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1. 发明授权

US07030500B2 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same 失效
标题翻译：使用电解无铅电镀工艺制造的封装衬底及其制造方法
公开(公告)号：US07030500B2
公开(公告)日：2006-04-18
申请号：US11034251
申请日：2005-01-13
申请人： Young-Hwan Shin , Chong-Ho Kim , Tae-Gui Kim
发明人： Young-Hwan Shin , Chong-Ho Kim , Tae-Gui Kim
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H05K3/243 , H01L21/4846 , H01L23/3128 , H01L23/498 , H01L23/50 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/00015 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/282 , H05K2203/0361 , H05K2203/0542 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate. The method includes the steps of laminating first dry films over upper and lower surfaces of a base substrate having via holes while being formed at its upper and lower surfaces with copper foils, and patterning the first dry films to expose predetermined surface portions of the base substrate, removing portions of the copper foils not covered by the first dry films to form circuits, stripping the first dry films, and forming a plated layer over the base substrate, laminating second dry films over the plated surfaces of the base substrate, and patterning the second dry films to expose portions of the plated surfaces of the base substrate corresponding to regions where Au is to be plated, removing the plated layer from the exposed surface portions of the base substrate corresponding to the Au plating regions, plating Au on the exposed surface portions of the base substrate, stripping the second dry films, and removing the remaining plated layer to expose the circuits, and coating a solder resist on the exposed circuits while exposing predetermined portions of the circuits.
摘要翻译：通过进行电解Au电镀工艺而不使用用于形成粘合指状物的焊接引线和焊球焊盘来制造的例如BGA型或CSP型的封装衬底以及制造封装衬底的方法。该方法包括以下步骤：在具有通孔的基底基板的上表面和下表面上层叠第一干膜，同时用铜箔在其上表面和下表面上形成，并且对第一干膜进行图案化，以暴露基底基板的预定表面部分除去未被第一干膜覆盖的铜箔的部分以形成电路，剥离第一干膜，并在基底基板上形成镀层，将第二干膜层叠在基底基板的镀覆表面上，第二干膜，以暴露对应于要镀覆的区域的基底基板的镀面的部分，从与Au镀区相对应的基底基板的暴露表面部分去除镀层，在暴露表面上镀Au 部分基底，剥离第二干膜，并除去剩余的镀层以露出电路，并涂覆已售出在露出电路的同时暴露电路的预定部分。

2. 发明授权

US06852625B2 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same 失效
标题翻译：使用电解无铅电镀工艺制造的封装衬底及其制造方法
公开(公告)号：US06852625B2
公开(公告)日：2005-02-08
申请号：US10617726
申请日：2003-07-14
申请人： Young-Hwan Shin , Chong-Ho Kim , Tae-Gui Kim
发明人： Young-Hwan Shin , Chong-Ho Kim , Tae-Gui Kim
IPC分类号： C25D7/00 , H01L21/48 , H01L23/12 , H01L23/31 , H01L23/498 , H01L23/50 , H05K3/02 , H05K3/24 , H05K3/28 , H01L21/44 , H05K3/00
CPC分类号： H05K3/243 , H01L21/4846 , H01L23/3128 , H01L23/498 , H01L23/50 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/00015 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/282 , H05K2203/0361 , H05K2203/0542 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate. The method includes the steps of laminating first dry films over upper and lower surfaces of a base substrate having via holes while being formed at its upper and lower surfaces with copper foils, and patterning the first dry films to expose predetermined surface portions of the base substrate, removing portions of the copper foils not covered by the first dry films to form circuits, stripping the first dry films, and forming a plated layer over the base substrate, laminating second dry films over the plated surfaces of the base substrate, and patterning the second dry films to expose portions of the plated surfaces of the base substrate corresponding to regions where Au is to be plated, removing the plated layer from the exposed surface portions of the base substrate corresponding to the Au plating regions, plating Au on the exposed surface portions of the base substrate, stripping the second dry films, and removing the remaining plated layer to expose the circuits, and coating a solder resist on the exposed circuits while exposing predetermined portions of the circuits.
摘要翻译：通过进行电解Au电镀工艺而不使用用于形成粘合指状物的焊接引线和焊球焊盘来制造的例如BGA型或CSP型的封装衬底以及制造封装衬底的方法。该方法包括以下步骤：在具有通孔的基底基板的上表面和下表面上层叠第一干膜，同时用铜箔在其上表面和下表面上形成，并且对第一干膜进行图案化，以暴露基底基板的预定表面部分除去未被第一干膜覆盖的铜箔的部分以形成电路，剥离第一干膜，并在基底基板上形成镀层，将第二干膜层叠在基底基板的镀覆表面上，第二干膜，以暴露对应于要镀覆的区域的基底基板的镀面的部分，从与Au镀区相对应的基底基板的暴露表面部分去除镀层，在暴露表面上镀Au 部分基底，剥离第二干膜，并除去剩余的镀层以露出电路，并涂覆已售出在露出电路的同时暴露电路的预定部分。

