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1. 发明申请

US20070096343A1 Semiconductor device package 失效
标题翻译：半导体器件封装
公开(公告)号：US20070096343A1
公开(公告)日：2007-05-03
申请号：US11585828
申请日：2006-10-25
申请人： Young Yoon , Dong Kim , Jin Park
发明人： Young Yoon , Dong Kim , Jin Park
IPC分类号： H01L23/52
CPC分类号： H01L33/641 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/12041 , H01S5/02276 , H01S5/02476 , H01L2924/00014
摘要： Disclosed is a semiconductor device package. The semiconductor device package includes at least one semiconductor device acting as a heating source, a package substrate having an upper surface on which the semiconductor device is mounted, the package substrate at least having a higher heat conductivity than that of the semiconductor device, and a fiber-reinforced polymer composite formed to surround a side surface of the package substrate, the polymer composite including fibers acting as a reinforcing material and a resin mass embedding the fibers therein.
摘要翻译：公开了一种半导体器件封装。半导体器件封装包括至少一个充当加热源的半导体器件，具有上表面的封装衬底，半导体器件安装在该上表面上，封装衬底至少具有比半导体器件更高的导热性，形成为围绕封装基板的侧表面的纤维增强聚合物复合材料，所述聚合物复合材料包括用作增强材料的纤维和将纤维嵌入其中的树脂块。

2. 发明申请

US20060193970A1 Rigid flexible printed circuit board and method of fabricating same 失效
标题翻译：刚性柔性印刷电路板及其制造方法
公开(公告)号：US20060193970A1
公开(公告)日：2006-08-31
申请号：US11214965
申请日：2005-08-29
申请人： Bum Myung , Dong Kim , Young Park , Young Yoon , Dek Yang
发明人： Bum Myung , Dong Kim , Young Park , Young Yoon , Dek Yang
IPC分类号： C23C26/00
CPC分类号： H05K3/4691 , C23C26/00 , C23C28/00 , C23C28/023 , H05K3/4652 , H05K2201/0187 , H05K2201/0355 , H05K2201/0382 , H05K2201/09109 , H05K2203/063 , Y10T29/49155
摘要： A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.
摘要翻译：一种刚性柔性印刷电路板（PCB）及其制造方法。由于在刚性柔性PCB的制造期间不使用聚酰亚胺覆铜层压板，所以避免了使用聚酰亚胺覆铜层压板所产生的成本的增加以及在不同材料之间的界面处的粘附可靠性差。

3. 发明申请

US20070120580A1 Non-volatile memory devices and methods of fabricating the same 有权
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US20070120580A1
公开(公告)日：2007-05-31
申请号：US11403902
申请日：2006-04-14
申请人： Dong Kim , In-kyeong Yoo , Myoung-jae Lee , Sun-ae Seo , In-gyu Baek , Seung-eon Ahn , Byoung-ho Park , Young-kwan Cha , Sang-jin Park
发明人： Dong Kim , In-kyeong Yoo , Myoung-jae Lee , Sun-ae Seo , In-gyu Baek , Seung-eon Ahn , Byoung-ho Park , Young-kwan Cha , Sang-jin Park
IPC分类号： H03K19/00
CPC分类号： H01L45/04 , H01L27/2436 , H01L45/1233 , H01L45/1253 , H01L45/146
摘要： A memory device may include a switching device and a storage node coupled with the switching device. The storage node may include a first electrode, a second electrode, a data storage layer and at least one contact layer. The data storage layer may be disposed between the first electrode and the second electrode and may include a transition metal oxide or aluminum oxide. The at least one contact layer may be disposed at least one of above or below the data storage layer and may include a conductive metal oxide.
摘要翻译：存储器件可以包括与开关器件耦合的开关器件和存储节点。存储节点可以包括第一电极，第二电极，数据存储层和至少一个接触层。数据存储层可以设置在第一电极和第二电极之间，并且可以包括过渡金属氧化物或氧化铝。至少一个接触层可以设置在数据存储层的上方或下方的至少一个上，并且可以包括导电金属氧化物。

4. 发明申请

US20050179027A1 Nitride based semiconductor light-emitting device 审中-公开
标题翻译：氮化物基半导体发光器件
公开(公告)号：US20050179027A1
公开(公告)日：2005-08-18
申请号：US10890215
申请日：2004-07-14
申请人： Je Kim , Jeong Oh , Dong Kim , Sun Kim , Jin Park , Kyu Lee
发明人： Je Kim , Jeong Oh , Dong Kim , Sun Kim , Jin Park , Kyu Lee
IPC分类号： H01L29/06 , H01L33/06 , H01L33/32
CPC分类号： H01L33/04 , B82Y20/00 , H01L33/06 , H01L33/32
摘要： Disclosed herein is a nitride-based semiconductor light-emitting device. The nitride-based semiconductor light-emitting device comprises an n-type clad layer made of n-type Alx1Iny1Ga(1−x1−y1)N (where 0≦x1≦1, 0≦y1≦1, and 0≦x1+y1≦1), a multiple quantum well-structured active layer made of undoped InAGa1−AN (where 0
摘要翻译：本文公开了一种氮化物基半导体发光器件。氮化物系半导体发光元件包括由n型Al x In 1（1-x1-y1）构成的n型覆盖层， N（其中0 <= X 1 <= 1，0 <= Y 1 <= 1，AND 0 <= X 1 1-y2 N（其中0 <= Y2-2 <1）和由p型Al < （1-x3-y3）N（其中0

