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1. 发明申请

US20050250273A1 Display device and manufacturing method of the same 有权
公开(公告)号：US20050250273A1
公开(公告)日：2005-11-10
申请号：US11180658
申请日：2005-07-14
申请人： Yuichi Harano , Jun Gotoh , Toshiki Kaneko , Masanao Yamamoto
发明人： Yuichi Harano , Jun Gotoh , Toshiki Kaneko , Masanao Yamamoto
IPC分类号： G02F1/1368 , G09F9/30 , H01L21/28 , H01L21/285 , H01L21/3205 , H01L21/336 , H01L21/768 , H01L21/77 , H01L23/52 , H01L29/417 , H01L29/45 , H01L29/786
CPC分类号： H01L21/28568 , G03G15/0131 , G03G15/1685 , G03G2215/0141 , H01L21/76843 , H01L21/76849 , H01L21/76856 , H01L27/124 , H01L29/458 , H01L29/66757 , H01L29/78603
摘要： The present invention prevents the diffusion of an aluminum element into a polysilicon layer in a heating step when an aluminum-based conductive layer is used in a source/drain electrode which is in contact with low-temperature polysilicon whereby the occurrence of defective display can be obviated. An aluminum-based conductive layer is used in a source/drain electrode and a barrier layer made of molybdenum or a molybdenum alloy layer is formed between the aluminum-based conductive layer and a polysilicon layer. Further, a molybdenum oxide nitride film formed by the rapid heat treatment (rapid heat annealing) in a nitrogen atmosphere is formed over a surface of the molybdenum or the molybdenum alloy which constitutes the barrier layer.

2. 发明授权

US06933525B2 Display device and manufacturing method of the same 有权
标题翻译：显示装置及其制造方法相同
公开(公告)号：US06933525B2
公开(公告)日：2005-08-23
申请号：US10742896
申请日：2003-12-23
申请人： Yuichi Harano , Jun Gotoh , Toshiki Kaneko , Masanao Yamamoto
发明人： Yuichi Harano , Jun Gotoh , Toshiki Kaneko , Masanao Yamamoto
IPC分类号： G02F1/1368 , G09F9/30 , H01L21/28 , H01L21/285 , H01L21/3205 , H01L21/336 , H01L21/768 , H01L21/77 , H01L23/52 , H01L29/417 , H01L29/45 , H01L29/786 , H01L27/01
CPC分类号： H01L21/28568 , G03G15/0131 , G03G15/1685 , G03G2215/0141 , H01L21/76843 , H01L21/76849 , H01L21/76856 , H01L27/124 , H01L29/458 , H01L29/66757 , H01L29/78603
摘要： The present invention prevents the diffusion of an aluminum element into a polysilicon layer in a heating step when an aluminum-based conductive layer is used in a source/drain electrode which is in contact with low-temperature polysilicon whereby the occurrence of defective display can be obviated. An aluminum-based conductive layer is used in a source/drain electrode and a barrier layer made of molybdenum or a molybdenum alloy layer is formed between the aluminum-based conductive layer and a polysilicon layer. Further, a molybdenum oxide nitride film formed by the rapid heat treatment (rapid heat annealing) in a nitrogen atmosphere is formed over a surface of the molybdenum or the molybdenum alloy which constitutes the barrier layer.
摘要翻译：本发明防止了在与低温多晶硅接触的源/漏电极中使用铝基导电层时，在加热步骤中铝元素扩散到多晶硅层中，从而可以发生不良显示消除了在源/漏电极中使用铝基导电层，并且在铝基导电层和多晶硅层之间形成由钼制成的阻挡层或钼合金层。此外，在构成阻挡层的钼或钼合金的表面上形成在氮气氛中通过快速热处理（快速热退火）形成的氧化钼氮化物膜。

3. 发明申请

US20050249525A1 Display device and manufacturing metho of the same 有权
标题翻译：显示设备和制造方法相同
公开(公告)号：US20050249525A1
公开(公告)日：2005-11-10
申请号：US11180358
申请日：2005-07-13
申请人： Yuichi Harano , Jun Gotoh , Toshiki Kaneko , Masanao Yamamoto
发明人： Yuichi Harano , Jun Gotoh , Toshiki Kaneko , Masanao Yamamoto
IPC分类号： G02F1/1368 , G09F9/30 , H01L21/28 , H01L21/285 , H01L21/3205 , H01L21/336 , H01L21/768 , H01L21/77 , H01L23/52 , H01L29/417 , H01L29/45 , H01L29/786 , G03G15/01
CPC分类号： H01L21/28568 , G03G15/0131 , G03G15/1685 , G03G2215/0141 , H01L21/76843 , H01L21/76849 , H01L21/76856 , H01L27/124 , H01L29/458 , H01L29/66757 , H01L29/78603
摘要： An endless belt transports a recording medium through image forming sections and transfers toner images from corresponding ones of the image forming sections onto the recording medium. The endless belt has a surface resistivity and a volume resistivity. The surface resistivity and the volume resistivity are related such that 0.3 ≦(log ρ s−log ρ v)≦1.3 where ρ s is the surface resistivity in Ω/□ measured after a voltage of substantially 500 V is applied to the endless belt for ten seconds and ρ v is the volume resistivity in Ω·cm ten after a voltage of substantially 250 V is applied to the endless belt for ten seconds.
摘要翻译：环形带通过图像形成部分传送记录介质，并将调色剂图像从对应的图像形成部分转印到记录介质上。环形带具有表面电阻率和体积电阻率。表面电阻率和体积电阻率相关，使得0.3 <=（log rho s-log rho v）<= 1.3其中rho是在基本上500V的电压之后测量的以Ω/□表示的表面电阻率施加到环形皮带10秒钟，rho v是在大约250V的电压施加到环形带上十秒钟之后的体积电阻率（Ω·cm·cm）。

