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1. 发明授权

US4332012A Control system for automotive vehicle component assembly lines 失效
标题翻译：汽车零部件装配线控制系统
公开(公告)号：US4332012A
公开(公告)日：1982-05-25
申请号：US96230
申请日：1979-11-20
申请人： Yoshitada Sekine , Hiroshi Imaizumi , Shoji Katagi , Kazunori Obata , Kazuyoshi Abe , Hisashi Shimizu
发明人： Yoshitada Sekine , Hiroshi Imaizumi , Shoji Katagi , Kazunori Obata , Kazuyoshi Abe , Hisashi Shimizu
IPC分类号： B23P21/00 , B62D65/00 , B62D65/02 , B62D65/18 , G05B19/12 , G05B19/418 , G06K7/10 , B07C3/14
CPC分类号： B62D65/02 , B62D65/18 , G05B19/128 , G05B19/4182 , G05B2219/23363 , Y02P90/04 , Y02P90/083 , Y02P90/10
摘要： Control of an automotive vehicle component assembling system having one or more series of assembly lines used in common for assembling various models, standards and/or specifications of vehicle component is provided by converting information and instructions relating to various models, standards and/or specifications of vehicle component into a sign. The sign is fitted onto one of the part of the component. Information and instructions from the sign are detected automatically to control picking up of parts and assembling operations in each assembly line.
摘要翻译：具有通常用于组装车辆部件的各种型号，标准和/或规格的一个或多个组合线的车辆部件组装系统的控制通过转换与各种型号，标准和/或规格有关的信息和指令来提供车辆部件成一个标志。符号被安装在部件的一部分上。自动检测符号的信息和指示，以控制零件的拾取和组装操作。

2. 发明申请

US20070099009A1 Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
标题翻译：用于密封光学元件的树脂组合物，其固化产物，以及密封半导体元件的方法
公开(公告)号：US20070099009A1
公开(公告)日：2007-05-03
申请号：US11586564
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04 , C08G77/08
CPC分类号： C08L83/04 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08J7/047 , C08J2483/00 , C08K5/0091 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, R2 to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0
摘要翻译：本发明提供了一种用于密封光学器件的组合物，该组合物可以形成具有优异的耐热性，耐紫外光性，光学透明性，韧性和粘附性的涂膜，并且还提供了该组合物的固化产物，以及密封方法使用组合。一种用于密封光学器件的树脂组合物，其包含：（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为： -formulae description =“In-line Formulas”end =“lead”？> R＆lt; 1＆lt;＆lt;＆gt;（OX）b 4-ab）/ 2 <？in-line-formula description =“In-line Formulas”end =“tail”？>（其中，R 1表示烷基，烯基基团或芳基; X表示由下式表示的基团的组合：R 1，R 2，R 3，R 4， O 2〜R 4为一价烃基），烷基，烯基，烷氧基烷基或酰基; a表示1.00〜1.5的数; b 表示满足0

3. 发明授权

US06259157B1 Hybrid integrated circuit device, and method of manufacturing thereof 有权
标题翻译：混合集成电路装置及其制造方法
公开(公告)号：US06259157B1
公开(公告)日：2001-07-10
申请号：US09188717
申请日：1998-11-10
申请人： Noriaki Sakamoto , Hidefumi Saito , Toshimichi Naruse , Hisashi Shimizu
发明人： Noriaki Sakamoto , Hidefumi Saito , Toshimichi Naruse , Hisashi Shimizu
IPC分类号： H01L2334
CPC分类号： H01L24/32 , H01L23/373 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L25/165 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/056 , H05K3/284 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A hybrid integrated circuit device comprising: a substrate having an insulated surface and superior thermal conductivity; conductor patterns provided on the substrate; an element mounted on the surface so as to connect with the conductor patterns through electrically connecting means; an outer read which is electrically connected to the conductor patterns and is extended to the outside; and a sealing member of thermoplastic resin so as to be molded and cover at least the surface of the substrate.
摘要翻译：一种混合集成电路器件，包括：具有绝缘表面和优异导热性的衬底; 设置在基板上的导体图案; 安装在表面上以通过电连接装置与导体图案连接的元件; 外部读取电连接到导体图案并延伸到外部; 以及热塑性树脂的密封构件，以便被模制并且至少覆盖基板的表面。

4. 发明授权

US5340851A Thermosetting resin compositions 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5340851A
公开(公告)日：1994-08-23
申请号：US17290
申请日：1993-02-12
申请人： Toshio Shiobara , Hisashi Shimizu , Minoru Takei
发明人： Toshio Shiobara , Hisashi Shimizu , Minoru Takei
IPC分类号： C08G59/00 , C08G59/40 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29
CPC分类号： H01L23/293 , C08G59/4042 , C08L63/00 , H01B3/40 , H01L2924/0002
摘要： A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.
摘要翻译：热固性树脂组合物包含（A）具有不含烯丙基的马来酰亚胺基的酰亚胺化合物和具有含烯丙基的酰亚胺基的酰亚胺化合物的混合物，（B）环氧树脂，（C）酚醛树脂，（D）芳族聚合物/有机聚硅氧烷共聚物。组分（B）和/或（C）包括含有与芳环共轭的双键的萘环的化合物。该组合物易于加工并且粘合性良好，并且可以改善机械强度，耐热水性，低热膨胀性和最小化吸水性的产品。

