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    • 9. 发明授权
    • Bonding method
    • 粘合方法
    • US07770781B2
    • 2010-08-10
    • US12223538
    • 2008-02-05
    • Yoshinori ShibataYoshinori IshikawaTeruyoshi Ichiyanagi
    • Yoshinori ShibataYoshinori IshikawaTeruyoshi Ichiyanagi
    • B23K31/02
    • B23K35/30H01L2224/29007H01L2224/29339H01L2224/83048H01L2224/8384H01L2924/00014
    • At a comparatively early stage, members to be bonded are pressurized together by an applied pressure that is a comparatively low pressure. Under an applied pressure condition (a gas venting process) of the comparatively low pressure, an organic protective film is vaporized by heating a bonding material, and a void portion of a porous structure that is formed by metal nanoparticles and a binder in the bonding material is not collapsed any more than necessary due to the applied pressure. Thus, the void portion of the porous structure functions as a degassing path for the gasified organic protective film, and the gas is smoothly released from between the members to be bonded. At the time point when the temperature of the bonding material has reached a predetermined temperature, the applied pressure is increased from the comparatively low pressure to a comparatively high pressure (a pressure increase process). Further, the bonding strength is increased by bonding the members to be bonded together by applying the comparatively high pressure (a bonding process).
    • 在比较早的阶段,待粘合的构件通过相对低的压力施加压力。 在相对较低压力的施加压力条件(排气过程)下,通过加热接合材料和在接合材料中由金属纳米颗粒和粘合剂形成的多孔结构的空隙部分,有机保护膜被蒸发 由于施加的压力,不会因为必要而折叠。 因此,多孔结构的空隙部分作为气化的有机保护膜的脱气路径起作用,并且气体从要结合的构件之间平滑地释放。 在接合材料的温度达到规定温度的时刻,施加的压力从较低的压力增加到比较高的压力(增压过程)。 此外,通过施加比较高的压力(接合工艺)将待接合的部件接合来增加接合强度。