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1. 发明授权

US06666923B1 Plasma polymerizing apparatus having an electrode with a lot of uniform edges 失效
标题翻译：等离子体聚合装置具有大量均匀边缘的电极
公开(公告)号：US06666923B1
公开(公告)日：2003-12-23
申请号：US09642524
申请日：2000-08-18
申请人： Young-Man Jeong , Su-Won Lee , Dong-Sik Youn , Sam-Chul Ha
发明人： Young-Man Jeong , Su-Won Lee , Dong-Sik Youn , Sam-Chul Ha
IPC分类号： C23C1600
CPC分类号： B05D1/62 , H01J37/32009 , H01J37/32541 , H01J2237/3382
摘要： The present invention relates to a plasma polymerizing apparatus comprises a polymerizing chamber polymerizing surface of substrates by high voltage discharge, a discharge electrode installed inside of the polymerizing chamber, an opposite electrode having a plurality of uniform edges in order to get electric field be formed uniformly on the surface of the electrode, a high voltage applying unit applying the high voltage to the electrode, a gas providing unit providing monomer gas and non-monomer gas inside of the polymerizing chamber, and a pumping unit keeping vacuum inside of the chamber. The present invention can keep the uniformity of the electrode, accordingly the high quality polymerizing film can be fabricated by keeping the uniformity of the current density, carbonation on the each part of the electrode.
摘要翻译：等离子体聚合装置技术领域本发明涉及一种等离子体聚合装置，其特征在于，包括：聚合室，通过高压放电聚合基板表面，安装在聚合室内的放电电极，具有多个均匀边缘的相对电极，以均匀地形成电场在电极表面上，向电极施加高电压的高压施加单元，在聚合室内部提供单体气体和非单体气体的气体提供单元以及在室内保持真空的抽气单元。本发明可以保持电极的均匀性，因此可以通过保持电极的每个部分上的电流密度均匀性，碳酸化来制造高质量的聚合膜。

2. 发明授权

US06705245B1 Apparatus for forming polymer continuously on the surface of metal by DC plasma polymerization 失效
标题翻译：用于通过DC等离子体聚合在金属表面上连续形成聚合物的装置
公开(公告)号：US06705245B1
公开(公告)日：2004-03-16
申请号：US09642537
申请日：2000-08-18
申请人： Young-Man Jeong , Su-Won Lee , Dong-Sik Youn
发明人： Young-Man Jeong , Su-Won Lee , Dong-Sik Youn
IPC分类号： C23C16507
CPC分类号： B05D1/62 , B05D7/14 , B05D2252/02 , C23C16/503 , C23C16/545
摘要： The present invention relates to an apparatus for forming polymer by DC plasma polymerization wherein a substrate is used as an electrode by applying a power to the substrate and an opposite electrode in a deposition chamber is positioned to both the surfaces of the substrate to be deposited. In addition, the present invention can acquire safety during the polymerization by insulating a main body from a substrate to which voltage is applied.
摘要翻译：本发明涉及通过DC等离子体聚合形成聚合物的装置，其中通过向基板施加电力而将基板用作电极，并且沉积室中的相对电极位于要沉积的基板的两个表面上。此外，本发明可以通过使主体与施加电压的基板绝缘来获得聚合期间的安全性。

3. 发明授权

US06833120B2 Supplying and exhausting system in plasma polymerizing apparatus 失效
标题翻译：等离子体聚合装置中的供排系统
公开(公告)号：US06833120B2
公开(公告)日：2004-12-21
申请号：US10220778
申请日：2002-12-09
申请人： Young-Man Jeong , Su-Won Lee , Dong-Sik Youn
发明人： Young-Man Jeong , Su-Won Lee , Dong-Sik Youn
IPC分类号： B01J1908
CPC分类号： C23C16/45502 , B05D1/62 , B05D3/0486 , B05D2252/02 , C23C16/4412 , C23C16/455 , C23C16/545
摘要： A plasma polymerizing apparatus is provided which comprises at least one chamber in which sheet to be coated can be moved continuously, at least one gas inlet supplying reactive gas into the chamber, and at least one gas outlet exhausting the reactive gas out of the chamber, wherein the gas inlet and the gas outlet are disposed on the chamber in such a way that reactive gas flows in substantially parallel with moving direction of the sheet.
摘要翻译：提供了一种等离子聚合装置，其包括至少一个室，其中待涂覆的片材可以连续移动，至少一个供应反应气体的气体入口到室中，以及将反应性气体排出室外的至少一个气体出口，其中所述气体入口和所述气体出口以这样的方式设置在所述室上，使得所述反应气体基本上平行于所述片材的移动方向流动。

