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1. 发明授权

US09018319B2 Radical-curable hot-melt urethane resin composition and optical molded body 有权
标题翻译：可自由基固化的热熔聚氨酯树脂组合物和光学成型体
公开(公告)号：US09018319B2
公开(公告)日：2015-04-28
申请号：US13809266
申请日：2011-12-21
申请人： Yoshinori Kanagawa , Daichi Higuchi , Tamotsu Sakamoto
发明人： Yoshinori Kanagawa , Daichi Higuchi , Tamotsu Sakamoto
IPC分类号： C08L75/04 , C08G18/67 , C08G18/44 , C08G18/48 , C08G18/10 , C08G18/83 , C09J4/00 , C08G18/75 , C08G18/12 , C09D175/16 , C08F299/06
CPC分类号： C08G18/831 , C08F299/065 , C08G18/12 , C08G18/44 , C08G18/672 , C08G18/758 , C08G2170/20 , C09D175/16 , C09J4/00 , C08G18/664
摘要： A radical-curable hot-melt urethane resin composition includes 100 parts by mass of a hot-melt urethane (X) having a (meth)acryloyl group and 0.5 to 5.0 parts by mass of a radical polymerization initiator (Y), wherein the hot-melt urethane (X) is obtained by introducing, using a (meth)acrylate compound (D) having an active-hydrogen-containing group, a (meth)acryloyl group into a hot-melt urethane prepolymer (C) that has isocyanate groups at its terminals and is obtained by a reaction of a polyol (A) and an alicyclic polyisocyanate (B), the polyol (A) containing an aliphatic polycarbonate polyol (a1), an alicyclic polycarbonate polyol (a2), or an aliphatic polyether polyol (a3), in an amount of more than 50 mol % and 100 mol % or less of the total number of isocyanate groups of the urethane prepolymer (C).
摘要翻译：可自由基固化的热熔性聚氨酯树脂组合物包括100质量份具有（甲基）丙烯酰基的热熔聚氨酯（X）和0.5〜5.0质量份自由基聚合引发剂（Y），其中，热通过将具有含活性氢基团的（甲基）丙烯酸酯化合物（D），（甲基）丙烯酰基引入到具有异氰酸酯基的热熔性氨基甲酸酯预聚物（C）中而获得 - 聚氨酯（X）通过多元醇（A）和脂环族多异氰酸酯（B）的反应得到含有脂肪族聚碳酸酯多元醇（a1）的多元醇（A），脂环族聚碳酸酯多元醇（a2）或脂肪族聚醚多元醇（a3），氨基甲酸酯预聚物（C）的异氰酸酯基总数的50摩尔％以上且100摩尔％以下。

2. 发明授权

US09404017B2 Active-energy-ray-curable hot-melt urethane resin composition, member for electronic device, the member including the resin composition, and packing 有权
标题翻译：活性能量射线固化热熔聚氨酯树脂组合物，电子器件用构件，包含树脂组合物的构件和填料
公开(公告)号：US09404017B2
公开(公告)日：2016-08-02
申请号：US13704450
申请日：2011-08-03
申请人： Yoshinori Kanagawa , Daichi Higuchi , Tamotsu Sakamoto
发明人： Yoshinori Kanagawa , Daichi Higuchi , Tamotsu Sakamoto
IPC分类号： C09D175/04 , F16J15/14 , C08F299/06 , C08G18/48 , C08G18/67 , C08G18/76 , C08G18/40 , C08G18/42 , C09J175/16
CPC分类号： C09D175/04 , C08F299/06 , C08G18/4018 , C08G18/4211 , C08G18/4854 , C08G18/672 , C08G18/7642 , C08G2170/20 , C09J175/16 , F16J15/14 , C08G18/40
摘要： An active-energy-ray-curable hot-melt urethane resin composition contains a hot-melt urethane and an active energy ray polymerization initiator, the hot-melt urethane being obtained by converting more than 50% and 100% or less of the total number of isocyanate groups in an isocyanate group-terminated urethane prepolymer into terminal (meth)acryloyl groups by a reaction with hydroxyl groups in a reactive functional group-containing (meth)acrylic compound, the isocyanate group-terminated urethane prepolymer being obtained by reacting a polyisocyanate component with a polyol component that contains an aromatic polyester polyol containing a 2,2-dimethyl-1,3-propylene structure in its molecule in an amount of 90% by mole or more of a glycol component and a polyol other than the aromatic polyester polyol. The hot-melt urethane resin composition has excellent properties such as hot melting, rapid curability, a shape-retaining property after being applied, flexibility, durability, a property of adhering to a base, a low outgas property, mechanical strength, and flame retardancy.
摘要翻译：活性能量射线固化热熔聚氨酯树脂组合物含有热熔聚氨酯和活性能量射线聚合引发剂，该热熔聚氨酯通过将总数转换为50％以上100％以下异氰酸酯基封端的氨基甲酸酯预聚物通过与含反应性官能团的（甲基）丙烯酸化合物中的羟基反应而与异氰酸酯基封端的氨基甲酸酯预聚物中的异氰酸酯基封端的氨基甲酸酯预聚物反应成末端（甲基）丙烯酰基，组分与含有分子中含有2,2-二甲基-1,3-亚丙基结构的芳族聚酯多元醇的多元醇组分的量为90摩尔％以上的二醇组分和芳族聚酯以外的多元醇多元醇。热熔性聚氨酯树脂组合物具有热熔融，快速固化性，施加后的形状保持性，柔软性，耐久性，粘附于基体的特性，低排气性，机械强度和阻燃性等优异的性能。