4. 发明授权

US07479451B2 Display device manufacturing method preventing diffusion of an aluminum element into a polysilicon layer in a heating step 有权
标题翻译：在加热步骤中防止铝元素扩散到多晶硅层中的显示器件制造方法
公开(公告)号：US07479451B2
公开(公告)日：2009-01-20
申请号：US11180658
申请日：2005-07-14
申请人： Yuichi Harano , Jun Gotoh , Toshiki Kaneko , Masanao Yamamoto
发明人： Yuichi Harano , Jun Gotoh , Toshiki Kaneko , Masanao Yamamoto
IPC分类号： H01L21/44
CPC分类号： H01L21/28568 , G03G15/0131 , G03G15/1685 , G03G2215/0141 , H01L21/76843 , H01L21/76849 , H01L21/76856 , H01L27/124 , H01L29/458 , H01L29/66757 , H01L29/78603
摘要： The present invention prevents the diffusion of an aluminum element into a polysilicon layer in a heating step when an aluminum-based conductive layer is used in a source/drain electrode which is in contact with low-temperature polysilicon whereby the occurrence of defective display can be obviated. An aluminum-based conductive layer is used in a source/drain electrode and a barrier layer made of molybdenum or a molybdenum alloy layer is formed between the aluminum-based conductive layer and a polysilicon layer. Further, a molybdenum oxide nitride film formed by the rapid heat treatment (rapid heat annealing) in a nitrogen atmosphere is formed over a surface of the molybdenum or the molybdenum alloy which constitutes the barrier layer.
摘要翻译：本发明防止了在与低温多晶硅接触的源/漏电极中使用铝基导电层时，在加热步骤中铝元素扩散到多晶硅层中，从而可以发生不良显示消除了在源/漏电极中使用铝基导电层，并且在铝基导电层和多晶硅层之间形成由钼制成的阻挡层或钼合金层。此外，在构成阻挡层的钼或钼合金的表面上形成在氮气氛中通过快速热处理（快速热退火）形成的氧化钼氮化物膜。

5. 发明授权

US06433842B1 Liquid crystal display device and method of manufacturing the same 有权
标题翻译：液晶显示装置及其制造方法
公开(公告)号：US06433842B1
公开(公告)日：2002-08-13
申请号：US09537395
申请日：2000-03-29
申请人： Toshiki Kaneko , Masaru Takabatake , Takahiro Ochiai , Takuya Takahashi , Katsumi Tamura , Kenichi Onisawa , Kenichi Cyahara , Masatomo Terakado , Yuichi Harano , Hideaki Yamamoto
发明人： Toshiki Kaneko , Masaru Takabatake , Takahiro Ochiai , Takuya Takahashi , Katsumi Tamura , Kenichi Onisawa , Kenichi Cyahara , Masatomo Terakado , Yuichi Harano , Hideaki Yamamoto
IPC分类号： G02F1136
CPC分类号： G02F1/136286 , G02F2001/13629
摘要： The method of fabrication of a liquid crystal display device includes the steps of: forming a metal thin film on a glass substrate; forming a resist pattern on the metal thin film by photolithography; and wet-etching the metal thin film with an etchant formed of a mixture including phosphoric acid, nitric acid in a range between 7 mol % and 12 mol % inclusive, and at least one of ammonium fluoride and hydrogen fluoride in a trace amount of about 0.01 to 0.1 mol %.
摘要翻译：制造液晶显示装置的方法包括以下步骤：在玻璃基板上形成金属薄膜; 通过光刻在金属薄膜上形成抗蚀剂图案; 并用由包括磷酸，硝酸在7摩尔％至12摩尔％之间的混合物的混合物形成的蚀刻剂湿蚀刻金属薄膜，以及微量约为的氟化铵和氟化氢中的至少一种 0.01〜0.1摩尔％。

6. 发明授权

US08338272B2 Method for manufacturing a semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US08338272B2
公开(公告)日：2012-12-25
申请号：US12480077
申请日：2009-06-08
申请人： Yuichi Harano , Hidenori Suzuki
发明人： Yuichi Harano , Hidenori Suzuki
IPC分类号： H01L21/326
CPC分类号： H01L21/6831
摘要： A wafer is mounted on the top surface of the stage having an electrostatic chuck function, and the wafer at 50° C. or more is cooled to a temperature lower than 50° C. In this step, the voltage to be applied to the internal electrode provided in the stage is raised stepwise to gradually increase the contact area between the back surface of the wafer and the top surface of the stage. Finally, a chuck voltage is applied to the internal electrode, so that the entire back surface of the wafer is uniformly attracted to the top surface of the stage. This reduces damage occurring in the top surface of the stage due to rubbing between the back surface of the wafer and the top surface of the stage.
摘要翻译：将晶片安装在具有静电卡盘功能的平台的顶表面上，并且将在50℃或更高的晶片冷却至低于50℃的温度。在该步骤中，施加到内部的电压设置在台架中的电极逐步升高以逐渐增加晶片的背表面和台的顶表面之间的接触面积。最后，向内部电极施加卡盘电压，使得晶片的整个背面被均匀地吸引到台的顶面。这减少了由于在晶片的后表面和台的顶表面之间的摩擦而在台的顶表面中发生的损坏。

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