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1. 发明授权

US08419918B2 Method of surface modification of polyimide film using ethyleneimines coupling agent, manufacturing method of flexible copper clad laminate and its product thereby 有权
标题翻译：使用乙烯亚胺偶联剂对聚酰亚胺膜进行表面改性的方法，由此形成柔性覆铜层压板及其制品的制造方法
公开(公告)号：US08419918B2
公开(公告)日：2013-04-16
申请号：US11920492
申请日：2006-05-18
申请人： Young-Taik Hong , Hyung Dae Kang , Seog Je Kim , Jae Heung Lee
发明人： Young-Taik Hong , Hyung Dae Kang , Seog Je Kim , Jae Heung Lee
IPC分类号： C25D5/56 , C25D5/34 , C23C28/02
CPC分类号： H05K3/389 , C08J7/12 , C08J7/18 , C08J2379/08 , C08L79/08 , H05K1/0346 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2203/095 , Y10T428/12569
摘要： A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams. Also, the FCCL having a two-layer structure, formed by conducting copper sputtering and electroplating on the surface modified polyimide film, has good adhesive strength between the polyimide film and the copper foil and can maintain such adhesive strength even at high temperatures for a long period of time. Further, it may be usefully applied to electronic parts, such as flexible printed circuit boards, TCP (Tape Carrier Package), COF (Chip On Film), etc.
摘要翻译：对聚酰亚胺膜进行表面改性的方法，使用该方法的柔性覆铜层压板的制造方法以及由此制造的具有两层结构的柔性覆铜层压板（FCCL）。聚酰亚胺薄膜的表面改性方法是通过第一等离子体处理改性聚酰亚胺薄膜的表面，将聚酰亚胺薄膜浸入含有通过将式1化合物与化合物混合而制备的乙烯亚胺基硅烷偶联剂的溶液的摩尔比为0.25〜1，然后通过第二等离子体处理改性聚酰亚胺膜的表面。对聚酰亚胺膜进行表面改性的方法是有利的，因为它可以代替使用离子束的常规表面处理方法。此外，具有通过在表面改性聚酰亚胺膜上进行铜溅射和电镀形成的双层结构的FCCL具有在聚酰亚胺膜和铜箔之间的良好的粘合强度，并且即使在高温下也能够保持这种粘合强度长时间一段的时间。此外，它可以有用地应用于诸如柔性印刷电路板，TCP（胶带载体封装），COF（片上胶片）等电子部件。

2. 发明申请

US20090023010A1 METHOD OF SURFACE MODIFICATION OF POLYIMIDE FILM USING ETHYLENEIMINES COUPLING AGENT, MANUFACTURING METHOD OF FLEXIBLE COPPER CLAD LAMINATE AND ITS PRODUCT THEREBY 有权
标题翻译：使用乙烯基偶联剂对聚酰亚胺膜进行表面改性的方法，柔性铜箔层压板及其制品的制造方法
公开(公告)号：US20090023010A1
公开(公告)日：2009-01-22
申请号：US11920492
申请日：2006-05-18
申请人： Young-Taik Hong , Hyung Dae Kang , Seog Je Kim , Jae Heung Lee
发明人： Young-Taik Hong , Hyung Dae Kang , Seog Je Kim , Jae Heung Lee
IPC分类号： B32B15/08 , C07F7/10 , B01J19/08 , C25D5/34
CPC分类号： H05K3/389 , C08J7/12 , C08J7/18 , C08J2379/08 , C08L79/08 , H05K1/0346 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2203/095 , Y10T428/12569
摘要： A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams. Also, the FCCL having a two-layer structure, formed by conducting copper sputtering and electroplating on the surface modified polyimide film, has good adhesive strength between the polyimide film and the copper foil and can maintain such adhesive strength even at high temperatures for a long period of time. Further, it may be usefully applied to electronic parts, such as flexible printed circuit boards, TCP (Tape Carrier Package), COF (Chip On Film), etc.
摘要翻译：对聚酰亚胺膜进行表面改性的方法，使用该方法的柔性覆铜层压板的制造方法以及由此制造的具有两层结构的柔性覆铜层压板（FCCL）。聚酰亚胺薄膜的表面改性方法是通过第一等离子体处理改性聚酰亚胺薄膜的表面，将聚酰亚胺薄膜浸入含有通过将式1化合物与化合物混合而制备的乙烯亚胺基硅烷偶联剂的溶液的摩尔比为0.25〜1，然后通过第二等离子体处理改性聚酰亚胺膜的表面。对聚酰亚胺膜进行表面改性的方法是有利的，因为它可以代替使用离子束的常规表面处理方法。此外，具有通过在表面改性的聚酰亚胺膜上进行铜溅射和电镀形成的双层结构的FCCL具有在聚酰亚胺膜和铜箔之间的良好的粘合强度，并且即使在高温下也能够长时间地保持这种粘合强度一段的时间。此外，它可以有用地应用于诸如柔性印刷电路板，TCP（胶带载体封装），COF（片上胶片）等电子部件。

