专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07243911B2 Substrate treating apparatus 有权
标题翻译：底物处理装置
公开(公告)号：US07243911B2
公开(公告)日：2007-07-17
申请号：US11043823
申请日：2005-01-26
申请人： Yoshitaka Abiko , Tomonori Kojimaru , Keiji Magara , Toshio Hiroe , Koji Hasegawa
发明人： Yoshitaka Abiko , Tomonori Kojimaru , Keiji Magara , Toshio Hiroe , Koji Hasegawa
IPC分类号： B01F3/04 , C23G1/02
CPC分类号： H01L21/67086 , B08B3/102 , B08B2203/005 , H01L21/67057 , Y10S134/902
摘要： A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating device for generating bubbles in the treating solution stored in the treating tank. The bubble generating device includes a plurality of cylindrical bodies extending in the one direction and arranged in a direction perpendicular to the one direction. Each of the cylindrical bodies is at least partly formed of a porous member extending in the one direction.
摘要翻译：用于进行基板的预定处理的基板处理装置包括：用于储存处理溶液的处理槽，用于保持处理槽内的沿一个方向布置的多个基板的保持器，以及用于在处理液中产生气泡的气泡产生装置储存在处理槽中。气泡产生装置包括在垂直于该一个方向的方向上沿一个方向延伸的多个圆柱体。每个圆柱体至少部分地由沿一个方向延伸的多孔构件形成。

2. 发明申请

US20050258085A1 Substrate treating apparatus 有权
标题翻译：底物处理装置
公开(公告)号：US20050258085A1
公开(公告)日：2005-11-24
申请号：US11121519
申请日：2005-05-04
申请人： Toshio Hiroe , Tadashi Maegawa , Yoshitaka Abiko , Akira Morita
发明人： Toshio Hiroe , Tadashi Maegawa , Yoshitaka Abiko , Akira Morita
IPC分类号： C02F1/00 , C02F1/32 , C02F1/38
CPC分类号： C02F1/325 , C02F1/004 , C02F1/38 , C02F2103/346 , C02F2201/3227 , Y10S134/902
摘要： A substrate treating apparatus for treating substrates having a film coating. The apparatus includes a treating unit for treating the substrates with a treating solution, a drain pipe for draining the treating solution from the treating unit, a filter mounted on the drain pipe, and an ultraviolet emitting unit for the filter for emitting ultraviolet light to the treating solution flowing through the filter.
摘要翻译：一种用于处理具有膜涂层的基板的基板处理装置。该设备包括用处理溶液处理基板的处理单元，用于从处理单元排出处理液的排水管，安装在排水管上的过滤器，以及用于向紫外线发射紫外线的紫外线发射单元处理溶液流过过滤器。

3. 发明申请

US20050161839A1 Substrate treating apparatus 有权
标题翻译：底物处理装置
公开(公告)号：US20050161839A1
公开(公告)日：2005-07-28
申请号：US11043823
申请日：2005-01-26
申请人： Yoshitaka Abiko , Tomonori Kojimaru , Keiji Magara , Toshio Hiroe , Koji Hasegawa
发明人： Yoshitaka Abiko , Tomonori Kojimaru , Keiji Magara , Toshio Hiroe , Koji Hasegawa
IPC分类号： B01F3/04 , B08B3/10 , H01L21/00
CPC分类号： H01L21/67086 , B08B3/102 , B08B2203/005 , H01L21/67057 , Y10S134/902
摘要： A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating device for generating bubbles in the treating solution stored in the treating tank. The bubble generating device includes a plurality of cylindrical bodies extending in the one direction and arranged in a direction perpendicular to the one direction. Each of the cylindrical bodies is at least partly formed of a porous member extending in the one direction.
摘要翻译：用于进行基板的预定处理的基板处理装置包括：用于储存处理溶液的处理槽，用于保持处理槽内的沿一个方向布置的多个基板的保持器，以及用于在处理液中产生气泡的气泡产生装置储存在处理槽中。气泡产生装置包括在垂直于该一个方向的方向上沿一个方向延伸的多个圆柱体。每个圆柱体至少部分地由沿一个方向延伸的多孔构件形成。

