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    • 1. 发明授权
    • Electroless deposition of metal films with spray processor
    • 用喷雾处理器无电沉积金属膜
    • US6065424A
    • 2000-05-23
    • US768447
    • 1996-12-18
    • Yosi Shacham-DiamandVinh NguyenValery Dubin
    • Yosi Shacham-DiamandVinh NguyenValery Dubin
    • C23C18/31C23C18/16C23C18/32C23C18/38C23C18/40C23C18/44H01L21/288B05C5/00
    • C23C18/405C23C18/1619C23C18/1658C23C18/166C23C18/1676C23C18/1682C23C18/1692
    • Electroless plating of very thin metal films, such as copper, is accomplished with a spray processor. Atomized droplets or a continuous stream of an electroless plating solution are sprayed on a substrate. The electroless plating solution may be prepared by mixing a reducing solution and a metal stock solution immediately prior to the spraying. The deposition process may be carried out in an apparatus which includes metal stock solution and reducing reservoirs, a mixing chamber for forming the plating solution, optionally an inert gas or air (oxygen) source, a process chamber in which the solution is sprayed on the substrate and a control system for providing solutions to the mixing chamber and the process chamber in accordance with a predetermined program for automated mixing and spraying of the plating solution. The process can be used to form metal films as thin as 100 .ANG. and these films have low resistivity values approaching bulk values, low surface roughness, excellent electrical and thickness uniformity and mirror-like surface. Low temperature annealing may be used to further improve electrical characteristics of the deposited films. The thin metal films produced by the disclosed process can be used in semiconductor wafer fabrication and assembly, and in preparation of thin film discs, thin film heads, optical storage devices, sensor devices, microelectromachined sensors (MEMS) and actuators, and optical filters.
    • 使用喷雾处理器实现非常薄的金属膜(例如铜)的无电镀。 将雾化的液滴或连续的无电镀液流喷射到基底上。 化学镀溶液可以通过在喷雾之前立即混合还原溶液和金属储备溶液来制备。 沉积过程可以在包括金属储备溶液和还原储存器的设备,用于形成电镀溶液的混合室,任选的惰性气体或空气(氧)源),其中溶液喷洒在其上的处理室 基板和用于根据用于电镀液的自动混合和喷涂的预定程序向混合室和处理室提供溶液的控制系统。 该方法可用于形成薄至100的金属膜,并且这些膜具有接近体积值,低表面粗糙度,优异的电和厚度均匀性以及镜面状表面的低电阻率值。 可以使用低温退火来进一步改善沉积膜的电特性。 通过所公开的方法制造的薄金属膜可用于半导体晶片制造和组装,以及薄膜盘,薄膜头,光学存储装置,传感器装置,微机电传感器(MEMS)和致动器以及光学滤波器的制备中。