3. 发明授权

US5521276A Polyamideimide resins containing isophorone diamine structures 失效
标题翻译：含有异佛尔酮二胺结构的聚酰胺酰亚胺树脂
公开(公告)号：US5521276A
公开(公告)日：1996-05-28
申请号：US263470
申请日：1994-06-22
申请人： Kil-Yeong Choi , Mi-Hie Yi , Jae-Heung Lee , Moon-Young Jin , Young-Taik Hong
发明人： Kil-Yeong Choi , Mi-Hie Yi , Jae-Heung Lee , Moon-Young Jin , Young-Taik Hong
IPC分类号： C08G73/14 , C08G75/20 , C09K21/14 , C08G73/10
CPC分类号： C08G73/14 , C08G75/20 , C09K21/14
摘要： Polyamideimide resins having the formula (I) ##STR1## in which repeating units are bound in a head to tail or head to head manner,R is at least two divalent groups selected from the group consisting of ##STR2## (cis-, trans- conformational mixture) wherein one divalent group is ##STR3## group in a PAI molecule, produced by introducing isophorone diamine into the conventional aromatic polyamideimide resins.
摘要翻译：具有式（I）的聚酰胺酰亚胺化合物（I）其中重复单元以头对尾或头对头的方式结合，R是选自由下列组成的组中的至少两个二价基团：通过将异佛尔酮二胺引入到常规芳族聚酰胺酰亚胺树脂中而产生的PAI分子中的一个二价基团为“IMAGE”（顺式 - 反式构型混合物）。

4. 发明授权

US06433184B1 Polyamide-imide having head-to-tail backbone 失效
标题翻译：具有头对头骨架的聚酰胺酰亚胺
公开(公告)号：US06433184B1
公开(公告)日：2002-08-13
申请号：US09605026
申请日：2000-06-28
申请人： Kil-Yeong Choi , Jae Heung Lee , Young-Taik Hong , Moon Young Jin , Kyoung-Su Choi , Ho-Jin Park
发明人： Kil-Yeong Choi , Jae Heung Lee , Young-Taik Hong , Moon Young Jin , Kyoung-Su Choi , Ho-Jin Park
IPC分类号： C07D20948
CPC分类号： C08G73/14
摘要： The present invention relates to polyamide-imides having head-to-tail backbone and more particularly, to polyamide-imimdes having head-to-tail ragularity to provide excellent heat and chemical resistance, physical and mechanical properties, processability, and gas permeability and selectivity. The polyamide-imides represented in the following formula (1) are obtained by direct polymerization, in the presence of dehydrating catalyst, of alone or as a mixture of 2 or above of monomers prepared by condensation of an amine compound having a nitro group with a carboxylic acid anhydride,
摘要翻译：本发明涉及具有头 - 尾主链的聚酰胺 - 酰亚胺，更具体地说，涉及具有头对尾的粗糙度以提供优异的耐热和耐化学性，物理和机械性能，可加工性和气体渗透性和选择性的聚酰胺酰亚胺。在下式（1）中表示的聚酰胺 - 酰亚胺通过在脱水催化剂的存在下，单独或作为2种以上的单体的混合物直接聚合而获得，所述单体通过具有硝基的胺化合物与羧酸酐，