4. 发明授权

US07422681B2 Substrate treating apparatus 有权
标题翻译：底物处理装置
公开(公告)号：US07422681B2
公开(公告)日：2008-09-09
申请号：US11121519
申请日：2005-05-04
申请人： Toshio Hiroe , Tadashi Maegawa , Yoshitaka Abiko , Akira Morita
发明人： Toshio Hiroe , Tadashi Maegawa , Yoshitaka Abiko , Akira Morita
IPC分类号： B01J19/12 , B08B3/14
CPC分类号： C02F1/325 , C02F1/004 , C02F1/38 , C02F2103/346 , C02F2201/3227 , Y10S134/902
摘要： A substrate treating apparatus for treating substrates having a film coating. The apparatus includes a treating unit for treating the substrates with a treating solution, a drain pipe for draining the treating solution from the treating unit, a filter mounted on the drain pipe, and an ultraviolet emitting unit for the filter for emitting ultraviolet light to the treating solution flowing through the filter.
摘要翻译：一种用于处理具有膜涂层的基板的基板处理装置。该设备包括用处理溶液处理基板的处理单元，用于从处理单元排出处理液的排水管，安装在排水管上的过滤器，以及用于向紫外线发射紫外线的紫外线发射单元处理溶液流过过滤器。

5. 发明授权

US07541285B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07541285B2
公开(公告)日：2009-06-02
申请号：US11464622
申请日：2006-08-15
申请人： Yoshitaka Abiko , Toshio Hiroe
发明人： Yoshitaka Abiko , Toshio Hiroe
IPC分类号： H01L21/302
CPC分类号： H01L21/67028 , H01L21/67034 , H01L21/67057
摘要： A substrate processing apparatus performs a chemical solution process in a chemical solution process room that is partially formed within a chamber. During the chemical solution process, the substrate processing apparatus seals the chemical solution process room, and measures the pressure within the chemical solution process room, and controls the pressure within the chemical solution process room, based on a measured value. Irrespective of location environment of the substrate processing apparatus, the chemical solution process room can be controlled to a predetermined pressure. The substrate processing apparatus also permits efficient pressure control with respect to a minimum required amount of region.
摘要翻译：基板处理装置在室内部分地形成的化学溶液处理室中进行化学溶液处理。在化学溶液处理过程中，基板处理装置密封化学溶液处理室，测量化学溶液处理室内的压力，并根据测量值控制化学溶液处理室内的压力。不管衬底处理装置的位置环境如何，化学溶液处理室可以被控制到预定的压力。基板处理装置还允许相对于最小所需的区域量进行有效的压力控制。

6. 发明授权

US08957564B1 Microelectromechanical system megasonic transducer 有权
标题翻译：微机电系统兆声传感器
公开(公告)号：US08957564B1
公开(公告)日：2015-02-17
申请号：US13172514
申请日：2011-06-29
申请人： Toshio Hiroe , Zarem Harold , Alexander Payne , James Hunter
发明人： Toshio Hiroe , Zarem Harold , Alexander Payne , James Hunter
IPC分类号： H02N2/00 , B08B3/12
CPC分类号： B08B3/12 , B06B1/0292
摘要： Megasonic cleaning systems and methods of fabricating and using the same are provided. In one embodiment, the system comprises a plurality of Micro-Electromechanical System (MEMS) transducers, each transducer including a movable membrane with a membrane electrode coupled to a first potential disposed above and spaced apart from an upper surface of a die including a cavity electrode coupled to a second potential, the membrane including multiple layers including a polysilicon layer between a top silicon nitride layer and a bottom silicon nitride layer, and the membrane electrode includes the polysilicon layer; a chuck on which a target workpiece is positioned; and a fluid to couple sonic energy from the plurality of MEMS transducers to the target workpiece. Other embodiments are also provided.
摘要翻译：提供了超声波清洗系统及其制造和使用方法。在一个实施例中，系统包括多个微机电系统（MEMS）换能器，每个换能器包括具有耦合到第一电位的膜电极的可移动膜，所述膜电极设置在模具的上表面上方并与模具的上表面间隔开，所述模具的上表面包括腔电极耦合到第二电位，所述膜包括多层，包括顶部氮化硅层和底部氮化硅层之间的多晶硅层，并且所述膜电极包括所述多晶硅层; 目标工件所在的卡盘; 以及将来自多个MEMS换能器的声能耦合到目标工件的流体。还提供了其他实施例。

