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1. 发明授权

US06908374B2 Chemical mechanical polishing endpoint detection 失效
标题翻译：化学机械抛光终点检测
公开(公告)号：US06908374B2
公开(公告)日：2005-06-21
申请号：US10052475
申请日：2002-01-17
申请人： Yuchun Wang , Bernard M. Frey , Bulent M. Basol , Douglas W. Young , Homayoun Talieh , Efrain Velazquez
发明人： Yuchun Wang , Bernard M. Frey , Bulent M. Basol , Douglas W. Young , Homayoun Talieh , Efrain Velazquez
IPC分类号： B24B21/04 , B24B21/08 , B24B37/04 , B24B47/04 , B24B49/16 , B24B49/12
CPC分类号： B24B37/205 , B24B21/04 , B24B21/08 , B24B37/013 , B24B37/04 , B24B47/04 , B24B49/16
摘要： The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical processing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.
摘要翻译：所描述的方法和系统提供用于材料去除过程（例如在工件上执行的化学机械处理（CMP））的原位端点检测。在优选实施例中，使用光学检测系统来检测使用CMP去除平面导电层期间的端点。光学透明的抛光带通过抛光带上的任何点提供端点检测。一旦检测到端点，就可以使用信号来终止或改变先前已经启动的CMP过程。

2. 发明授权

US06857947B2 Advanced chemical mechanical polishing system with smart endpoint detection 失效
标题翻译：先进的化学机械抛光系统，智能端点检测
公开(公告)号：US06857947B2
公开(公告)日：2005-02-22
申请号：US10346425
申请日：2003-01-17
申请人： Yuchun Wang , Bernard M. Frey , Bulent M. Basol , Homayoun Talieh , Douglas W. Young , Brett E. McGrath , Mukesh Desai , Efrain Velazquez , Tuan Truong
发明人： Yuchun Wang , Bernard M. Frey , Bulent M. Basol , Homayoun Talieh , Douglas W. Young , Brett E. McGrath , Mukesh Desai , Efrain Velazquez , Tuan Truong
IPC分类号： B24B21/04 , B24B21/08 , B24B37/013 , B24B37/20 , B24B49/10 , B24B49/16 , B24B21/00
CPC分类号： B24B37/013 , B24B21/04 , B24B21/08 , B24B37/205 , B24B49/10 , B24B49/16
摘要： An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.
摘要翻译：一种用于抛光工件的装置包括：被配置为保持工件的工件保持器;抛光构件，其构造成邻近工件的表面定位，以便抛光工件面与抛光构件的前侧;以及压板，多个压力区被配置为选择性地向抛光构件施加压力，从而使抛光构件与选择压力接触工件面。在另一个实施例中，该装置包括耦合到压板并配置成选择性地调节压力区的压力控制器。

3. 发明授权

US07059944B2 Integrated system for processing semiconductor wafers 有权
公开(公告)号：US07059944B2
公开(公告)日：2006-06-13
申请号：US10369118
申请日：2003-02-18
申请人： Jalal Ashjaee , Boris Govzman , Bernard M. Frey , Boguslaw A. Nagorski , Douglas W. Young , Bulent M. Basol , Homayoun Talieh
发明人： Jalal Ashjaee , Boris Govzman , Bernard M. Frey , Boguslaw A. Nagorski , Douglas W. Young , Bulent M. Basol , Homayoun Talieh
IPC分类号： B24B1/00
CPC分类号： H01L21/67745 , B24B37/345 , G05B19/41865 , G05B2219/32272 , G05B2219/45031 , H01L21/67028 , H01L21/67034 , H01L21/67046 , H01L21/67051 , H01L21/67173 , H01L21/67219 , H01L21/68707 , H01L21/68728 , Y02P90/20
摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

4. 发明申请

US20090148598A1 Methods and Apparatus to Provide Group VIA Materials to Reactors for Group IBIIIAVIA Film Formation 失效
标题翻译：为集团IBIIIAVIA成膜的反应堆提供集团VIA材料的方法和设备
公开(公告)号：US20090148598A1
公开(公告)日：2009-06-11
申请号：US12137510
申请日：2008-06-11
申请人： Howard G. Zolla , Douglas W. Young , Bulent M. Basol
发明人： Howard G. Zolla , Douglas W. Young , Bulent M. Basol
IPC分类号： C23C16/06
CPC分类号： C23C14/246 , C23C14/0623 , C23C14/562 , H01L31/0322 , H01L31/1864 , H01L31/1876 , Y02E10/541 , Y02P70/521
摘要： Processes and apparatus are described that form a solar cell absorber on a surface of a workpiece by reacting a precursor layer disposed on the surface of the workpiece with an absorber constituent vapor in a heating chamber. The absorber constituent material is delivered from an absorber constituent material delivery system in molten form into a container in the heating chamber and vaporized to be used during the reaction.
摘要翻译：描述了通过使设置在工件表面上的前体层与加热室中的吸收体构成蒸气反应而在工件表面上形成太阳能电池吸收体的方法和装置。吸收剂构成材料从熔融形式的吸收剂构成材料输送系统输送到加热室中的容器中并蒸发以在反应期间使用。