4. 发明授权

US07004108B2 Apparatus for fixing an electrode in plasma polymerizing apparatus 失效
标题翻译：用于将电极固定在等离子体聚合装置中的装置
公开(公告)号：US07004108B2
公开(公告)日：2006-02-28
申请号：US10181228
申请日：2001-11-16
申请人： Dong-Sik Youn , Sam Chul Ha
发明人： Dong-Sik Youn , Sam Chul Ha
IPC分类号： C23C16/00
CPC分类号： H01J37/32605
摘要： An apparatus for fixing an eletrode of an electrode of plama polymerization apparatus is provided, which comprises; a nonconductive holder for fixing an electrode by covering an end part of the electrode, a leadline connecting the electrode with a power supply, and a fixing part fixing the holder on a chamber wall.
摘要翻译：提供了一种用于固定聚合装置的电极的电极的装置，包括：用于通过覆盖电极的端部来固定电极的非导电保持器，将电极与电源连接的引线以及将保持器固定在室壁上的固定部。

5. 发明申请

US20050016455A1 Surface treatment system and method 有权
标题翻译：表面处理系统及方法
公开(公告)号：US20050016455A1
公开(公告)日：2005-01-27
申请号：US10485900
申请日：2002-12-30
申请人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha
发明人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha
IPC分类号： C23C16/44 , C23C16/50 , C23C16/00
CPC分类号： C23C16/4411 , C23C16/50
摘要： A surface treatment system is disclosed to form a deposition layer at a surface of an object of surface treatment by using a deposition reaction in which an electrode (110) for applying power to form a deposition reaction in the deposition chamber (100) is installed between an inner wall (120) of the deposition chamber (100) and an object of surface treatment (900) and further includes a cooling unit (200) installed at the inner wall (120) of the deposition chamber (100) facing the electrode (110) and cooling ambient thereof.
摘要翻译：公开了一种表面处理系统，通过使用沉积反应在表面处理对象的表面上形成沉积层，其中用于在沉积室（100）中施加电力以形成沉积反应的电极（110）安装在沉积室（100）的内壁（120）和表面处理物（900），还包括安装在沉积室（100）的面向电极（100）的内壁（120）处的冷却单元（200） 110）及其冷却环境。

6. 发明授权

US07175880B2 Surface treatment system and method 有权
标题翻译：表面处理系统及方法
公开(公告)号：US07175880B2
公开(公告)日：2007-02-13
申请号：US10496219
申请日：2002-12-28
申请人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha , Hyun-Woo Jun
发明人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha , Hyun-Woo Jun
IPC分类号： C23C16/00
CPC分类号： C23C16/45563 , C23C16/4412 , C23C16/455 , C23C16/54
摘要： A surface treatment system in which gas for a deposition reaction is injected into a deposition chamber and power is applied to form a deposition reaction to form a deposition layer at a surface of an object or surface treatment, wherein the deposition chamber has a plurality of deposition spaces disposed in parallel and a convey unit for conveying one or more objects of surface treatment to each deposition space or discharging the objects of surface treatment from each deposition space after a deposition reaction.
摘要翻译：一种表面处理系统，其中用于沉积反应的气体被注入沉积室并施加功率以形成沉积反应以在物体表面处理沉积层或表面处理，其中所述沉积室具有多个沉积平行布置的空间和用于将沉积反应之后的每个沉积空间的一个或多个表面处理物体输送到每个沉积空间或排放表面处理物体的输送单元。

