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1. 发明授权

US07781522B2 Curable silicone composition and cured product thereof 有权
标题翻译：可固化硅酮组合物及其固化产物
公开(公告)号：US07781522B2
公开(公告)日：2010-08-24
申请号：US10578798
申请日：2004-11-04
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
IPC分类号： C08G77/52 , C08G77/00 , C08L83/04
CPC分类号： C09J183/06 , C08L83/00 , C08L83/06
摘要： A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a[R22SiO2/2]b[R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c equals 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0.2≦b≦0.8; and, on average, “c” satisfies the following condition: 0.2
摘要翻译：可固化的有机硅组合物包括：（A）由下面给出的硅氧烷单元式（1）表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷：[R 13 SiO 1/2] a [R 22 SiO 2 / 2] b [R3SiO3 / 2] c（其中R1，R2和R3是一价有机基团，其中至少两个是含有环氧基并且不含芳环的一价有机基团;大于20摩尔％的R3是芳基; a + b + c等于1;平均而言，“a”满足以下条件：0＆nlE; a＆nlE; 0.8;平均而言，“b”满足以下条件：0.2＆nlE; b＆nlE; 0.8; ，“c”满足以下条件：0.2

2. 发明申请

US20070225437A1 Curable Silicone Composition and Cured Product Thereof 有权
标题翻译：可固化硅酮组合物及其固化产品
公开(公告)号：US20070225437A1
公开(公告)日：2007-09-27
申请号：US10578798
申请日：2004-11-04
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
IPC分类号： C08L83/06 , C09D183/06 , C09J183/06
CPC分类号： C09J183/06 , C08L83/00 , C08L83/06
摘要： A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a [R22SiO2/2]b [R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c & equals; 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0≦b≦0.8; and, on average satisfies the following condition: 0.2≦c≦1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.
摘要翻译：可固化的有机硅组合物包括：（A）由下式给出的硅氧烷单元式（1）表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷：[R 1 3 SiO 2 1/2 2 2 2 > 2/2 3 R 1，R 2，R 3和R 3是一价有机基团，其中至少两个含有环氧基并且不含芳环; 大于20摩尔％的R 3是芳基; a + b + c等于1;平均而言，“a”满足以下条件：0 <= a <= 0.8;平均，“b”满足以下条件：0 <= b <= 0.8;平均满足下列条件：0.2 <= c <= 1.0）; （B）具有至少两个含有酚羟基的一价有机基团的直链有机聚硅氧烷; 和（C）固化促进剂。

3. 发明授权

US07863391B2 Organopolysiloxane and curable silicone composition that contains aforementioned organopolysiloxane 有权
标题翻译：含有上述有机聚硅氧烷的有机聚硅氧烷和可固化的有机硅组合物
公开(公告)号：US07863391B2
公开(公告)日：2011-01-04
申请号：US11576628
申请日：2005-09-28
申请人： Yoshitsugu Morita , Hiroshi Ueki , Minoru Isshiki
发明人： Yoshitsugu Morita , Hiroshi Ueki , Minoru Isshiki
IPC分类号： C08L83/06 , C08G77/04
CPC分类号： C08G77/14 , C08G59/3254 , C08L83/06 , C08L2205/02 , C08L83/00 , C08L2666/48 , C08L2666/52 , C08L2666/44
摘要： A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO3/2)x[R1aSiO(4-a)/2]y (where R represents a cycloalkyl group, and R1 represents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one R1 in one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0 0; y>0; and x+y=1).
摘要翻译：含有一分子中含有至少一个含环氧基的有机基团的有机聚硅氧烷的可固化有机硅组合物的聚苯乙烯参考重均分子量至少为500，并由以下通式表示：（RSiO3 / 2） x [R1aSiO（4-a）/ 2] y（其中R表示环烷基，R1表示氢原子或一价有机基团，除了芳基和环烷基，一分子中至少一个R 1为含有环氧基的一价有机基团，其中观察到以下条件：0 0; y> 0; x + y = 1）。