3. 发明申请

US20140303330A1 RADICAL-CURABLE HOT-MELT URETHANE RESIN COMPOSITION AND OPTICAL MOLDED BODY 有权
标题翻译：光固化热熔凝胶组合物和光塑体
公开(公告)号：US20140303330A1
公开(公告)日：2014-10-09
申请号：US13809266
申请日：2011-12-21
申请人： Yoshinori Kanagawa , Daichi Higuchi , Tamotsu Sakamoto
发明人： Yoshinori Kanagawa , Daichi Higuchi , Tamotsu Sakamoto
IPC分类号： C08G18/83
CPC分类号： C08G18/831 , C08F299/065 , C08G18/12 , C08G18/44 , C08G18/672 , C08G18/758 , C08G2170/20 , C09D175/16 , C09J4/00 , C08G18/664
摘要： A radical-curable hot-melt urethane resin composition includes 100 parts by mass of a hot-melt urethane (X) having a (meth)acryloyl group and 0.5 to 5.0 parts by mass of a radical polymerization initiator (Y), wherein the hot-melt urethane (X) is obtained by introducing, using a (meth)acrylate compound (D) having an active-hydrogen-containing group, a (meth)acryloyl group into a hot-melt urethane prepolymer (C) that has isocyanate groups at its terminals and is obtained by a reaction of a polyol (A) and an alicyclic polyisocyanate (B), the polyol (A) containing an aliphatic polycarbonate polyol (a1), an alicyclic polycarbonate polyol (a2), or an aliphatic polyether polyol (a3), in an amount of more than 50 mol % and 100 mol % or less of the total number of isocyanate groups of the urethane prepolymer (C).
摘要翻译：可自由基固化的热熔性聚氨酯树脂组合物包括100质量份具有（甲基）丙烯酰基的热熔聚氨酯（X）和0.5〜5.0质量份自由基聚合引发剂（Y），其中，热通过将具有含活性氢基团的（甲基）丙烯酸酯化合物（D），（甲基）丙烯酰基引入到具有异氰酸酯基的热熔性氨基甲酸酯预聚物（C）中而获得 - 聚氨酯（X）通过多元醇（A）和脂环族多异氰酸酯（B）的反应得到含有脂肪族聚碳酸酯多元醇（a1）的多元醇（A），脂环族聚碳酸酯多元醇（a2）或脂肪族聚醚多元醇（a3），氨基甲酸酯预聚物（C）的异氰酸酯基总数的50摩尔％以上且100摩尔％以下。