5. 发明申请

US20090117380A1 Filament Bundle Type Nano Fiber and Manufacturing Method Thereof 审中-公开
标题翻译：丝束束式纳米纤维及其制造方法
公开(公告)号：US20090117380A1
公开(公告)日：2009-05-07
申请号：US11920495
申请日：2006-05-15
申请人： Jae-Rock Lee , Seung-Yong Jee , Hyo-Joong Kim , Young-Taik Hong , Seok Kim , Soo-Jin Park
发明人： Jae-Rock Lee , Seung-Yong Jee , Hyo-Joong Kim , Young-Taik Hong , Seok Kim , Soo-Jin Park
IPC分类号： D02G3/02 , B29C47/88
CPC分类号： D01D5/0076 , D01F6/80 , D01F6/90 , Y10T428/29 , Y10T428/2913 , Y10T428/2929 , Y10T428/298
摘要： A filament type nano-sized long fiber and a method of producing the same. In the method, a spinning solution or a spinning melt is electro-spun in drops using a spinneret to which a critical voltage is applied, and the spun drops are continuously collected on a multi-collector. The spinning solution is produced by dissolving a blend or copolymer consisting of two or more kinds of polymers in a solvent. The spinning melt is produced by melting the polymers. The multi-collector is selected from the group consisting of a plate type collector, a roll type collector, and a combination thereof. The filament type nano-sized long fiber is processed into a yarn through one step during the electrospinning process, and thus, mechanical properties are better than those of a conventional nanofiber non-woven fabric. Consequently, the filament type nano-sized long fiber can be utilized for the extended application.
摘要翻译：长丝型纳米长纤维及其制造方法。在该方法中，使用施加有临界电压的喷丝头，将纺丝溶液或纺丝熔体以液滴电纺丝，并将纺丝液滴连续收集在多收集器上。纺丝溶液通过将由两种或更多种聚合物组成的共混物或共聚物溶解在溶剂中来制备。通过熔化聚合物制备纺丝熔体。多集电体选自板式集电体，辊式集电体及其组合。丝网型纳米长纤维在静电纺丝过程中通过一步加工成纱线，因此机械性能优于常规纳米纤维无纺布。因此，长丝型纳米尺寸长纤维可用于扩展应用。

6. 发明申请

US20080241538A1 Filament Bundle Type Nano Fiber and Manufacturing Method Thereof 审中-公开
标题翻译：丝束束式纳米纤维及其制造方法
公开(公告)号：US20080241538A1
公开(公告)日：2008-10-02
申请号：US11570663
申请日：2004-09-17
申请人： Jae-Rock Lee , Seung-Yong Jee , Hyo-Jung Kim , Young-Taik Hong , Seok Kim , Soo-Jin Park
发明人： Jae-Rock Lee , Seung-Yong Jee , Hyo-Jung Kim , Young-Taik Hong , Seok Kim , Soo-Jin Park
IPC分类号： D01D5/00
CPC分类号： D01D5/0076 , D01F6/80 , D01F6/90 , Y10T428/29 , Y10T428/2913 , Y10T428/2929 , Y10T428/298
摘要： A filament type nano-sized long fiber and a method of producing the same are disclosed. In the method, a spinning solution or a spinning melt is electro-spun in drops using a spinneret to which a critical voltage is applied, and the spun drops are continuously collected on a multi-collector. The spinning solution is produced by dissolving a blend or copolymer consisting of two or more kinds of polymers in a solvent. The spinning melt is produced by melting the polymers. The multi-collector is selected from the group consisting of a plate type collector, a roll type collector, and a combination thereof. The filament type nano-sized long fiber is processed into a yarn through one step during the electrospinning process, and thus, mechanical properties are better than those of a conventional nanofiber non-woven fabric. Consequently, the filament type nano-sized long fiber can be utilized for the extended application.
摘要翻译：公开了一种长丝型纳米长纤维及其制造方法。在该方法中，使用施加有临界电压的喷丝头，将纺丝溶液或纺丝熔体以液滴电纺丝，并将纺丝液滴连续收集在多收集器上。纺丝溶液通过将由两种或更多种聚合物组成的共混物或共聚物溶解在溶剂中来制备。通过熔化聚合物制备纺丝熔体。多集电体选自板式集电体，辊式集电体及其组合。丝网型纳米长纤维在静电纺丝过程中通过一步加工成纱线，因此机械性能优于常规纳米纤维无纺布。因此，长丝型纳米尺寸长纤维可用于扩展应用。