4. 发明申请

US20090234078A1 Organotrisiloxane, Preparation And Use In Curable Resin Composition 审中-公开
标题翻译：有机硅氧烷，可固化树脂组合物的制备与应用
公开(公告)号：US20090234078A1
公开(公告)日：2009-09-17
申请号：US11908587
申请日：2006-03-15
申请人： Hiroshi Ueki , Minoru Isshiki , Yoshitsugu Morita , Tomoko Kato
发明人： Hiroshi Ueki , Minoru Isshiki , Yoshitsugu Morita , Tomoko Kato
IPC分类号： C08L83/06 , C07F7/06 , C08L63/00
CPC分类号： C07F7/0838
摘要： An organotrisiloxane represented by the following general formula (I), wherein R1 and R2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R1 or R2 is an aryl group, and R3 designates an organic group that contains a phenolic hydroxyl group, is a novel compound that possesses good reactivity and excellent compatibility and dispersibility with respect to the curable resins, such as epoxy resin.
摘要翻译：由以下通式（I）表示的有机三
氧硅烷，其中R 1和R 2可以相同或不同，并且表示不具有脂族不饱和键的任选取代的一价烃基，条件是R 1或R 2中的至少一个为芳基，R3表示含有酚性羟基的有机基，是具有良好的反应性，相对于环氧树脂等固化性树脂的相容性和分散性优异的新型化合物。

5. 发明申请

US20100213623A1 Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby 有权
标题翻译：制造半导体器件的方法和由此产生的半导体器件
公开(公告)号：US20100213623A1
公开(公告)日：2010-08-26
申请号：US12280248
申请日：2007-02-14
申请人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
发明人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： B29C43/18 , B29C43/50 , C08L83/06 , C08L83/14 , H01L21/565 , H01L23/293 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.
摘要翻译：一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将供入到模具和未密封的半导体器件之间的空间中的可固化的硅氧烷组合物压缩成型，将密封在固化的硅氧烷体中的方法进行压缩成型上述可固化硅氧烷组合物至少包含以下组分：（A）含环氧基的硅氧烷和（B）环氧树脂的固化剂; 可以减少半导体芯片和电路板翘曲，提高表面耐擦伤性。

6. 发明申请

US20090214870A1 Curable Silicone Composition And Electronic Device Produced Therefrom 审中-公开
标题翻译：可固化的硅酮组合物和电子装置
公开(公告)号：US20090214870A1
公开(公告)日：2009-08-27
申请号：US11908592
申请日：2006-03-15
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Tomoko Kato
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Tomoko Kato
IPC分类号： C08L83/06 , C08K3/22 , C08K3/08
CPC分类号： H01L23/3737 , C08G59/40 , C08L83/06 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/12044 , H01L2924/1301 , H01L2924/16152 , Y10T428/31511 , C08L83/00 , H01L2924/00 , H01L2224/0401
摘要： A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R2—(R12SiO)nR12Si—R2-A {wherein R1 represents the same or different optionally substituted univalent hydrocarbon groups that do not have unsaturated aliphatic bonds; R2 represents bivalent organic groups; A designates siloxane residual radicals represented by the following average unit formula: (XR12SiO1/2)a (SiO4/2)b (wherein R1 designates the previously mentioned group; X designates a single bond, hydrogen atom, the previously mentioned group that is designated by R1, an epoxy-containing alkyl group, or an alkoxysilylalkyl group; at least one X in one molecule is a single bond; at least two X's are epoxy-containing alkyl groups; “a” is a positive number, “b” is a positive number; and “a/b” is a positive number within the range of 0.2 to 4), and “n” is an integer which is equal to or greater than 1}; and (B) a curing agent for an epoxy resin, is characterized by excellent handlability and curability and that is suitable for curing into a cured body that has excellent flexibility and adhesive characteristics; to provide a highly reliable electronic device.
摘要翻译：一种可固化有机硅组合物，其包含：（A）由以下通式表示的二有机硅氧烷：A-R2-（R12SiO）nR12Si-R2-A {其中R1表示不具有不饱和脂肪键的相同或不同的任选取代的一价烃基 ; R2表示二价有机基团; A表示由以下平均单元式表示的硅氧烷残基：（XR12SiO1 / 2）a（SiO4 / 2）b（其中R1表示前述基团; X表示单键，氢原子，指定为前述的基团通过R 1，含环氧基的烷基或烷氧基甲硅烷基烷基;一个分子中的至少一个X是单键;至少两个X是含环氧基的烷基;“a”是正数，“b”是正数，“a / b”为0.2〜4的正数），“n”为1以上的整数。和（B）环氧树脂用固化剂，其特征在于优异的可处理性和固化性，并且适于固化成具有优异的柔性和粘合特性的固化体; 以提供高度可靠的电子设备。

