking to heating elements of the thermal printhead, which are caused especially by the application of heating pulses for shorter periods of time and/or at increased pressures during repeated image formation and erasure processing.
    • 提供了一种可逆热敏记录介质,其包括支撑衬底,可逆热敏记录层和外涂层,其按照所述顺序形成,其中记录层随着温度可逆地改变透明度或色调。 形成外涂层在tanδ对温度曲线中具有至多155℃的峰值温度,其中tanδ由G'/ G“定义,具有由G'表示的动态弹性模量和动态 由G“表示的弹性损失。 这种热敏记录介质能够令人满意地执行图像的形成和擦除,其中加热装置例如热打印头,并且克服诸如发生裂纹和外涂层的部分被从其中除去的困难,然后粘附到加热 特别是通过在重复图像形成和擦除处理期间施加加热脉冲较短时间和/或在增加的压力下引起热敏打印头的元件。