7. 发明申请

US20050051090A1 Surface treatment system and method 有权
标题翻译：表面处理系统及方法
公开(公告)号：US20050051090A1
公开(公告)日：2005-03-10
申请号：US10496219
申请日：2002-12-28
申请人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha , Hyun-Woo Jun
发明人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha , Hyun-Woo Jun
IPC分类号： C23C16/44 , C23C16/455 , C23C16/54 , C23C16/00
CPC分类号： C23C16/45563 , C23C16/4412 , C23C16/455 , C23C16/54
摘要： A surface treatment system in which gas for a deposition reaction is injected into a deposition chamber and power is applied to form a deposition reaction to form a deposition layer at a surface of an object or surface treatment, wherein the deposition chamber has a plurality of deposition spaces disposed in parallel and a convey unit for conveying one or more objects of surface treatment to each deposition space or discharging the objects of surface treatment from each deposition space after a deposition reaction.
摘要翻译：一种表面处理系统，其中用于沉积反应的气体被注入沉积室并施加功率以形成沉积反应以在物体表面处理沉积层或表面处理，其中所述沉积室具有多个沉积平行布置的空间和用于将沉积反应之后的每个沉积空间的一个或多个表面处理物体输送到每个沉积空间或排放表面处理物体的输送单元。

8. 发明授权

US07677199B2 Surface treatment system and method 有权
标题翻译：表面处理系统及方法
公开(公告)号：US07677199B2
公开(公告)日：2010-03-16
申请号：US10485900
申请日：2002-12-30
申请人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha
发明人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha
IPC分类号： C23C16/50 , C23C16/509 , C23C16/458 , C23C16/52 , C23C16/06 , C23C16/22
CPC分类号： C23C16/4411 , C23C16/50
摘要： A surface treatment system is disclosed to form a deposition layer at a surface of an object of surface treatment by using a deposition reaction in which an electrode (110) for applying power to form a deposition reaction in the deposition chamber (100) is installed between an inner wall (120) of the deposition chamber (100) and an object of surface treatment (900) and further includes a cooling unit (200) installed at the inner wall (120) of the deposition chamber (100) facing the electrode (110) and cooling ambient thereof.
摘要翻译：公开了一种表面处理系统，通过使用沉积反应在表面处理对象的表面上形成沉积层，其中用于在沉积室（100）中施加电力以形成沉积反应的电极（110）安装在沉积室（100）的内壁（120）和表面处理物（900），还包括安装在沉积室（100）的面向电极（100）的内壁（120）处的冷却单元（200） 110）及其冷却环境。

9. 发明授权

US07572339B2 Surface treatment system and method thereof 有权
标题翻译：表面处理系统及其方法
公开(公告)号：US07572339B2
公开(公告)日：2009-08-11
申请号：US10486031
申请日：2002-12-28
申请人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha , Hyun-Woo Jun
发明人： Cheon-Soo Cho , Dong-Sik Youn , Hyun-Wook Lee , Samchul Ha , Hyun-Woo Jun
IPC分类号： C23C16/00
CPC分类号： C23C16/458 , C23C16/54
摘要： Disclosed are a surface treatment system that includes a deposition chamber (100) for forming a deposition layer at a surface of an object of surface treatment (900); a carrier (910) for carrying the object of surface treatment (900) by mounting thereon, and a power applying unit (230) for forming a deposition reaction by applying a power to the object in the deposition chamber (100), wherein the power applying unit (230) includes a fixed power applying unit (220) installed in the deposition chamber (100) and connected to an external power source (210); and a movable power applying unit (230) installed at the carrier (910) for being electrically connected to the fixed power applying unit (220) movably as the carrier on which the object of surface treatment (900) is mounted goes into the deposition chamber and thereby applying a power to the object of surface treatment mounted on the carrier by contacting thereto.
摘要翻译：公开了一种表面处理系统，其包括用于在表面处理物体（900）的表面处形成沉积层的沉积室（100）; 用于通过安装其上承载表面处理物体（900）的载体（910）和用于通过向沉积室（100）中的物体施加电力来形成沉积反应的动力施加单元（230），其中，施加单元（230）包括安装在所述沉积室（100）中并连接到外部电源（210）的固定供电单元（220）。以及安装在所述载体（910）上的用于电连接到所述固定电力施加单元（220）的可动电力施加单元（230），所述固定电力施加单元（220）可移动地作为其上安装有所述表面处理（900）的物体的载体进入所述沉积室从而通过与载体接触而对安装在载体上的表面处理对象施加电力。

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