7. 发明申请

US20090247681A1 Curable Silicone Composition And Cured Product Therefrom 失效
标题翻译：可固化硅胶组合物及其固化产品
公开(公告)号：US20090247681A1
公开(公告)日：2009-10-01
申请号：US11912631
申请日：2006-04-27
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki
IPC分类号： C08K3/08 , C08L83/04
CPC分类号： C08L83/06 , C08K3/08 , C08L83/04 , C09D183/06 , C08L83/00
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3 SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0≦a≦0.8, 0≦b≦0.8, 0.2≦c≦0.9, 0≦d
摘要翻译：一种可固化有机硅组合物，其包含：（A）由平均单元式表示的有机聚硅氧烷：（R 13 SiO 1/2）a（R 22 SiO 2/2）b（R 3 SiO 3/2）c（SiO 4/2）d（其中R 1，R 2 和R 3各自独立地选自取代或未取代的单价烃基和环氧官能的一价有机基团，条件是至少20摩尔％的R 3是芳基，a，b，c和d是满足 0 <= a <= 0.8,0 <= b <= 0.8,0.2 <= c <= 0.9,0 <= d <0.8，a + b + c + d = 1），并且具有至少两个上述环氧官能单价有机基团; （B）具有能够与环氧基反应的基团的化合物; （C）固化促进剂; 和（D）导热填料，具有优异的处理特性，并快速固化，得到高导热性，非常柔性，高粘合性和非常阻燃的固化产物。

8. 发明申请

US20070282058A1 Curing Silicone Composition and Cured Product Thereof 有权
标题翻译：固化硅酮组合物及其固化产物
公开(公告)号：US20070282058A1
公开(公告)日：2007-12-06
申请号：US10584655
申请日：2004-12-20
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
IPC分类号： C08L83/00 , C08G77/04
CPC分类号： C08L63/00 , C08G59/306 , C08G59/3254 , C08L83/06 , C08L83/00
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.
摘要翻译：一种可固化有机硅组合物，其包含：（A）具有支链分子结构并在一个分子中含有至少两个具有酚羟基的一价烃基的有机聚硅氧烷; （B）具有至少两个不含芳环的环氧基的单价羟基的直链有机聚硅氧烷; 和（C）固化促进剂。

9. 发明授权

US08802506B2 Method of manufacturing a semiconductor device and a semiconductor device produced thereby 有权
标题翻译：制造半导体器件的方法和由此制造的半导体器件
公开(公告)号：US08802506B2
公开(公告)日：2014-08-12
申请号：US12280248
申请日：2007-02-14
申请人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
发明人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
IPC分类号： H01L21/00
CPC分类号： B29C43/18 , B29C43/50 , C08L83/06 , C08L83/14 , H01L21/565 , H01L23/293 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.
摘要翻译：一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将供入到模具和未密封的半导体器件之间的空间中的可固化的硅氧烷组合物压缩成型，将密封在固化的硅氧烷体中的方法进行压缩成型上述可固化硅氧烷组合物至少包含以下组分：（A）含环氧基的硅氧烷和（B）环氧树脂的固化剂; 可以减少半导体芯片和电路板翘曲，提高表面耐擦伤性。

10. 发明授权

US08309652B2 Curable silicone composition and cured product therefrom 失效
标题翻译：可固化硅酮组合物及其固化产物
公开(公告)号：US08309652B2
公开(公告)日：2012-11-13
申请号：US11912631
申请日：2006-04-27
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki
IPC分类号： C08L83/04
CPC分类号： C08L83/06 , C08K3/08 , C08L83/04 , C09D183/06 , C08L83/00
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0≦a≦0.8, 0≦b≦0.8, 0.2≦c≦0.9, 0≦d
摘要翻译：一种可固化有机硅组合物，其包含：（A）由平均单元式表示的有机聚硅氧烷：（R 13 SiO 1/2）a（R 22 SiO 2/2）b（R 3 SiO 3/2）c（SiO 4/2）d（其中R 1，R 2，和R 3各自独立地选自取代或未取代的单价烃基和环氧官能的一价有机基团，条件是至少20摩尔％的R 3是芳基，a，b，c和d是满足0＆nlE的数 ; a＆nlE; 0.8,0和nlE; b＆nlE; 0.8,0.2＆nlE; c＆nlE; 0.9,0＆amp; nlE; d <0.8，a + b + c + d = 1），并且具有至少两个上述环氧官能单价有机每个分子中的基团; （B）具有能够与环氧基反应的基团的化合物; （C）固化促进剂; 和（D）导热填料，具有优异的处理特性，并快速固化，得到高导热性，非常柔性，高粘合性和非常阻燃的固化产物。

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