5. 发明授权

US5321299A Hybrid integrated circuit device 失效
标题翻译：混合集成电路装置
公开(公告)号：US5321299A
公开(公告)日：1994-06-14
申请号：US951348
申请日：1992-09-25
申请人： Katsumi Ohkawa , Hisashi Shimizu , Hirofumi Kikuchi
发明人： Katsumi Ohkawa , Hisashi Shimizu , Hirofumi Kikuchi
IPC分类号： H01L25/16 , H02M1/00 , H02M1/12 , H02M1/42 , H02M3/158 , H05K1/02 , H05K9/00 , H01L23/02
CPC分类号： H02M1/4225 , H01L25/16 , H02M1/12 , H02M3/158 , H05K1/0218 , H05K9/0039 , H01L2224/48091 , H01L2224/48227 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , Y02B70/126
摘要： Disclosed is a hybrid integrated circuit device provided with an active filter. The active filter is constructed mainly from a rectifier circuit, a reactor with one terminal connected with an output terminal of the rectifier, a switching element connected with one terminal of the reactor and a smoothing condenser connected with the other terminal of the reactor. The active filter is mounted on an insulating metal substrate and has, other than the above feature, a specific circuit structure wherein the substrate is divided by a ground pattern or power supply pattern into two blocks. One block is for a large current circuit such as the rectifier circuit, the switching element, and a diode and another block for a small signal circuit such as a control circuit. The hybrid integrated circuit device is of remarkably compact size. Also, it is greatly superior in a noise performance because switching noise does not flow into the chassis of electronic equipment from the metal substrate and the control circuit is shielded from the noise produced by the large current circuit, and also because the noise caused by wiring inductance can be limited.
摘要翻译：公开了一种具有有源滤波器的混合集成电路装置。有源滤波器主要由整流电路，一端与整流器的输出端连接的电抗器，与电抗器的一端连接的开关元件和与电抗器的另一端连接的平滑电容器构成。有源滤波器安装在绝缘金属基板上，并且除了上述特征之外，具有特定的电路结构，其中基板被接地图案或电源图案划分成两个块。一个块用于诸如整流器电路，开关元件和二极管之类的大电流电路，以及用于诸如控制电路的小信号电路的另一块。混合集成电路器件尺寸非常紧凑。此外，由于开关噪声不从金属基板流入电子设备的底盘，并且控制电路被大电流电路产生的噪声屏蔽，并且还因为布线引起的噪声，噪声性能非常优越电感可以受到限制。

6. 发明授权

US5306748A Fluorine-modified thermosetting resin and thermosetting resin composition 失效
标题翻译：氟改性热固性树脂和热固性树脂组合物
公开(公告)号：US5306748A
公开(公告)日：1994-04-26
申请号：US921251
申请日：1992-07-29
申请人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
发明人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
IPC分类号： C08G8/08 , C08G59/08 , C08G59/32 , C08L61/06 , C08L63/00 , C08G59/00 , C08G8/04 , C08G14/04
CPC分类号： C08L61/06 , C08G59/08 , C08G59/3218 , C08G59/3254 , C08G8/08 , C08L63/00
摘要： Fluorine-modified thermosetting reins are available as phenolic or epoxy resins having trifluoromethyl groups and a naphthalene skeleton in a molecule. They are useful as components of resin compositions or resin modifiers and cure to products having low water pickup, low coefficient of thermal expansion, and adhesion as well as heat resistance and mechanical strength. Thermosetting resin compositions having such a thermosetting resin blended therein are useful in semiconductor element packaging.
摘要翻译：氟改性的热固性榫头可以作为分子中具有三氟甲基和萘骨架的酚醛树脂或环氧树脂来获得。它们可用作树脂组合物或树脂改性剂的组分，并且固化成具有低吸水率，低热膨胀系数和粘合性以及耐热性和机械强度的产品。具有这样的热固性树脂的热固性树脂组合物可用于半导体元件封装。

7. 发明授权

US5173544A Epoxy resin compositions 失效
标题翻译：环氧树脂组合物
公开(公告)号：US5173544A
公开(公告)日：1992-12-22
申请号：US523814
申请日：1990-05-16
申请人： Hisashi Shimizu , Kazutoshi Tomiyoshi , Hatsuji Shiraishi , Toshio Shiobara
发明人： Hisashi Shimizu , Kazutoshi Tomiyoshi , Hatsuji Shiraishi , Toshio Shiobara
IPC分类号： C08G59/00 , C08G59/14 , C08G59/20 , C08G59/30 , C08G77/42 , C08L63/00
CPC分类号： C08G77/42 , C08L63/00
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.
摘要翻译：包含环氧树脂，固化剂和包含长链有机聚硅氧烷共聚物[I]和短链有机聚硅氧烷共聚物[II]的共聚物混合物的环氧树脂组合物，其各自通过含链烯基的公开了具有含有重量比[II]至[I]为0.3至0.6的侧基苯基的长链或短链有机聚硅氧烷的环氧树脂。环氧树脂组合物表现出优异的可印刷性，抗龟裂性和成型性。

