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1. 发明申请

US20050229426A1 Single wafer dryer and drying methods 有权
标题翻译：单片干燥机和干燥方法
公开(公告)号：US20050229426A1
公开(公告)日：2005-10-20
申请号：US11054336
申请日：2005-02-09
申请人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavliev , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavliev , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B05D3/02 , F26B3/00 , H01L21/00 , H01L21/306
CPC分类号： H01L21/02052 , H01L21/67034
摘要： In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.
摘要翻译：在第一方面中，提供了干燥基板的第一种方法。第一种方法包括以下步骤：（1）以第一速率提升衬底通过空气/流体界面; （2）在提升衬底期间在空气/流体界面处引导干燥蒸汽; 和（3）当衬底的一部分保留在空气/流体界面中时，降低衬底的剩余部分通过空气/流体界面提升到第二速率的速率。干燥蒸气可以与空气/流体界面形成约23°的角度和/或第二速率可以为约2.5mm / sec。

2. 发明授权

US06955516B2 Single wafer dryer and drying methods 有权
标题翻译：单片干燥机和干燥方法
公开(公告)号：US06955516B2
公开(公告)日：2005-10-18
申请号：US10286404
申请日：2002-11-01
申请人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavliev , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavliev , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： H01L21/304 , H01L21/00 , B65G1/133
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

3. 发明申请

US20050241684A1 Single wafer dryer and drying methods 审中-公开
公开(公告)号：US20050241684A1
公开(公告)日：2005-11-03
申请号：US11179926
申请日：2005-07-12
申请人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： H01L21/304 , H01L21/00 , B08B3/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

4. 发明申请

US20070295371A1 SINGLE WAFER DRYER AND DRYING METHODS 有权
标题翻译：单辊干燥机和干燥方法
公开(公告)号：US20070295371A1
公开(公告)日：2007-12-27
申请号：US11846400
申请日：2007-08-28
申请人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B08B1/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

5. 发明申请

US20060174921A1 Single wafer dryer and drying methods 审中-公开
公开(公告)号：US20060174921A1
公开(公告)日：2006-08-10
申请号：US11398058
申请日：2006-04-04
申请人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B08B3/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

6. 发明授权

US07980255B2 Single wafer dryer and drying methods 有权
标题翻译：单片干燥机和干燥方法
公开(公告)号：US07980255B2
公开(公告)日：2011-07-19
申请号：US11846400
申请日：2007-08-28
申请人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B08B3/04
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluidnozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没液体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

7. 发明申请

US20100006124A1 SINGLE WAFER DRYER AND DRYING METHODS 审中-公开
标题翻译：单辊干燥机和干燥方法
公开(公告)号：US20100006124A1
公开(公告)日：2010-01-14
申请号：US12345605
申请日：2008-12-29
申请人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Hoaquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Hoaquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B08B5/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

8. 发明授权

US07513062B2 Single wafer dryer and drying methods 有权
标题翻译：单片干燥机和干燥方法
公开(公告)号：US07513062B2
公开(公告)日：2009-04-07
申请号：US11054336
申请日：2005-02-09
申请人： Younes Achkire , Alexander N Lerner , Boris Govzman , Boris Fishkin , Michael N Sugarman , Rashid A Mavliev , Haoquan Fang , Shijian Li , Guy E Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander N Lerner , Boris Govzman , Boris Fishkin , Michael N Sugarman , Rashid A Mavliev , Haoquan Fang , Shijian Li , Guy E Shirazi , Jianshe Tang
IPC分类号： F26B3/00 , B08B3/00
CPC分类号： H01L21/02052 , H01L21/67034
摘要： In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.
摘要翻译：在第一方面中，提供了干燥基板的第一种方法。第一种方法包括以下步骤：（1）以第一速率提升衬底通过空气/流体界面; （2）在提升衬底期间在空气/流体界面处引导干燥蒸汽; 和（3）当衬底的一部分保留在空气/流体界面中时，降低衬底的剩余部分通过空气/流体界面提升到第二速率的速率。干燥蒸气可以与空气/流体界面形成约23°的角度和/或第二速率可以为约2.5mm / sec。

