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    • 3. 发明申请
    • ORGANIC SILICON OXIDE FINE PARTICLE AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE
    • 有机硅氧化物微粒及其制备方法,多孔膜成膜组合物,多孔膜及其形成方法及半导体器件
    • US20090294922A1
    • 2009-12-03
    • US12472645
    • 2009-05-27
    • Yoshitaka HamadaFujio YagihashiTakeshi AsanoHideo NakagawaMasaru Sasago
    • Yoshitaka HamadaFujio YagihashiTakeshi AsanoHideo NakagawaMasaru Sasago
    • H01L23/58H01L21/47C07F7/08B32B9/00
    • H01L21/31695H01L21/02126H01L21/02203H01L21/02216H01L21/02282Y10T428/2995
    • Provided is an organic silicon oxide fine particle capable of satisfying an expected dielectric constant and mechanical strength and having excellent chemical stability for obtaining a high-performance porous insulating film. More specifically, provided is an organic silicon oxide fine particle comprising a core comprising an inorganic silicon oxide or a first organic silicon oxide containing an organic group having a carbon atom directly attached to a silicon atom and, and a shell on or above an outer circumference of the core, the shell comprising a second organic silicon oxide different from the first organic silicon oxide which the second organic silicon has been formed by hydrolysis and condensation, in the presence of a basic catalyst, of a shell-forming component comprising an organic-group-containing hydrolyzable silane containing an organic group having a carbon atom directly attached to a silicon atom or a mixture of the organic-group-containing hydrolyzable silane and an organic-group-free hydrolyzable silane not having the organic group, wherein a ratio [C]/[Si] is 0 or greater but less than 1 in the core and 1 or greater 1 in the shell wherein [C] represents the number of all the carbon atoms and [Si] represents the number of all the silicon atoms.
    • 提供一种能够满足预期介电常数和机械强度并且具有优异的化学稳定性以获得高性能多孔绝缘膜的有机氧化硅细颗粒。 更具体地说,提供了一种有机氧化硅微粒,其包括含有无机氧化硅或含有直接连接到硅原子的碳原子的有机基团的第一有机氧化硅的芯,以及在外周上或上方的壳 所述壳包含不同于所述第一有机氧化硅的第二有机氧化硅,所述第二有机氧化硅通过在碱性催化剂的存在下通过水解和缩合形成第二有机硅,所述成壳组分包含有机 - 含有具有与硅原子直接连接的碳原子的有机基团的含有基团的可水解硅烷或含有机基的可水解硅烷和不具有有机基团的可水解硅烷的混合物,其中[ C] / [Si]在核中为0以上且小于1,在壳中为1以上1,[C]表示全部碳原子数a nd [Si]表示所有硅原子的数目。