7. 发明授权

US5824766A Polyamideamic acid resin prepolymers, high heat resistant polyamideimide foams prepared therefrom, and processes for preparing them 失效
标题翻译：聚酰胺酰胺酸树脂预聚物，由其制备的高耐热聚酰胺酰亚胺泡沫及其制备方法
公开(公告)号：US5824766A
公开(公告)日：1998-10-20
申请号：US586972
申请日：1996-01-16
申请人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Young-Taik Hong
发明人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Young-Taik Hong
IPC分类号： C08G73/10 , C08G73/14 , C08J9/00 , C08J9/02
CPC分类号： C08J9/02 , C08G73/14 , C08J2379/08
摘要： A polyamideamic acid resin prepolymer represented by formula A having isophorone diamine as one of monomers, ##STR1## in which k, l, m and n are integer of 1 or more, respectively, and ##EQU1## --R-- is at least one group selected from the group consisting of ##STR2## --R'-- is a cis- and trans-conformational mixture of ##STR3## high heat resistant polyamideimide foam produced therefrom, and processes for producing them are disclosed.
摘要翻译：由式A表示的具有异佛尔酮二胺作为单体之一的聚酰胺酰胺酸树脂预聚物，其中k，l，m和n分别为1以上的整数，＆lt; IMAGE＆gt;（A）＆lt; IMAGE＆gt; > -R-是至少一种选自由其制备的高耐热性聚酰胺酰亚胺泡沫的第一混合物组成的组，以及用于制备它们的方法。

8. 发明授权

US6018055A Polyarylether containing N-substituted imide groups and process for producing the same 失效
标题翻译：含有N-取代的酰亚胺基团的聚芳醚基及其制备方法
公开(公告)号：US6018055A
公开(公告)日：2000-01-25
申请号：US892707
申请日：1997-07-15
申请人： Kil-Yeong Choi , Dong-Hack Suh , Young-Taik Hong , Eun-Young Chung
发明人： Kil-Yeong Choi , Dong-Hack Suh , Young-Taik Hong , Eun-Young Chung
IPC分类号： C07D487/04 , C08G65/40 , C08G73/06 , C07D487/02
CPC分类号： C07D487/04 , C08G73/0672
摘要： A polyarylether of the formula (VIII) ##STR1## wherein wherein Z' is 1-3 optionally substituted rings selected from the group consisting of an aromatic ring, a hetero aromatic ring or an aliphatic ring.A is --R.sub.1 --Z--Y in which R.sub.1 is H, C.sub.1 -C.sub.30 -alkyl or -aralkyl or phenyl, Z is a direct bond or CH.sub.2, S, O or NH, Y is CH.sub.3, OR.sub.3, SR.sub.3, NHR.sub.3, N(R.sub.3).sub.2, COOR.sub.3, COOM, SO.sub.3 R.sub.3 or SO.sub.3 M in which R.sub.3 is C.sub.1 -C.sub.30 alkyl and M is alkali metal,produced from 3,6-dihalogen- or -dintro-1,2,4,5-diimide having an N,N-substituent and which is suitable for use as a monomer for high temperature structural and functional polymers, and a process for producing the same are disclosed.
摘要翻译：式（VIII）的聚芳醚，其中Z'为1-3个选自芳香环，杂芳环或脂族环的任选取代的环。 A是-R1-ZY，其中R1是H，C1-C30 - 烷基或 - 烷基或苯基，Z是直接键或CH2，S，O或NH，Y是CH3，OR3，SR3，NHR3，N ）2，CO 3，COOM，SO 3 R 3或SO 3 M，其中R 3为C 1 -C 30烷基且M为碱金属，由具有N，N的3,6-二卤代 - 或二苯并1,2,4,5-二酰亚胺并且其适合用作高温结构和功能性聚合物的单体，并且公开了其制备方法。