4. 发明申请

US20130158149A1 ACTIVE-ENERGY-RAY-CURABLE HOT-MELT URETHANE RESIN COMPOSITION, MEMBER FOR ELECTRONIC DEVICE, THE MEMBER INCLUDING THE RESIN COMPOSITION, AND PACKING 有权
标题翻译：活性能量可固化的热熔凝胶组合物，电子器件的成员，包括树脂组合物的成员和包装
公开(公告)号：US20130158149A1
公开(公告)日：2013-06-20
申请号：US13704450
申请日：2011-08-03
申请人： Yoshinori Kanagawa , Daichi Higuchi , Tamotsu Sakamoto
发明人： Yoshinori Kanagawa , Daichi Higuchi , Tamotsu Sakamoto
IPC分类号： C09D175/04
CPC分类号： C09D175/04 , C08F299/06 , C08G18/4018 , C08G18/4211 , C08G18/4854 , C08G18/672 , C08G18/7642 , C08G2170/20 , C09J175/16 , F16J15/14 , C08G18/40
摘要： An active-energy-ray-curable hot-melt urethane resin composition contains a hot-melt urethane and an active energy ray polymerization initiator, the hot-melt urethane being obtained by converting more than 50% and 100% or less of the total number of isocyanate groups in an isocyanate group-terminated urethane prepolymer into terminal (meth)acryloyl groups by a reaction with hydroxyl groups in a reactive functional group-containing (meth)acrylic compound, the isocyanate group-terminated urethane prepolymer being obtained by reacting a polyisocyanate component with a polyol component that contains an aromatic polyester polyol containing a 2,2-dimethyl-1,3-propylene structure in its molecule in an amount of 90% by mole or more of a glycol component and a polyol other than the aromatic polyester polyol. The hot-melt urethane resin composition has excellent properties such as hot melting, rapid curability, a shape-retaining property after being applied, flexibility, durability, a property of adhering to a base, a low outgas property, mechanical strength, and flame retardancy.
摘要翻译：活性能量射线固化热熔聚氨酯树脂组合物含有热熔聚氨酯和活性能量射线聚合引发剂，该热熔聚氨酯通过将总数转换为50％以上100％以下异氰酸酯基封端的氨基甲酸酯预聚物通过与含反应性官能团的（甲基）丙烯酸化合物中的羟基反应而与异氰酸酯基封端的氨基甲酸酯预聚物中的异氰酸酯基封端的氨基甲酸酯预聚物反应成末端（甲基）丙烯酰基，组分与含有分子中含有2,2-二甲基-1,3-亚丙基结构的芳族聚酯多元醇的多元醇组分的量为90摩尔％以上的二醇组分和芳族聚酯以外的多元醇多元醇。热熔性聚氨酯树脂组合物具有热熔融，快速固化性，施加后的形状保持性，柔软性，耐久性，粘附于基体的特性，低排气性，机械强度和阻燃性等优异的性能。

5. 发明授权

US08066550B2 Wafer polishing method and apparatus 有权
标题翻译：晶圆抛光方法及装置
公开(公告)号：US08066550B2
公开(公告)日：2011-11-29
申请号：US12337145
申请日：2008-12-17
申请人： Daichi Higuchi , Kazuma Tanaka
发明人： Daichi Higuchi , Kazuma Tanaka
IPC分类号： B24B1/00
CPC分类号： B24B9/065
摘要： A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished. Finally, the polishing unit is lowered to make the lower surface of the polishing member into pressure contact with the peripheral portion of the wafer, thus polishing only the peripheral portion.
摘要翻译：一种晶片抛光方法，其中抛光构件的外周边缘首先被固定到台座上的切割工具切割，从而将抛光构件形成为完全圆形，并且将抛光构件沿Y方向定位在表格的Y方向参考位置。此后，抛光单元在桌面保持静止在基准位置的状态下一次抬起。此后，台架沿着Y方向水平移动，从而将抛光部件定位在Y方向上，使得只有晶片的周边部分被抛光部件抛光。此时，预先从切削工具与夹持台上的晶片之间的Y方向的位置关系和待抛光的周边部的宽度获得台座的水平行程。最后，抛光单元被降低以使抛光构件的下表面与晶片的周边部分压力接触，从而只抛光周边部分。

6. 发明申请

US20090176444A1 WAFER POLISHING METHOD AND APPARATUS 有权
标题翻译：波浪抛光方法和装置
公开(公告)号：US20090176444A1
公开(公告)日：2009-07-09
申请号：US12337145
申请日：2008-12-17
申请人： Daichi Higuchi , Kazuma Tanaka
发明人： Daichi Higuchi , Kazuma Tanaka
IPC分类号： B24B9/06 , B24B53/00
CPC分类号： B24B9/065
摘要： A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished. Finally, the polishing unit is lowered to make the lower surface of the polishing member into pressure contact with the peripheral portion of the wafer, thus polishing only the peripheral portion.
摘要翻译：一种晶片抛光方法，其中抛光构件的外周边缘首先被固定到台座上的切割工具切割，从而将抛光构件形成为完全圆形，并且将抛光构件沿Y方向定位在表格的Y方向参考位置。此后，抛光单元在桌面保持静止在基准位置的状态下一次抬起。此后，台架沿着Y方向水平移动，从而将抛光部件定位在Y方向上，使得只有晶片的周边部分被抛光部件抛光。此时，预先从切削工具与夹持台上的晶片之间的Y方向的位置关系和待抛光的周边部的宽度获得台座的水平行程。最后，抛光单元被降低以使抛光构件的下表面与晶片的周边部分压力接触，从而只抛光周边部分。

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