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1. 发明授权

US09219206B2 Package and manufacturing method of the same 有权
标题翻译：包装和制造方法相同
公开(公告)号：US09219206B2
公开(公告)日：2015-12-22
申请号：US13522902
申请日：2010-12-23
申请人： Young Ju Han , Deok Ki Hwang , Jae Chung Lim
发明人： Young Ju Han , Deok Ki Hwang , Jae Chung Lim
IPC分类号： H05K1/03 , H01L33/62 , H01L33/44 , H01L33/00
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/44 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
摘要： Provided are a package including a first conductive layer on a patterned layer, an insulating layer on the patterned layer burying the first conductive layer, a second conductive layer on an outer surface of the insulating layer, and a third conductive layer in the insulating layer electrically connecting the first conductive layer with the second conductive layer. A substrate is formed by printing or coating a paste- or ink-type insulator and conductor on a patterned layer formed on a sapphire wafer. No void is created between the substrate and LED chip, thus enhancing attachment strength. The ceramic-containing insulator is cured at a low temperature, thereby minimizing contraction of and damage to the wafer when the ceramic is fired. Printing methods utilizing viscous paste or ink solves problems with co-planarity of substrate that occur in existing wafer-to-wafer bonding processes and renders several steps of the existing substrate manufacturing process unnecessary.
摘要翻译：提供了一种封装，其包括图案化层上的第一导电层，埋置第一导电层的图案化层上的绝缘层，绝缘层外表面上的第二导电层和绝缘层中的第三导电层将第一导电层与第二导电层连接。通过在形成在蓝宝石晶片上的图案化层上印刷或涂布糊状或油墨型绝缘体和导体来形成基板。在基板和LED芯片之间不产生空隙，从而提高附着强度。含陶瓷的绝缘体在低温下固化，从而使陶瓷烧制时晶片的收缩和损坏最小化。利用粘性糊状物或油墨的印刷方法解决了在现有的晶片到晶片粘接工艺中出现的基板的共面性问题，并且使现有的基板制造工艺的几个步骤不必要。

2. 发明申请

US20130020109A1 Package and Manufacturing Method of the Same 有权
标题翻译：包装和制造方法相同
公开(公告)号：US20130020109A1
公开(公告)日：2013-01-24
申请号：US13522902
申请日：2010-12-23
申请人： Young Ju Han , Deok Ki Hwang , Jae Chung Lim
发明人： Young Ju Han , Deok Ki Hwang , Jae Chung Lim
IPC分类号： H05K1/09 , H05K3/00
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/44 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
摘要： Provided are a package including a first conductive layer on a patterned layer, an insulating layer on the patterned layer burying the first conductive layer, a second conductive layer on an outer surface of the insulating layer, and a third conductive layer in the insulating layer electrically connecting the first conductive layer with the second conductive layer. A substrate is formed by printing or coating a paste- or ink-type insulator and conductor on a patterned layer formed on a sapphire wafer. No void is created between the substrate and LED chip, thus enhancing attachment strength. The ceramic-containing insulator is cured at a low temperature, thereby minimizing contraction of and damage to the wafer when the ceramic is fired. Printing methods utilizing viscous paste or ink solves problems with co-planarity of substrate that occur in existing wafer-to-wafer bonding processes and renders several steps of the existing substrate manufacturing process unnecessary.
摘要翻译：提供了一种封装，其包括图案化层上的第一导电层，埋置第一导电层的图案化层上的绝缘层，绝缘层外表面上的第二导电层和绝缘层中的第三导电层将第一导电层与第二导电层连接。通过在形成在蓝宝石晶片上的图案化层上印刷或涂布糊状或油墨型绝缘体和导体来形成基板。在基板和LED芯片之间不产生空隙，从而提高附着强度。含陶瓷的绝缘体在低温下固化，从而使陶瓷烧制时晶片的收缩和损坏最小化。利用粘性糊状物或油墨的印刷方法解决了在现有的晶片到晶片粘接工艺中出现的基板的共面性问题，并且使现有的基板制造工艺的几个步骤不必要。

