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1. 发明申请

US20110079421A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110079421A1
公开(公告)日：2011-04-07
申请号：US12634520
申请日：2009-12-09
申请人： Young Gwan KO , Ryoichi Watanabe , Sang Soo Lee , Se Won Park
发明人： Young Gwan KO , Ryoichi Watanabe , Sang Soo Lee , Se Won Park
IPC分类号： H05K1/11 , B05D5/12 , C25D5/00 , C23F1/00
CPC分类号： H05K3/465 , H05K3/045 , H05K3/06 , H05K3/064 , H05K3/4602 , H05K3/4644 , H05K2201/0352 , H05K2201/09536 , H05K2203/0353
摘要： Disclosed herein is a printed circuit board, including: a base substrate; insulation layers which are formed on both sides of the base substrate and in which trenches are formed; and circuit layers including circuit patterns and vias formed in the trenches using a plating process. The printed circuit board is advantageous in that trenches are formed in both sides of a base substrate, so that a fine circuit pattern can be simultaneously formed on both sides thereof, thereby simplifying the manufacturing process thereof.
摘要翻译：本文公开了一种印刷电路板，包括：基底; 绝缘层，其形成在基底基板的两侧，并且形成沟槽; 以及电路层，其包括使用电镀工艺在沟槽中形成的电路图案和通孔。印刷电路板的优点在于，在基底基板的两侧形成沟槽，从而可以在其两侧同时形成精细电路图案，从而简化了其制造工艺。

2. 发明申请

US20120077333A1 TRENCH SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： TRENCH基板及其制造方法
公开(公告)号：US20120077333A1
公开(公告)日：2012-03-29
申请号：US13310319
申请日：2011-12-02
申请人： Young Gwan KO , Ryoichi WATANABE , Sang Soo LEE
发明人： Young Gwan KO , Ryoichi WATANABE , Sang Soo LEE
IPC分类号： H01L21/78
CPC分类号： H01L21/486 , H01L21/32115 , H01L21/4846 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H05K3/045 , H05K3/06 , H05K3/465 , H05K2201/09036 , H05K2201/09781 , H05K2203/0723 , H01L2924/00
摘要： Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.
摘要翻译：这里公开了沟槽衬底及其制造方法。沟槽基板包括基底基板，形成在基底基板的一侧或两侧上的绝缘层，并且包括形成在电路区域中的沟槽和位于沟槽基板的周边边缘的虚设区域，以及电路层，通过电镀工艺的电路区域的沟槽，并且包括电路图案和通孔。由于在虚拟区域和切割区域中形成沟槽，因此在电镀工艺中在绝缘层上形成的镀层的厚度偏差得到改善。

3. 发明申请

US20100264549A1 Trench Substrate and Method Of Manufacturing The Same 有权
标题翻译：沟槽基板及其制造方法
公开(公告)号：US20100264549A1
公开(公告)日：2010-10-21
申请号：US12463945
申请日：2009-05-11
申请人： Young Gwan KO , Ryoichi Watanabe , Sang Soo Lee
发明人： Young Gwan KO , Ryoichi Watanabe , Sang Soo Lee
IPC分类号： H01L23/48 , H01L21/78 , H01L21/768
CPC分类号： H01L21/486 , H01L21/32115 , H01L21/4846 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H05K3/045 , H05K3/06 , H05K3/465 , H05K2201/09036 , H05K2201/09781 , H05K2203/0723 , H01L2924/00
摘要： Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.
摘要翻译：这里公开了沟槽衬底及其制造方法。沟槽基板包括基底基板，形成在基底基板的一侧或两侧上的绝缘层，并且包括形成在电路区域中的沟槽和位于沟槽基板的周边边缘的虚设区域，以及电路层，通过电镀工艺的电路区域的沟槽，并且包括电路图案和通孔。由于在虚拟区域和切割区域中形成沟槽，因此在电镀工艺中在绝缘层上形成的镀层的厚度偏差得到改善。

4. 发明申请

US20120267157A1 PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120267157A1
公开(公告)日：2012-10-25
申请号：US13541619
申请日：2012-07-03
申请人： Young Gwan KO
发明人： Young Gwan KO
IPC分类号： H05K1/11
CPC分类号： H05K3/4682 , H01L21/4857 , H01L23/49816 , H01L23/49822 , H01L23/49894 , H01L2924/0002 , H05K3/0097 , H05K3/045 , H05K2201/0376 , H05K2203/0108 , H05K2203/0733 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , H01L2924/00
摘要： Disclosed is a printed circuit board, which includes an insulating member having a circuit pattern embedded in one surface thereof, a build-up layer formed on one surface of the insulating member and including a build-up insulating layer and a circuit layer formed in the build-up insulating layer and having a via connected to the circuit pattern, and a solder resist layer formed on the build-up layer. A method of fabricating the printed circuit board is also provided. The printed circuit board is fabricated using a build-up process and the outermost circuit layer thereof is formed to have an embedded structure using an imprinting process, thus minimizing the separation of the circuit layer and reducing the lead time and the fabrication cost.
摘要翻译：公开了一种印刷电路板，其包括具有嵌入其一个表面中的电路图案的绝缘构件，形成在所述绝缘构件的一个表面上并包括积聚绝缘层和形成在所述绝缘构件中的电路层的积聚层并且具有连接到电路图案的通孔，以及形成在积聚层上的阻焊层。还提供了制造印刷电路板的方法。印刷电路板使用积聚工艺制造，并且其最外面的电路层被形成为具有使用压印工艺的嵌入式结构，从而最小化电路层的分离并减少了交货时间和制造成本。