3. 发明申请

US20050194696A1 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same 失效
公开(公告)号：US20050194696A1
公开(公告)日：2005-09-08
申请号：US11034251
申请日：2005-01-13
申请人： Young-Hwan Shin , Chong-Ho Kim , Tae-Gui Kim
发明人： Young-Hwan Shin , Chong-Ho Kim , Tae-Gui Kim
IPC分类号： C25D7/00 , H01L21/48 , H01L23/12 , H01L23/31 , H01L23/498 , H01L23/50 , H05K3/02 , H05K3/24 , H05K3/28 , H01L23/48
CPC分类号： H05K3/243 , H01L21/4846 , H01L23/3128 , H01L23/498 , H01L23/50 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/00015 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/282 , H05K2203/0361 , H05K2203/0542 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate. The method includes the steps of laminating first dry films over upper and lower surfaces of a base substrate having via holes while being formed at its upper and lower surfaces with copper foils, and patterning the first dry films to expose predetermined surface portions of the base substrate, removing portions of the copper foils not covered by the first dry films to form circuits, stripping the first dry films, and forming a plated layer over the base substrate, laminating second dry films over the plated surfaces of the base substrate, and patterning the second dry films to expose portions of the plated surfaces of the base substrate corresponding to regions where Au is to be plated, removing the plated layer from the exposed surface portions of the base substrate corresponding to the Au plating regions, plating Au on the exposed surface portions of the base substrate, stripping the second dry films, and removing the remaining plated layer to expose the circuits, and coating a solder resist on the exposed circuits while exposing predetermined portions of the circuits.

4. 发明授权

US07298887B2 System for and method of analyzing surface condition of PCB using RGB colors 有权
标题翻译：使用RGB颜色分析PCB表面状况的系统和方法
公开(公告)号：US07298887B2
公开(公告)日：2007-11-20
申请号：US10670096
申请日：2003-09-24
申请人： Hyo-Soo Lee , Young-Hwan Shin , Chong-Ho Kim
发明人： Hyo-Soo Lee , Young-Hwan Shin , Chong-Ho Kim
IPC分类号： G06K9/00
CPC分类号： G01N21/27 , G01N21/3554 , G01N2021/95638 , G06T7/0004 , G06T7/90 , G06T2207/30141 , H05K3/22 , H05K2203/0315 , H05K2203/162
摘要： A system for and a method of analyzing the surface condition of a PCB using RGB colors are disclosed. The analyzing method includes the steps of feeding a target PCB, to be measured, to an image pick-up position where a pick-up unit is disposed, by a feeding unit, picking up an image of a metal surface of the fed target PCB, extracting pixel data from the picked-up image for the target PCB, performing a mapping operation for RGB signals of the extracted pixel data in accordance with a mapping program, thereby determining relative RGB values, producing cumulative distribution data of the relative RGB values for the target PCB in accordance with an RGB-mapping process, and quantitatively determining the oxidation degree of the target PCB metal surface exhibited with the lapse of time, based on the cumulative distribution data. Since relative values of RGB colors in an image picked up from the metal surface of a PCB can be analyzed, it is possible to rapidly and easily analyze the surface condition of the PCB such as oxidation, contamination, or structural defects of the PCB in a quantitative manner without using an expensive surface analyzer.
摘要翻译：公开了一种使用RGB颜色分析PCB的表面状态的系统和方法。分析方法包括以下步骤：通过馈送单元将待测量的目标PCB馈送到拾取单元的拾取单元，拾取馈送的目标PCB的金属表面的图像从目标PCB的拾取图像中提取像素数据，根据映射程序对所提取的像素数据的RGB信号执行映射操作，从而确定相对RGB值，产生相对RGB值的累积分布数据，以生成根据RGB映射处理的目标PCB，并且基于累积分布数据定量确定随着时间的流逝呈现的目标PCB金属表面的氧化度。由于可以分析从PCB的金属表面拾取的图像中的RGB颜色的相对值，因此可以快速且容易地分析PCB的表面状况，例如PCB的氧化，污染或结构缺陷定量方式，而不使用昂贵的表面分析仪。