3. 发明授权

US09269878B2 Light emitting device and light emitting apparatus 有权
标题翻译：发光装置和发光装置
公开(公告)号：US09269878B2
公开(公告)日：2016-02-23
申请号：US13293858
申请日：2011-11-10
申请人： Deok Ki Hwang , Young Ju Han , Hee Seok Choi , Ju Won Lee , Pil Geun Kang , Seok Beom Choi
发明人： Deok Ki Hwang , Young Ju Han , Hee Seok Choi , Ju Won Lee , Pil Geun Kang , Seok Beom Choi
IPC分类号： H01L33/36 , H01L33/62 , H01L33/00 , H01L33/38 , H01L33/40 , H01L33/44 , H01L33/50
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/06 , H01L33/32 , H01L33/385 , H01L33/405 , H01L33/44 , H01L33/46 , H01L33/483 , H01L33/505 , H01L33/507 , H01L33/641 , H01L2224/16
摘要： A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode under the first semiconductor layer, a reflective electrode layer under the second conductive semiconductor layer, a second electrode under the reflective electrode layer, and a support member under the first semiconductor layer and the reflective electrode layer around the first and second electrodes. A first connection electrode may be provided under the first electrode. At least a part of the first connection electrode is provided in the support member. A second connection electrode may be provided under the second electrode At least a part of the second connection electrode may be provided in the support member.
摘要翻译：可以提供一种发光器件，其包括衬底，发光结构，第一半导体层下的第一电极，第二导电半导体层下的反射电极层，反射电极层下的第二电极和支撑构件在第一半导体层和第一和第二电极周围的反射电极层之下。可以在第一电极下方设置第一连接电极。第一连接电极的至少一部分设置在支撑构件中。第二连接电极可以设置在第二电极下方第二连接电极的至少一部分可以设置在支撑构件中。

4. 发明申请

US20120299038A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS 有权
标题翻译：发光装置和发光装置
公开(公告)号：US20120299038A1
公开(公告)日：2012-11-29
申请号：US13293858
申请日：2011-11-10
申请人： Deok Ki Hwang , Young Ju Han , Hee Seok Choi , Ju Won Lee , Pil Geun Kang , Seok Beom Choi
发明人： Deok Ki Hwang , Young Ju Han , Hee Seok Choi , Ju Won Lee , Pil Geun Kang , Seok Beom Choi
IPC分类号： H01L33/36
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/06 , H01L33/32 , H01L33/385 , H01L33/405 , H01L33/44 , H01L33/46 , H01L33/483 , H01L33/505 , H01L33/507 , H01L33/641 , H01L2224/16
摘要： A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode under the first semiconductor layer, a reflective electrode layer under the second conductive semiconductor layer, a second electrode under the reflective electrode layer, and a support member under the first semiconductor layer and the reflective electrode layer around the first and second electrodes. A first connection electrode may be provided under the first electrode. At least a part of the first connection electrode is provided in the support member. A second connection electrode may be provided under the second electrode At least a part of the second connection electrode may be provided in the support member.
摘要翻译：可以提供一种发光器件，其包括衬底，发光结构，第一半导体层下的第一电极，第二导电半导体层下的反射电极层，反射电极层下的第二电极和支撑构件在第一半导体层和第一和第二电极周围的反射电极层之下。可以在第一电极下方设置第一连接电极。第一连接电极的至少一部分设置在支撑构件中。第二连接电极可以设置在第二电极下方第二连接电极的至少一部分可以设置在支撑构件中。

5. 发明申请

US20140332116A1 SOLDER PASTE 有权
标题翻译：焊膏
公开(公告)号：US20140332116A1
公开(公告)日：2014-11-13
申请号：US14272127
申请日：2014-05-07
申请人： Deok Ki Hwang
发明人： Deok Ki Hwang
IPC分类号： B23K35/02 , B23K35/24
CPC分类号： B23K35/025 , B22F1/0003 , B22F1/025 , B22F2998/10 , B23K1/0016 , B23K35/0244 , B23K35/24 , B23K35/262 , B23K35/302 , B23K35/36 , B23K35/3612 , C22C1/0425 , C22C1/0483 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/06102 , H01L2224/27442 , H01L2224/27849 , H01L2224/29294 , H01L2224/29311 , H01L2224/29347 , H01L2224/29439 , H01L2224/32058 , H01L2224/32245 , H01L2224/83801 , H01L2924/01322 , H05K3/3463 , H05K3/3484 , H05K2201/0272 , H01L2924/00 , B22F9/04 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029
摘要： A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one metal dissolved in the tin (Sn), and the second powder may be a copper (Cu) powder, the surface of which is coated with silver (Ag).
摘要翻译：焊膏包括与焊剂混合的焊剂和粉末，其中粉末包括彼此混合的第一粉末和第二粉末。第一粉末可以是锡（Sn）和溶解在锡（Sn）中的至少一种金属，第二粉末可以是铜（Cu）粉末，其表面涂有银（Ag）。

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