8. 发明授权

US4389432A Method of improving adhesion and adhesion improvers used therefor 失效
标题翻译：改善附着力的方法和用于其的粘合改进剂
公开(公告)号：US4389432A
公开(公告)日：1983-06-21
申请号：US386230
申请日：1982-06-08
申请人： Yoshio Inoue , Hisashi Shimizu
发明人： Yoshio Inoue , Hisashi Shimizu
IPC分类号： C08J7/04 , B05D1/36 , B05D7/02 , B05D7/24 , C08L43/04 , C08L83/04 , C09D5/00 , C09D125/06 , C09D127/06 , C09D131/04 , C09D133/12 , C09D137/00 , C09D143/04 , C09J5/00 , C09J5/02 , C09J133/04 , C08L31/02
CPC分类号： B05D7/54 , C09D125/06 , C09D127/06 , C09D131/04 , C09D133/12 , C09D143/04 , C09D5/002 , B05D2518/10 , C08L43/04 , C08L83/04 , Y10T428/31663
摘要： The invention provides a novel means for solving the problem of poor adhesion between the surface of a substrate of a metal or a plastic resin, e.g. polycarbonate resin, and a cured coating film of an organopolysiloxane formed thereon to impart good surface properties, e.g. hardness and weathering resistance, to the substrate surface by use of an adhesion improver as a primer which comprises a copolymer of an organosilicon compound having a hydrolyzable group and an ethylenic unsaturation in the molecule, glycidyl methacrylate and an organic monomer, e.g. methyl methacrylate and vinyl acetate, a reaction product of an aminoalkyl-containing organosilane compound and an acid anhydride and, optionally, an ultra-violet light absorber in a limited proportion.
摘要翻译：本发明提供了解决金属或塑料树脂的基材表面之间的粘合性差的新颖方法，例如，聚碳酸酯树脂和其上形成的有机聚硅氧烷的固化涂膜以赋予良好的表面性质，例如。硬度和耐候性，通过使用粘合改进剂作为底漆，其包含分子中具有可水解基团和烯属不饱和键的有机硅化合物的共聚物，甲基丙烯酸缩水甘油酯和有机单体，例如，甲基丙烯酸甲酯和乙酸乙烯酯，含氨基烷基的有机硅烷化合物与酸酐的反应产物和任选的有限比例的紫外光吸收剂。

9. 发明授权

US07563854B2 Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof 有权
标题翻译：生产高分子量有机聚硅氧烷的方法，包含高分子量有机聚硅氧烷的组合物和用其固化产物密封的光学半导体器件
公开(公告)号：US07563854B2
公开(公告)日：2009-07-21
申请号：US11586525
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08G77/06
CPC分类号： C08G77/04 , C08G77/06 , C08G77/08 , C08G77/14 , Y10T428/31663
摘要： Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
摘要翻译：本发明提供一种聚苯乙烯换算重均分子量为5×10 4以上的高分子量有机聚硅氧烷的制造方法，其特征在于，包括使具有水解性基团的硅烷化合物进行第一次水解缩合而制造有机聚硅氧烷的工序，该有机聚硅氧烷再次进行水解和缩合。高分子量有机聚硅氧烷是稳定的，耐胶凝的，即使形成厚膜也能耐裂纹。包含高分子量有机聚硅氧烷和缩合催化剂的树脂组合物可用于密封光学元件并用于制造光学半导体器件。

10. 发明授权

US07550204B2 Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
标题翻译：用于密封光学元件的树脂组合物，其固化产物，以及密封半导体元件的方法
公开(公告)号：US07550204B2
公开(公告)日：2009-06-23
申请号：US11586564
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04 , C08G77/18
CPC分类号： C08L83/04 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08J7/047 , C08J2483/00 , C08K5/0091 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.
摘要翻译：本发明提供了一种用于密封光学装置的组合物，其包含（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为：<？in-line-formula description =“In- 线形式“end =”lead“→> R1a（OX）bSiO（4-ab）/ 2 <？in-line-formula description =”In-line Formulas“end =”tail“？>（其中，R1表示烷基，烯基或芳基; X表示由式-SiR 2 R 3 R 4表示的基团（其中，RE至R 4为一价烃基）和烷基，烯基，烷氧基烷基或酰基的组合; 表示在1.00〜1.5的范围内的数字; b表示满足0 b 2的数，a + b满足1.00 a + b 2），（ii）缩合催化剂，以及由固化组合物，以及密封半导体元件的方法，其包括施加组合物的步骤涉及半导体元件，以及固化已经施加到半导体元件上的组合物的步骤。该组合物可以形成表现出优异的耐热性，耐紫外线性，光学透明性，韧性和粘附性的涂膜。

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