5. 发明申请

US20080001138A1 NITRIDE BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
标题翻译：基于氮化物的半导体发光器件
公开(公告)号：US20080001138A1
公开(公告)日：2008-01-03
申请号：US11380415
申请日：2006-04-26
申请人： Je Kim , Jeong Oh , Dong Kim , Sun Kim , Jin Park , Kyu Lee
发明人： Je Kim , Jeong Oh , Dong Kim , Sun Kim , Jin Park , Kyu Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/04 , B82Y20/00 , H01L33/06 , H01L33/32
摘要： Disclosed herein is a nitride-based semiconductor light-emitting device. The nitride-based semiconductor light-emitting device comprises an n-type clad layer made of n-type Alx1Iny1Ga(1-x1-y1)N (where 0≦x1≦1, 0≦y1≦1, and 0≦x1+y1≦1), a multiple quantum well-structured active layer made of undoped InAGa1-AN (where 0
摘要翻译：本文公开了一种氮化物基半导体发光器件。氮化物系半导体发光元件包括由n型Al x In 1（1-x1-y1）构成的n型覆盖层， N（其中0 <= X 1 <= 1，0 <= Y 1 <= 1，AND 0 <= X 1 1-y2 N（其中0 <= Y2-2 <1）和由p型Al < （1-x3-y3）N（其中0

6. 发明授权

US08990666B2 Decoder, method of operating the same, and apparatuses including the same 有权
标题翻译：解码器，其操作方法和包括该解码器的设备
公开(公告)号：US08990666B2
公开(公告)日：2015-03-24
申请号：US13234130
申请日：2011-09-15
申请人： Jae Phil Kong , Hwa Seok Oh , Dong Kim
发明人： Jae Phil Kong , Hwa Seok Oh , Dong Kim
IPC分类号： H03M13/00 , G06F11/10 , H03M13/15
CPC分类号： G06F11/1008 , G06F11/108 , H03M13/1515 , H03M13/152 , H03M13/1545 , H03M13/6502
摘要： A decoder, a method of decoding and systems implementing the same are disclosed. In one example, the method includes calculating syndrome values from input codewords, generating an error location polynomial about the codewords using the syndrome values, determining an error count in the codewords using the error location polynomial, and adjusting power consumption of a circuit in response to the determined error count in the codewords. In one example, a frequency of a clock signal to be provided to a search circuit may be determined based on the error count, and the clock signal may be provided having the determined frequency to a search circuit, such as a Chien search circuit.
摘要翻译：公开了解码器，解码方法及其实现方法。在一个示例中，该方法包括从输入码字计算校正子值，使用校正子值生成关于码字的误差位置多项式，使用误差位置多项式确定码字中的误差计数，以及响应于在码字中确定的错误计数。在一个示例中，可以基于错误计数来确定要提供给搜索电路的时钟信号的频率，并且可以向诸如Chien搜索电路的搜索电路提供具有确定的频率的时钟信号。

7. 发明申请

US20080038144A1 High strength alloys 有权
标题翻译：高强度合金
公开(公告)号：US20080038144A1
公开(公告)日：2008-02-14
申请号：US11788858
申请日：2007-04-20
申请人： Phillip Maziasz , John Shingledecker , Michael Santella , Joachim Schneibel , Vinod Sikka , Harold Vinegar , Randy John , Dong Kim
发明人： Phillip Maziasz , John Shingledecker , Michael Santella , Joachim Schneibel , Vinod Sikka , Harold Vinegar , Randy John , Dong Kim
IPC分类号： C22C38/44 , C22C30/02 , C22C38/02 , C22C38/04 , C22C38/08 , C22C38/12 , C22C38/16 , C22C38/18 , C22C38/58 , E21B36/00 , C22C38/48 , C22C38/20 , C22C38/22 , C22C38/26 , C22C38/38 , C22C38/40 , C22C38/42
CPC分类号： E21B43/2401 , B32B1/08 , B32B9/002 , B32B9/045 , B32B15/013 , B32B15/015 , B32B2307/202 , B32B2307/208 , C21D6/002 , C21D6/007 , C21D2211/001 , C21D2211/004 , C21D2211/005 , C22C38/02 , C22C38/04 , C22C38/10 , C22C38/12 , C22C38/14 , C22C38/24 , C22C38/28 , C22C38/30 , E21B36/04 , G05F1/10 , Y10S166/902 , Y10T307/406
摘要： High strength metal alloys are described herein. At least one composition of a metal alloy includes chromium, nickel, copper, manganese, silicon, niobium, tungsten and iron. System, methods, and heaters that include the high strength metal alloys are described herein. At least one heater system may include a canister at least partially made from material containing at least one of the metal alloys. At least one system for heating a subterranean formation may include a tubular that is at least partially made from a material containing at least one of the metal alloys.
摘要翻译：本文描述了高强度金属合金。至少一种金属合金组成包括铬，镍，铜，锰，硅，铌，钨和铁。包括高强度金属合金的系统，方法和加热器在本文中描述。至少一个加热器系统可以包括至少部分地由包含至少一种金属合金的材料制成的罐。用于加热地下地层的至少一个系统可以包括至少部分地由包含至少一种金属合金的材料制成的管状体。

