专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07513632B2 Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
标题翻译：具有用作导光板的透明板的直接照明背光装置
公开(公告)号：US07513632B2
公开(公告)日：2009-04-07
申请号：US11860391
申请日：2007-09-24
申请人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
发明人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
IPC分类号： G01D11/28
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.
摘要翻译：使用LED的直接照明背光装置包括平面反射板，LED光源，透明板，散射图案和导光体。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。

2. 发明授权

US07186013B2 Large size backlight apparatus reduced in thickness 失效
标题翻译：大尺寸背光设备厚度减小
公开(公告)号：US07186013B2
公开(公告)日：2007-03-06
申请号：US11060286
申请日：2005-02-18
申请人： Young June Jeong , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young Sam Park , Bum Jin Kim , Hun Joo Hahm
发明人： Young June Jeong , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young Sam Park , Bum Jin Kim , Hun Joo Hahm
IPC分类号： F21V8/00
CPC分类号： G02B6/0021 , G02B6/0036 , G02B6/0055 , G02B6/0061 , G02B6/0068 , G02B6/0076
摘要： In a backlight apparatus used in an LCD, in which upper and lower reflective plates are installed under upper and lower transparent plates, respectively. The lower transparent plates and the lower reflective plates introduce light generated by lower light sources in upward directions and the upper transparent plate and the upper reflective plates introduce light generated by an upper light source into those areas, which are not lighted by the lower light sources. This can prevent the formation of dark areas above the lower light sources thereby enhancing the overall uniformity of light.
摘要翻译：在LCD中使用的背光装置中，上下反射板分别安装在上透明板和下透明板之下。下透明板和下反射板在向上方向引入由下光源产生的光，并且上透明板和上反射板将由上光源产生的光引入那些未被下光源照射的区域。这可以防止在较低光源之上形成暗区，从而增强光的整体均匀性。

3. 发明授权

US07473937B2 Side-emission type LED package 有权
标题翻译：侧面发射型LED封装
公开(公告)号：US07473937B2
公开(公告)日：2009-01-06
申请号：US11318837
申请日：2005-12-28
申请人： Young Sam Park , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Hun Joo Hahm , Bum Jin Kim
发明人： Young Sam Park , Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Hun Joo Hahm , Bum Jin Kim
IPC分类号： H01L29/22
CPC分类号： H01L33/60 , F21K9/68 , H01L33/54
摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.
摘要翻译：提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。下部结构具有下反射镜和透明密封构件。下部结构支持LED芯片。下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。透明密封件形成在下反射镜内部的LED芯片周围。上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

4. 发明申请

US20090321773A1 LED PACKAGE FRAME AND LED PACKAGE HAVING THE SAME 有权
标题翻译： LED包装框架和带有它的LED包装
公开(公告)号：US20090321773A1
公开(公告)日：2009-12-31
申请号：US12549252
申请日：2009-08-27
申请人： Young Sam PARK , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
发明人： Young Sam PARK , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
摘要翻译： LED封装框架包括LED芯片和由高导热性材料制成的导热部件。导热构件在侧部具有接收部，并且安装有LED芯片。构造成插入到包括导线的导热构件的接收部分的引线涂层组件的一端插入导热构件的接收部分中，并且电连接到LED芯片。引线与导热部件的接收部之间紧密接触的电绝缘层使引线与接收部分隔离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。

5. 发明授权

US07592631B2 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US07592631B2
公开(公告)日：2009-09-22
申请号：US11319101
申请日：2005-12-28
申请人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
发明人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
摘要翻译： LED封装框架包括LED芯片和由高导热性材料制成的导热部件。导热构件在侧部具有接收部，并且安装有LED芯片。构造成插入到包括导线的导热构件的接收部分的引线涂层组件的一端插入导热构件的接收部分中，并且电连接到LED芯片。引线与导热部件的接收部之间紧密接触的电绝缘层使引线与接收部分隔离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。

6. 发明授权

US07273291B2 Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
标题翻译：具有用作导光板的透明板的直接照明背光装置
公开(公告)号：US07273291B2
公开(公告)日：2007-09-25
申请号：US11136529
申请日：2005-05-25
申请人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
发明人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
IPC分类号： G01D11/28
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.
摘要翻译：使用LED的直接照明背光装置包括平面反射板，LED光源，透明板，散射图案和导光体。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。

7. 发明授权

US07968894B2 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US07968894B2
公开(公告)日：2011-06-28
申请号：US12549252
申请日：2009-08-27
申请人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
发明人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
摘要翻译： LED封装框架包括LED芯片和由高导热性材料制成的导热部件。导热构件在侧部具有接收部，并且安装有LED芯片。构造成插入到包括导线的导热构件的接收部分的引线涂层组件的一端插入导热构件的接收部分中，并且电连接到LED芯片。引线与导热部件的接收部之间紧密接触的电绝缘层使引线与接收部分隔离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。