5. 发明授权

US5807534A In vivo binding pair pretargeting 失效
标题翻译：体内结合对预靶向
公开(公告)号：US5807534A
公开(公告)日：1998-09-15
申请号：US452938
申请日：1995-05-30
申请人： Nicholas Pomato , Richard P. McCabe , Gregory Alan Hawkins , Reinhard Bredehorst , Chong-Ho Kim , Carl-Wilhelm Ernst Vogel
发明人： Nicholas Pomato , Richard P. McCabe , Gregory Alan Hawkins , Reinhard Bredehorst , Chong-Ho Kim , Carl-Wilhelm Ernst Vogel
IPC分类号： A61K38/43 , A61K39/395 , A61K47/48 , A61K49/00 , A61K51/00 , A61K51/10
CPC分类号： B82Y5/00 , A61K47/48746 , A61K51/1093 , A61K2121/00
摘要： A method for in-vivo targeting a functional moiety in a patient by administering a targeting moiety coupled to an affinity component, wherein the targeting moiety has affinity for binding sites in a target area, and administering a binding partner to the affinity component coupled to a functional moiety to localize the functional moiety in the target area. Preferably the targeting moiety is an antibody and the functional moiety is a radiometal when performing in vivo imaging or therapy. The affinity component may be a novel methotrexate analog.
摘要翻译：一种通过施用与亲和成分偶联的靶向部分来体内靶向患者功能部分的方法，其中所述靶向部分对靶区域中的结合位点具有亲和力，以及将结合配偶体施用于与功能部分以定位目标区域中的功能部分。优选地，靶向部分是抗体，并且当进行体内成像或治疗时，功能部分是放射性金属。亲和成分可以是新型甲氨蝶呤类似物。

6. 发明授权

US4788181A 5-substituted-2',3'-dideoxycytidine compounds with anti-HTLV-III activity 失效
标题翻译：具有抗HTLV-III活性的5-取代-2'，3'-双脱氧胞苷化合物
公开(公告)号：US4788181A
公开(公告)日：1988-11-29
申请号：US913575
申请日：1986-09-29
申请人： John S. Driscoll , Victor E. Marquez , Chong-Ho Kim , James A. Kelley
发明人： John S. Driscoll , Victor E. Marquez , Chong-Ho Kim , James A. Kelley
IPC分类号： C07D405/04 , A61K31/70 , C07H19/06 , C07H19/10
CPC分类号： C07D405/04
摘要： 5-substituted 2',3'-dideoxycytidine compounds and their monophosphates are disclosed which have been found to have potent activity against retroviruses. The 5-fluoro-and 5-aza-substituted 2',3'-dideoycytidine compounds have been found to be effective against HTLV-III/LAV virus.
摘要翻译：公开了已经发现其具有对逆转录病毒的有效活性的5-取代的2'，3'-双脱氧胞苷化合物及其单磷酸酯。已经发现5-氟代和5-氮杂取代的2'，3'-二脱氧胞苷化合物对HTLV-III / LAV病毒有效。

7. 发明授权

US5433955A Site specific in vivo activation of therapeutic drugs 失效
标题翻译：治疗药物的体内活化位点特异性
公开(公告)号：US5433955A
公开(公告)日：1995-07-18
申请号：US134520
申请日：1993-10-08
申请人： Reinhard Bredehorst , Chong-Ho Kim , Richard McCabe , Nicholas Pomato , Carl-Wilhelm Vogel
发明人： Reinhard Bredehorst , Chong-Ho Kim , Richard McCabe , Nicholas Pomato , Carl-Wilhelm Vogel
IPC分类号： A61K31/715 , A61K47/48 , A61K38/52 , A61K31/70 , C07H15/252 , C12N11/06
CPC分类号： A61K31/70 , A61K31/715 , A61K47/48761 , B82Y5/00
摘要： A method for site-specific in-vivo activation of a prodrug in an animal using an activator-targeting moiety conjugate to localize an activator at a predetermined site of use and a prodrug compound that is converted to an active drug in the presence of the activator. In the preferred embodiment, the targeting moiety, the activator, and the prodrug demonstrate little or no immunogenicity in the animal being treated. The targeting moiety is relatively specific for binding to the target tissue than to non-target tissue. The activator is not found or present in only small amounts in circulation or in non-target tissue, does not have a substrate for its activity in circulation or in non-target tissue, can be linked to the targeting moiety, and is capable of converting the prodrug to an active drug. The prodrug is selected for its ability to exert a cytotoxic activity on the target tissue after conversion by the activator.
摘要翻译：使用活化剂 - 靶向部分缀合物在动物中进行体内前体药物的位点特异性体内活化的方法，以在预定的使用位点定位活化剂，以及在活化剂存在下转化为活性药物的前药化合物。在优选的实施方案中，靶向部分，活化剂和前药在所治疗的动物中表现出很少的或不具有免疫原性。靶向部分对于与非靶组织的结合相对于靶组织是相对特异的。活化剂在循环或非靶组织中没有发现或仅存在少量，不具有其在循环中或非靶组织中的活性的底物，可以连接到靶向部分，并且能够转化该前体药物为活性药物。选择前体药物是通过活化剂转化后在靶组织上发挥细胞毒活性的能力。