5. 发明授权

US08323408B2 Methods and apparatus to provide group VIA materials to reactors for group IBIIIAVIA film formation 失效
标题翻译：将组VIA材料提供给组IBIIIAVIA膜形成的反应器的方法和装置
公开(公告)号：US08323408B2
公开(公告)日：2012-12-04
申请号：US12137510
申请日：2008-06-11
申请人： Howard G. Zolla , Douglas W. Young , Bulent M. Basol
发明人： Howard G. Zolla , Douglas W. Young , Bulent M. Basol
IPC分类号： C23C16/00
CPC分类号： C23C14/246 , C23C14/0623 , C23C14/562 , H01L31/0322 , H01L31/1864 , H01L31/1876 , Y02E10/541 , Y02P70/521
摘要： Processes and apparatus are described that form a solar cell absorber on a surface of a workpiece by reacting a precursor layer disposed on the surface of the workpiece with an absorber constituent vapor in a heating chamber. The absorber constituent material is delivered from an absorber constituent material delivery system in molten form into a container in the heating chamber and vaporized to be used during the reaction.
摘要翻译：描述了通过使设置在工件表面上的前体层与加热室中的吸收体构成蒸气反应而在工件表面上形成太阳能电池吸收体的方法和装置。吸收剂构成材料从熔融形式的吸收剂构成材料输送系统输送到加热室中的容器中并蒸发以在反应期间使用。

6. 发明授权

US07572354B2 Electrochemical processing of conductive surface 有权
标题翻译：导电表面的电化学处理
公开(公告)号：US07572354B2
公开(公告)日：2009-08-11
申请号：US11445594
申请日：2006-06-01
申请人： Cyprian Emeka Uzoh , Homayoun Talieh , Bulent Basol , Douglas W. Young
发明人： Cyprian Emeka Uzoh , Homayoun Talieh , Bulent Basol , Douglas W. Young
IPC分类号： C25B9/00 , C25D7/00
CPC分类号： B24B37/20 , B24B37/046 , B24B37/24 , B24B37/26 , C25D5/06 , C25D17/001 , C25D17/14 , C25F7/00 , H01L21/2885 , H01L21/76877
摘要： The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece. Upon application of power to the anode plate and the cathode workpiece, the electrolyte solution disposed in the plating apparatus is used to deposit the conductive material on the workpiece surface using cylindrical rollers having the pad or blade type objects.
摘要翻译：本发明涉及通过旋转靠近基板的垫片或刀片型物体来在半导体衬底上镀覆导电材料的方法和装置，从而消除/减少凹陷和空隙。这通过提供安装在圆柱形阳极或辊子上的垫片或刀片型物体，并使用设置在垫片上或穿过垫片上的电解质溶液将导电材料施加到衬底来实现。在本发明的一个实施例中，衬垫或刀片型物体安装在圆柱形阳极上并围绕第一轴线旋转，同时工件可以是静止的或围绕第二轴线旋转，并且来自电解质溶液的金属沉积在工件上，在工件和阳极之间施加电位差。在本发明的另一实施例中，电镀装置包括与阴极工件间隔开的阳极板。在向阳极板和阴极工件施加电力时，使用设置在电镀装置中的电解液将导电材料沉积在工件表面上，使用具有焊盘或刀片型物体的圆柱形辊。

7. 发明授权

US06969456B2 Method of using vertically configured chamber used for multiple processes 有权
标题翻译：使用垂直配置的室用于多个过程的方法
公开(公告)号：US06969456B2
公开(公告)日：2005-11-29
申请号：US10041029
申请日：2001-12-28
申请人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25D7/12 , H01L21/00 , H01L21/02 , H01L21/3063 , C25F3/00 , B08B3/04
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
摘要翻译：本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。然后可以使用相同的容纳室来冲洗和清洁相同的晶片。结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。

8. 发明授权

US06773576B2 Anode assembly for plating and planarizing a conductive layer 有权
标题翻译：用于电镀和平坦化导电层的阳极组件
公开(公告)号：US06773576B2
公开(公告)日：2004-08-10
申请号：US10251377
申请日：2002-09-20
申请人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas W. Young
发明人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas W. Young
IPC分类号： C25F302
CPC分类号： C25D17/14 , C25F7/00
摘要： A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.
摘要翻译：可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。还提供了可以将溶液输送到所述阳极腔的溶液输送结构。溶液输送结构可以包含在进行操作的室内。护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

9. 发明授权

US06932679B2 Apparatus and method for loading a wafer in polishing system 失效
标题翻译：在抛光系统中装载晶片的装置和方法
公开(公告)号：US06932679B2
公开(公告)日：2005-08-23
申请号：US10295197
申请日：2002-11-15
申请人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
发明人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
IPC分类号： B24B21/04 , B24B21/08 , B24B21/22 , B24B37/04 , B24B47/04 , B24B49/16 , B24B1/00
CPC分类号： B24B21/04 , B24B21/08 , B24B21/22 , B24B37/013 , B24B37/04 , B24B37/205 , B24B47/04 , B24B49/16
摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
摘要翻译：本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源并且使抛光垫的寿命最大化。

10. 发明授权

US06478936B1 Anode assembly for plating and planarizing a conductive layer 有权
标题翻译：用于电镀和平坦化导电层的阳极组件
公开(公告)号：US06478936B1
公开(公告)日：2002-11-12
申请号：US09568584
申请日：2000-05-11
申请人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas W. Young
发明人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas W. Young
IPC分类号： C25B1103
CPC分类号： C25D17/14 , C25F7/00
摘要： A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.
摘要翻译：可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。还提供了可以将溶液输送到所述阳极腔的溶液输送结构。溶液输送结构可以包含在进行操作的室内。护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

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