8. 发明授权

US07221416B2 LCD Backlight unit and LCD having the same 有权
标题翻译： LCD背光单元和LCD具有相同的功能
公开(公告)号：US07221416B2
公开(公告)日：2007-05-22
申请号：US10997895
申请日：2004-11-29
申请人： Hun Joo Hahm , Jung Kyu Park , Young June Jeong , Young Sam Park , Hyung Suk Kim , Ho Sik Ahn
发明人： Hun Joo Hahm , Jung Kyu Park , Young June Jeong , Young Sam Park , Hyung Suk Kim , Ho Sik Ahn
IPC分类号： G02F1/1335
CPC分类号： G02B6/0028 , G02B5/021 , G02B5/0284 , G02B6/0018 , G02B6/003 , G02B6/0038 , G02B6/0068 , G02B6/0073
摘要： An LCD backlight apparatus includes a light guide plate placed under an LCD panel of the LCD to guide light to the LCD panel. The light guide plate has an even upper surface and a scattering pattern formed in a bottom surface. A plurality of monochromatic light sources are placed in line at a side of the light guide plate to radiate light along the plane direction of the light guide plate between the upper and bottom surfaces of the light guide plate. The light sources are adapted to radiate light beams at a predetermined beam angle so that the light beams reach the scattering pattern only after having propagated a predetermined reference length necessary for forming white light when mixed together. The LCD backlight apparatus can reduce the Bezel width without increasing the thickness of the LCD.
摘要翻译： LCD背光装置包括一个导光板，该导光板放置在LCD的LCD面板的下方，以将光引向LCD面板。导光板具有均匀的上表面和形成在底面中的散射图案。多个单色光源在导光板的一侧成直线放置，以在导光板的上表面和底表面之间沿着导光板的平面方向辐射光。光源适于以预定的光束角辐射光束，使得光束仅在已经传播混合在一起形成白光所需的预定参考长度之后才到达散射图案。 LCD背光装置可以在不增加LCD的厚度的情况下减少边框宽度。

9. 发明授权

US07118236B2 Light emitting diode lens and backlight apparatus having the same 有权
公开(公告)号：US07118236B2
公开(公告)日：2006-10-10
申请号：US10953816
申请日：2004-09-30
申请人： Hun Joo Hahm , Jung Kyu Park , Young June Jeong , Young Sam Park , Hyung Suk Kim , Ho Sik Ahn
发明人： Hun Joo Hahm , Jung Kyu Park , Young June Jeong , Young Sam Park , Hyung Suk Kim , Ho Sik Ahn
IPC分类号： G01D11/28 , F21V5/00
CPC分类号： H01L33/58 , H01L33/54 , H01L33/60
摘要： The present invention relates to an LED lens, in which a planar bottom has a pair of halves symmetrically connected with each other about a reference line and narrowed in the vicinity of the reference line. A pair of substantially semicircular reflecting surfaces are extended from both edges of the bottom connected with both ends of the reference line. A radiating surface is connected with remaining edges of the bottom and semicircular edges of the reflecting surfaces. The reflecting surfaces reflect light beams are introduced from the LED chip through the bottom toward the radiating surface. The radiating surface radiates the light beams to the outside when the light beams are introduced to the radiating surface through reflection from the reflecting surfaces and directly through the bottom, so that the light beams are radiated to the outside in a predetermined beam angle.

10. 发明授权

US07414270B2 Side-emitting LED package having scattering area and backlight apparatus incorporating the LED lens 有权
标题翻译：具有散射面积的侧面发光LED封装和并入LED透镜的背光装置
公开(公告)号：US07414270B2
公开(公告)日：2008-08-19
申请号：US11370021
申请日：2006-03-08
申请人： Bum Jin Kim , Hyung Suk Kim , Ho Sik Ahn , Young June Jeong , Sung Min Yang
发明人： Bum Jin Kim , Hyung Suk Kim , Ho Sik Ahn , Young June Jeong , Sung Min Yang
IPC分类号： H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00
CPC分类号： H01L33/54 , G02F1/133603 , G02F1/133615 , H01L33/60 , H01L2933/0091
摘要： The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.
摘要翻译：本发明提供了一种LED封装和结合了LED透镜的背光装置。 LED封装具有底表面和从底表面围绕封装的中心轴线圆柱形延伸的光出射表面。此外，反射表面位于底表面的相对侧并且围绕中心轴对称，使得从底表面入射的光被反射到光出射表面。此外，在反射面上形成散射区域。根据本发明，通过在LED封装的反射面上施加散射材料，不需要附着反射纸，从而简化了工艺并缩短了制造时间和成本。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式