8. 发明授权

US5965106A In vivo binding pair pretargeting 失效
标题翻译：体内结合对预靶向
公开(公告)号：US5965106A
公开(公告)日：1999-10-12
申请号：US461267
申请日：1995-06-05
申请人： Nicholas Pomato , Richard P. McCabe , Gregory A. Hawkins , Reinhard Bredehorst , Chong-Ho Kim , Carl-Wilhelm Vogel
发明人： Nicholas Pomato , Richard P. McCabe , Gregory A. Hawkins , Reinhard Bredehorst , Chong-Ho Kim , Carl-Wilhelm Vogel
IPC分类号： A61K47/48 , A61K51/10 , A61K39/395 , A61K51/00
CPC分类号： B82Y5/00 , A61K47/48746 , A61K51/1093 , A61K2121/00
摘要： A method for in-vivo targeting a functional moiety in a patient by administering a targeting moiety coupled to an affinity component, wherein the targeting moiety has affinity for binding sites in a target area, and administering a binding partner to the affinity component coupled to a functional moiety to localize the functional moiety in the target area. Preferably the targeting moiety is an antibody and the functional moiety is a radiometal when performing in vivo imaging or therapy. The affinity component may be a novel methotrexate analog. Preferably, the affinity component is thermo-stabilized.
摘要翻译：一种通过施用与亲和成分偶联的靶向部分来体内靶向患者功能部分的方法，其中所述靶向部分对靶区域中的结合位点具有亲和力，以及将结合配偶体施用于与功能部分以定位目标区域中的功能部分。优选地，靶向部分是抗体，并且当进行体内成像或治疗时，功能部分是放射性金属。亲和成分可以是新型甲氨蝶呤类似物。优选地，亲和性组分是热稳定的。

9. 发明授权

US5578289A In vivo binding pair pretargeting 失效
标题翻译：体内结合对预靶向
公开(公告)号：US5578289A
公开(公告)日：1996-11-26
申请号：US140186
申请日：1993-11-04
申请人： Nicholas Pomato , Richard P. McCabe , Gregory A. Hawkins , Reinhard Bredehorst , Chong-Ho Kim , Carl-Wilhelm E. Vogel
发明人： Nicholas Pomato , Richard P. McCabe , Gregory A. Hawkins , Reinhard Bredehorst , Chong-Ho Kim , Carl-Wilhelm E. Vogel
IPC分类号： A61K38/43 , A61K39/395 , A61K47/48 , A61K49/00 , A61K51/00 , A61K51/10
CPC分类号： B82Y5/00 , A61K47/48746 , A61K51/1093 , A61K2121/00
摘要： A method for in-vivo targeting a functional moiety in a patient by administering a targeting moiety coupled to an affinity component, wherein the targeting moiety has affinity for binding sites in a target area, and administering a binding partner to the affinity component coupled to a functional moiety to localize the functional moiety in the target area. Preferably the targeting moiety is an antibody and the functional moiety is a radiometal when performing in vivo imaging or therapy. The affinity component may be a novel methotrexate analog.
摘要翻译： PCT No.PCT / US93 / 01858 Sec。 371日期：1993年11月4日 102（e）日期1993年11月4日PCT 1993年3月3日PCT公布。出版物WO93 / 17707 日期1993年9月16日一种通过施用与亲和组分偶联的靶向部分来体内靶向患者功能部分的方法，其中靶向部分对靶区域中的结合位点具有亲和力，偶联至功能部分的亲和成分以定位目标区域中的功能部分。优选地，靶向部分是抗体，并且当进行体内成像或治疗时，功能部分是放射性金属。亲和成分可以是新型甲氨蝶呤类似物。

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