7. 发明授权

US07267128B2 Substrate treating apparatus 有权
标题翻译：底物处理装置
公开(公告)号：US07267128B2
公开(公告)日：2007-09-11
申请号：US10681450
申请日：2003-10-08
申请人： Toshio Hiroe , Koji Hasegawa , Ichiro Mitsuyoshi , Yoshihiro Nishina
发明人： Toshio Hiroe , Koji Hasegawa , Ichiro Mitsuyoshi , Yoshihiro Nishina
IPC分类号： B08B3/00
CPC分类号： H01L21/67265 , H01L21/67057
摘要： A substrate treating apparatus for treating substrates includes a treating tank for receiving and treating the substrates, a holding device movable, while holding the substrates in a cantilever mode, between a treating position in the treating tank and a transfer position above the treating tank, a transport device for supporting the substrates and transferring the substrates to and from the holding device in the transfer position, a detecting device for detecting a posture variation of the holding device, and a correcting device for correcting a position of the holding device or the transport device. The correcting device performs a correction according to the posture variation of the holding device detected by the detecting device in time of transfer of the substrates between the holding device and the transport device.
摘要翻译：用于处理基板的基板处理装置包括：用于接收和处理基板的处理槽;保持装置，可以在处理槽中的处理位置和处理槽上方的转移位置之间以悬臂模式保持基板; 传送装置，用于支撑基板并在保持装置的传送位置上传送基板;检测装置，用于检测保持装置的姿势变化;以及校正装置，用于校正保持装置或输送装置的位置。校正装置根据在保持装置和输送装置之间的基板的传送时由检测装置检测到的保持装置的姿势变化进行校正。

8. 发明授权

US07938129B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07938129B2
公开(公告)日：2011-05-10
申请号：US11672284
申请日：2007-02-07
申请人： Toshio Hiroe , Hiroaki Uchida
发明人： Toshio Hiroe , Hiroaki Uchida
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , H01L21/67017 , Y10S134/902
摘要： A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.
摘要翻译：本发明的基板处理装置是使用处理液对基板进行处理。基板处理装置包括与基板的第一表面相对设置的与第一表面相对的多个排出口和吸入口相对设置的第一侧板，第一侧处理液供给机构，处理液体到第一侧板中的排出口，以及第一侧抽吸机构，其吸入第一侧板中的吸入口的内部。

9. 发明申请

US20070277861A1 WAFER THINNING APPARATUS AND WAFER TREATING SYSTEM 审中-公开
标题翻译：吹风装置和水处理系统
公开(公告)号：US20070277861A1
公开(公告)日：2007-12-06
申请号：US11750620
申请日：2007-05-18
申请人： Toshio Hiroe , Kenichiro Arai
发明人： Toshio Hiroe , Kenichiro Arai
IPC分类号： B08B3/00 , C23F1/00
CPC分类号： H01L21/67086 , H01L21/67253 , H01L21/67276
摘要： A wafer thinning apparatus for treating wafers each having at least a circuit-forming surface thereof protected, by immersing the wafers in a treating solution. The apparatus includes a support table for receiving, as placed thereon, containers each containing a plurality of wafers in one of groups into which the wafers are sorted according to predetermined ranges of thickness, a treating tank for storing the treating solution and receiving the containers, a transport mechanism for transporting the containers between the support table and the treating tank, and a control unit for controlling the transport mechanism to transport the containers successively to the treating tank, and for changing an immersion time of the containers in the treating tank for each group.
摘要翻译：一种用于处理通过将晶片浸入处理溶液中的至少具有电路形成表面的晶片的晶片减薄装置被保护。该装置包括一个支撑台，用于接收放置在其上的容器，每个容器包含根据预定厚度范围分选晶片的组中的一组中的多个晶片，用于存储处理溶液并接收容器的处理槽，用于在支撑台和处理槽之间运送容器的运送机构，以及控制单元，用于控制运输机构将容器依次运送到处理槽，并且用于改变每个处理槽中的容器的浸渍时间组。

10. 发明申请

US20070240743A1 SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工设备
公开(公告)号：US20070240743A1
公开(公告)日：2007-10-18
申请号：US11672284
申请日：2007-02-07
申请人： Toshio Hiroe , Hiroaki Uchida
发明人： Toshio Hiroe , Hiroaki Uchida
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , H01L21/67017 , Y10S134/902
摘要： A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.
摘要翻译：本发明的基板处理装置是使用处理液对基板进行处理。基板处理装置包括与基板的第一表面相对设置的与第一表面相对的多个排出口和吸入口相对设置的第一侧板，第一侧处理液供给机构，处理液体到第一侧板中的排出口，以及第一侧抽吸机构，其吸入第一侧板中的吸入口的内部。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式