5. 发明申请

US20120228007A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFATURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120228007A1
公开(公告)日：2012-09-13
申请号：US13473542
申请日：2012-05-16
申请人： Young Gwan KO
发明人： Young Gwan KO
IPC分类号： H05K1/02
CPC分类号： H05K3/462 , H05K3/007 , H05K3/107 , H05K3/28 , H05K3/4602 , H05K2201/09536 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed are a printed circuit board including a core substrate including core circuit layers on both sides thereof, a first build-up layer formed on one side of the core substrate, a second build-up layer formed on the other side of the core substrate, and first and second protective layers formed on the first and second build-up layers, respectively, wherein the first build-up layer includes a trench circuit layer as an outermost circuit layer formed by a trench technology, the trench circuit layer is embedded in the first protective layer, and an outermost circuit layer of the second build-up layer is embedded in an outermost insulating layer of the second build-up layer, and a method of manufacturing the printed circuit board. Thanks to the formation of the outermost circuit layer by the trench technology, it is difficult to separate the outermost circuit layer from the outermost insulating layer.
摘要翻译：公开了一种印刷电路板，其包括其两侧具有芯电路层的芯基板，形成在芯基板的一侧上的第一累积层，形成在芯基板的另一侧上的第二累积层，以及分别形成在第一和第二堆积层上的第一和第二保护层，其中第一堆积层包括作为通过沟槽技术形成的最外层电路层的沟槽电路层，沟槽电路层嵌入第一保护层和第二堆积层的最外层电路层嵌入第二堆积层的最外绝缘层中，以及制造印刷电路板的方法。由于通过沟槽技术形成最外层电路层，难以将最外层电路层与最外层绝缘层分开。

6. 发明申请

US20110088937A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110088937A1
公开(公告)日：2011-04-21
申请号：US12634617
申请日：2009-12-09
申请人： Young Gwan KO
发明人： Young Gwan KO
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/462 , H05K3/007 , H05K3/107 , H05K3/28 , H05K3/4602 , H05K2201/09536 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed are a printed circuit board including a core substrate including core circuit layers on both sides thereof, a first build-up layer formed on one side of the core substrate, a second build-up layer formed on the other side of the core substrate, and first and second protective layers formed on the first and second build-up layers, respectively, wherein the first build-up layer includes a trench circuit layer as an outermost circuit layer formed by a trench technology, the trench circuit layer is embedded in the first protective layer, and an outermost circuit layer of the second build-up layer is embedded in an outermost insulating layer of the second build-up layer, and a method of manufacturing the printed circuit board. Thanks to the formation of the outermost circuit layer by the trench technology, it is difficult to separate the outermost circuit layer from the outermost insulating layer.
摘要翻译：公开了一种印刷电路板，其包括其两侧具有芯电路层的芯基板，形成在芯基板的一侧上的第一累积层，形成在芯基板的另一侧上的第二累积层，以及分别形成在第一和第二堆积层上的第一和第二保护层，其中第一堆积层包括作为通过沟槽技术形成的最外层电路层的沟槽电路层，沟槽电路层嵌入第一保护层和第二堆积层的最外层电路层嵌入第二堆积层的最外绝缘层中，以及制造印刷电路板的方法。由于通过沟槽技术形成最外层电路层，难以将最外层电路层与最外层绝缘层分开。

7. 发明申请

US20110088938A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110088938A1
公开(公告)日：2011-04-21
申请号：US12634633
申请日：2009-12-09
申请人： Young Gwan KO
发明人： Young Gwan KO
IPC分类号： H05K1/11 , H05K1/00 , H05K3/10
CPC分类号： H05K3/4647 , H05K3/4007 , H05K3/465 , H05K3/4682 , H05K2203/0152 , H05K2203/0156 , Y10T29/49155
摘要： Disclosed are a printed circuit board including a core substrate including core circuit layers on both sides thereof, a first build-up layer formed on one side of the core substrate, a second build-up layer formed on the other side of the core substrate, and first and second protective layers formed on the first and second build-up layers, respectively, wherein the first build-up layer includes a trench circuit layer as an outermost circuit layer formed by a trench-forming technology, and the trench circuit layer is embedded in the first protective layer, and a method of manufacturing the printed circuit board. Thanks to the formation of the outermost circuit layer by the trench-forming technology, it is difficult to separate the outermost circuit layer from the outermost insulating layer.
摘要翻译：公开了一种印刷电路板，其包括其两侧具有芯电路层的芯基板，形成在芯基板的一侧上的第一累积层，形成在芯基板的另一侧上的第二累积层，以及分别形成在第一和第二堆积层上的第一和第二保护层，其中第一堆积层包括作为通过沟槽形成技术形成的最外面电路层的沟槽电路层，沟槽电路层是嵌入在第一保护层中，以及制造印刷电路板的方法。由于通过沟槽形成技术形成最外层电路层，难以将最外层电路层与最外层绝缘层分开。

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