9. 发明授权

US5955568A Process for preparing polyamideimide resins by direct polymerization 失效
标题翻译：通过直接聚合制备聚酰胺酰亚胺树脂的方法
公开(公告)号：US5955568A
公开(公告)日：1999-09-21
申请号：US956923
申请日：1997-10-23
申请人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Moon-Young Jin
发明人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Moon-Young Jin
IPC分类号： C08G73/14 , C08G69/28
CPC分类号： C08G73/14
摘要： The disclosure describes a process for preparing a polyamideimide resin having high molecular weight in a simple manner wherein major problems of the prior processes such as low heat resistance and low melt flowability are improved. The process comprises condensation of an aromatic tricarboxylic acid anhydride and an aromatic diamine in a polar solvent, subjecting the resulting diimidedicarboxylic acid to acyl halogenating agent treatment to give an intermediate having good reactivity at low temperature, and then subjecting the latter to direct polymerization by using diamine as a nucleophilic agent to give a polyamideimide resin having high molecular weight. The polyamideimide resin prepared by the present invention can be used as major heat resistant structural material in advanced industries and as paint, sheet, adhesives, sliding material, fiber and film having heat resistance.
摘要翻译：本公开内容描述了以简单的方式制备具有高分子量的聚酰胺酰亚胺树脂的方法，其中诸如低耐热性和低熔融流动性的现有方法的主要问题得到改善。该方法包括在极性溶剂中将芳族三羧酸酐和芳族二胺缩合，将所得二酰亚胺二羧酸进行酰卤处理，得到在低温下具有良好反应性的中间体，然后使用后者通过使用二胺作为亲核剂，得到具有高分子量的聚酰胺酰亚胺树脂。本发明制备的聚酰胺酰亚胺树脂可用作先进工业中的主要耐热结构材料，可用作具有耐热性的油漆，片材，粘合剂，滑动材料，纤维和薄膜。

10. 发明授权

US5532334A Process for preparing polyamideimide resins having high molecular weight 失效
标题翻译：制备高分子量聚酰胺酰亚胺树脂的方法
公开(公告)号：US5532334A
公开(公告)日：1996-07-02
申请号：US339391
申请日：1994-11-14
申请人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Jong-Chan Won
发明人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Jong-Chan Won
IPC分类号： C08G73/14 , H01B3/30 , C08G69/26
CPC分类号： C08G73/14 , H01B3/303
摘要： A process for preparing polyamideimide resins having high molecular weights as described wherein major problems of prior art processes such as low heat resistance and low melt flowability are improved. Polyamideimide resins having an intrinsic viscosity of 0.4 to 1.50 dl/g as measured on a solution of dimethylacetamide as a solvent at a concentration of 0.5 g/dl at 30.degree. C., are prepared by reacting an aromatic tricarboxylic acid anhydride with an aromatic diamine in N-methyl pyrrolidone solvent in the presence of a first catalyst selected from a group consisting of thionyl chloride, p-toluenesulphonly chloride, sulfuryl chloride, cyanuric chloride and phosphorus trichloride at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours and further reacting the resultant reaction mixture in the presence of a second catalyst which is a compound of the formula (RO).sub.3 P wherein R is an aliphatic or aromatic substituent, or a compound which is phosphoric acid, pyrophosphoric acid, phosphorous pentaoxide or phosphorous pentachloride as a second catalyst at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours.
摘要翻译：制备如上所述的具有高分子量的聚酰胺酰亚胺树脂的方法，其中提高了诸如低耐热性和低熔融流动性的现有技术方法的主要问题。通过在30℃下以0.5g / dl的浓度作为溶剂的二甲基乙酰胺溶液测定的特性粘度为0.4至1.50dl / g的聚酰胺酰亚胺树脂通过芳族三羧酸酐与芳族二胺在N-甲基吡咯烷酮溶剂中，在50℃至130℃的温度下，在选自亚硫酰氯，对甲苯磺酰氯，磺酰氯，氰尿酰氯和三氯化磷的第一催化剂存在下，在时间为1至5小时，并且在第二催化剂存在下进一步反应，所述第二催化剂是式（RO）3P的化合物，其中R是脂族或芳族取代基，或者是磷酸化合物，焦磷酸，五氧化二磷或五氯化磷作为第二催化剂，温度为50〜130℃，时间为1〜5小时。

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