8. 发明申请

US20080000098A1 Drying machine and method for controlling the same 有权
标题翻译：干燥机及其控制方法
公开(公告)号：US20080000098A1
公开(公告)日：2008-01-03
申请号：US11706435
申请日：2007-02-15
申请人： Chul Choi , Dae Yang , Chong Ryu , Jea Wee , Young Kim , Sang Hun Bae , Chang Son , Dong Kim , Young Son
发明人： Chul Choi , Dae Yang , Chong Ryu , Jea Wee , Young Kim , Sang Hun Bae , Chang Son , Dong Kim , Young Son
IPC分类号： D06F58/04 , F26B21/02
CPC分类号： D06F58/203 , D06F58/04 , D06F58/28
摘要： A drying machine is disclosed. The drying machine includes a selectively rotatable drum receiving an object to be dried, a steam supply member having one side connected to a steam generator and the other side connected to the drum, and a swirler installed in the steam supply member at a predetermined position for swirling steam flowing through the steam supply member. A method for controlling the drying machine includes heating a drum, supplying steam generated in a steam generator into the drum, and supplying hot air into the drum. The drying machine having the above described configuration can efficiently eliminate creases of clothes.
摘要翻译：公开了干燥机。干燥机包括容纳待干燥物体的可选择性地旋转的滚筒，具有连接到蒸汽发生器的一侧的蒸汽供应构件和连接到滚筒的另一侧;以及在预定位置处安装在蒸汽供应构件中的旋流器，蒸汽通过蒸汽供应构件流动。一种用于控制干燥机的方法包括加热滚筒，将在蒸汽发生器中产生的蒸汽供应到滚筒中，并将热空气供应到滚筒中。具有上述构造的干燥机能够有效地消除衣服的褶皱。

9. 发明申请

US20070279940A1 Optical Sheet and Backlight Assembly Having the Same 有权
标题翻译：光学片和背光组件具有相同的功能
公开(公告)号：US20070279940A1
公开(公告)日：2007-12-06
申请号：US11734611
申请日：2007-04-12
申请人： Cheul Kim , Sang Kim , Jong Huh , Dong Kim , Ju Lee , Min Kim , Hyun Shin , Yong Kim
发明人： Cheul Kim , Sang Kim , Jong Huh , Dong Kim , Ju Lee , Min Kim , Hyun Shin , Yong Kim
IPC分类号： F21V8/00 , G02B5/02
CPC分类号： G02B5/045
摘要： Provided are embodiments of an optical sheet and a backlight assembly having the optical sheet. The optical sheet can include a body, a plurality of protrusions, and a plurality of embossed portions. The body can form a substrate. One surface of the body can be provided in a planar shape, and the other surface of the body can include the plurality of protrusions, where the protrusions have a triangular shaped cross-section. Each of the protrusions can be configured with the plurality of embossed, which may be formed by a microlens pattern.
摘要翻译：提供了具有光学片的光学片和背光组件的实施例。光学片可以包括主体，多个突起和多个压花部分。身体可以形成底物。身体的一个表面可以设置成平面形状，并且主体的另一个表面可以包括多个突起，其中突起具有三角形的横截面。每个突起可以配置有多个压花，其可以由微透镜图案形成。

10. 发明申请

US20070249095A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US20070249095A1
公开(公告)日：2007-10-25
申请号：US11769489
申请日：2007-06-27
申请人： Moon Song , Dong Kim , Jin Ryu
发明人： Moon Song , Dong Kim , Jin Ryu
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/3114 , H01L24/10 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.
摘要翻译：本文公开了用于数字光学仪器的半导体封装及其制造方法。半导体封装包括由硅材料制成的晶片，并且在其一个侧表面上形成有焊盘电极，IR滤光器通过粘结剂分别附着在晶片的焊盘电极上，分别与焊盘电极电连接，在与晶片电极相对的晶片的另一侧表面上形成的通孔以及每个端子的一侧连接的凸起电极。通过采用晶片级封装技术，本发明能够使具有图像传感器（称为互补金属氧化物半导体（CMOS）或电荷耦合器件（CCD））的半导体封装的尺寸最小化，从而降低半导体封装的制造成本并大量实现生产。

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