9. 发明申请

US20090241996A1 SINGLE WAFER DRYER AND DRYING METHODS 审中-公开
标题翻译：单辊干燥机和干燥方法
公开(公告)号：US20090241996A1
公开(公告)日：2009-10-01
申请号：US12345642
申请日：2008-12-29
申请人： Younes Achkire , Alexander N. Lerner , Boris I. Govzman , Boris Fishkin , Michael N. Sugarman , Rashid A. Mavliev , Haoquan Fang , Shijian Li , Guy E. Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander N. Lerner , Boris I. Govzman , Boris Fishkin , Michael N. Sugarman , Rashid A. Mavliev , Haoquan Fang , Shijian Li , Guy E. Shirazi , Jianshe Tang
IPC分类号： B08B3/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

10. 发明授权

US06460551B1 Megasonic resonator for disk cleaning and method for use thereof 失效
标题翻译：用于磁盘清洗的超声波谐振器及其使用方法
公开(公告)号：US06460551B1
公开(公告)日：2002-10-08
申请号：US09430345
申请日：1999-10-29
申请人： Boris Fishkin , Alexander Lerner , Jianshe Tang , Brian J. Brown
发明人： Boris Fishkin , Alexander Lerner , Jianshe Tang , Brian J. Brown
IPC分类号： B08B312
CPC分类号： H01L21/67057 , B08B3/12 , G10K11/28 , Y10S134/902
摘要： A Megasonic cleaning apparatus having at least one reflector (e.g., a parabolic or paraboloid reflector) positioned to collect otherwise wasted cleaning energy and redirect that energy to one or a plurality of positions on a wafer's edge is provided. A first embodiment comprises a complex parabolic reflector which has a width greater than that of the wafer and a preferred length approximately equal to the diameter of the wafer, and which is shaped to provide focal points which vary along the length of the parabolic reflector, such that energy striking the reflector at different points along the reflector's length is directed to a plurality of different points along the wafer's edge. A second embodiment comprises a simple parabolic reflector having a width greater than that of the wafer and a preferred length less than the diameter of the wafer, and which is provided to focus at a cord along the wafer's surface, effectively focusing cleaning energy on two points along the wafer's edge at any given time. Yet another embodiment of the invention comprises a paraboloid reflector having a width greater than that of the wafer and a preferred length which is substantially less than the diameter of the wafer and which is shaped to focus all collected energy to a single point on the wafer's edge. Multiple such reflectors may be positioned in the cleaning tank to optimize energy usage and wafer cleaning.
摘要翻译：提供了一种具有至少一个反射器（例如，抛物面或抛物面反射器）的超声波清洗装置，其被定位成收集另外浪费的清洁能量并将该能量重定向到晶片边缘上的一个或多个位置。第一实施例包括复杂的抛物面反射器，其宽度大于晶片的宽度，并且优选的长度近似等于晶片的直径，并且其被成形为提供沿着抛物面反射器的长度变化的焦点，沿着反射器长度的不同点撞击反射器的能量被引导到沿着晶片边缘的多个不同点。第二实施例包括具有大于晶片宽度的宽度的简单抛物面反射器，并且具有小于晶片直径的优选长度，并且其设置成沿着晶片表面聚焦在绳索处，有效地将清洁能量聚焦在两点上在任何给定的时间沿晶圆的边缘。本发明的另一个实施例包括具有大于晶片宽度的宽度的抛物面反射器，其优选长度基本上小于晶片的直径，并且其被成形为将所有收集的能量聚焦到晶片边缘上的单个点。可以将多个这样的反射器定位在清洁槽中以优化能量使用和晶片清洁。

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