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1. 发明授权

US09097833B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US09097833B2
公开(公告)日：2015-08-04
申请号：US13373095
申请日：2011-11-04
申请人： Yoshinobu Suehiro , Koji Tasumi , Osamu Ito
发明人： Yoshinobu Suehiro , Koji Tasumi , Osamu Ito
IPC分类号： F21V3/00 , F21V8/00 , F21V29/76 , F21Y103/00
CPC分类号： G02B6/0085 , F21V29/76 , F21Y2103/10 , F21Y2115/10 , G02B6/0021 , G02B6/0031 , G02B6/0078 , H01L2224/14 , H01L2224/16225 , H01L2924/181 , H01L2924/00012
摘要： A light emitting device includes a light source including an inorganic material substrate, a light emitting element mounted on a mounting surface of the inorganic material substrate, and a metalized pattern formed on a non-mounting surface of the inorganic material substrate on which the light emitting element is not mounted, a mounting substrate including an mounting surface on which the light source is mounted, and a conductor pattern formed on the mounting surface and bonded to the metalized pattern, and an optical member disposed on the mounting surface of the mounting substrate so as to guide a light emitted from the light source in a predetermined direction. The optical member includes a heat absorbing surface at least a part of which faces the conductor pattern of the mounting substrate, and a heat radiating surface that radiates heat of the light source conducted from the conductor pattern via the heat absorbing surface.
摘要翻译：发光装置包括：光源，其包括无机材料基板，安装在无机材料基板的安装面上的发光元件和形成在无机材料基板的非安装面上的金属化图案，元件没有安装，安装基板包括其上安装有光源的安装表面和形成在安装表面上并结合到金属化图案的导体图案，以及设置在安装基板的安装表面上的光学构件，以引导从光源发射的光沿预定方向。光学构件包括至少一部分面向安装基板的导体图案的吸热表面，以及散热表面，其辐射从导体图案经由吸热表面传导的光源的热量。

2. 发明申请

US20120250329A1 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US20120250329A1
公开(公告)日：2012-10-04
申请号：US13373095
申请日：2011-11-04
申请人： Yoshinobu Suehiro , Koji Tasumi , Osamu Ito
发明人： Yoshinobu Suehiro , Koji Tasumi , Osamu Ito
IPC分类号： F21V29/00
CPC分类号： G02B6/0085 , F21V29/76 , F21Y2103/10 , F21Y2115/10 , G02B6/0021 , G02B6/0031 , G02B6/0078 , H01L2224/14 , H01L2224/16225 , H01L2924/181 , H01L2924/00012
摘要： A light emitting device includes a light source including an inorganic material substrate, a light emitting element mounted on a mounting surface of the inorganic material substrate, and a metalized pattern formed on a non-mounting surface of the inorganic material substrate on which the light emitting element is not mounted, a mounting substrate including an mounting surface on which the light source is mounted, and a conductor pattern formed on the mounting surface and bonded to the metalized pattern, and an optical member disposed on the mounting surface of the mounting substrate so as to guide a light emitted from the light source in a predetermined direction. The optical member includes a heat absorbing surface at least a part of which faces the conductor pattern of the mounting substrate, and a heat radiating surface that radiates heat of the light source conducted from the conductor pattern via the heat absorbing surface.
摘要翻译：发光装置包括：光源，其包括无机材料基板，安装在无机材料基板的安装面上的发光元件和形成在无机材料基板的非安装面上的金属化图案，元件没有安装，安装基板包括其上安装有光源的安装表面和形成在安装表面上并结合到金属化图案的导体图案，以及设置在安装基板的安装表面上的光学构件，以引导从光源发射的光沿预定方向。光学构件包括至少一部分面向安装基板的导体图案的吸热表面，以及散热表面，其辐射从导体图案经由吸热表面传导的光源的热量。

3. 发明授权

US07999398B2 Solid state device 有权
标题翻译：固态设备
公开(公告)号：US07999398B2
公开(公告)日：2011-08-16
申请号：US11882601
申请日：2007-08-02
申请人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
发明人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
IPC分类号： H01L23/28
CPC分类号： H01L33/56 , C03C3/066 , H01L24/17 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2924/00014 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a B2O3—SiO2—Li2O—Na2O—ZnO—Nb2O5 based glass, which is composed of 21 wt % to 23 wt % of B2O3, 11 wt % to 13 wt % of SiO2, 1 wt % to 1.5 wt % of Li2O, and 2 wt % to 2.5 wt % of Na2O.
摘要翻译：固体装置具有固态成分，将固态成分安装在其上用于从固态成分接收/供给电力的电力接收供给部和密封固体成分的玻璃密封部。玻璃密封部由B 2 O 3 -SiO 2 -Li 2 O-Na 2 O-ZnO-Nb 2 O 5基玻璃形成，该玻璃由21重量％〜23重量％的B 2 O 3，11重量％〜13重量％的SiO 2，1重量％〜 1.5重量％的Li 2 O和2重量％至2.5重量％的Na 2 O.

4. 发明申请

US20090086479A1 Light source unit 有权
标题翻译：光源单元
公开(公告)号：US20090086479A1
公开(公告)日：2009-04-02
申请号：US12232760
申请日：2008-09-23
申请人： Yoshinobu Suehiro , Koji Tasumi , Kazue Tagata
发明人： Yoshinobu Suehiro , Koji Tasumi , Kazue Tagata
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21K9/00 , F21V29/767 , F21V29/83 , H01L2224/16225 , Y10S362/80
摘要： A light source unit includes a light source portion including an LED element, a heat radiation portion that is connected to the light source portion, a case including an outside wall that is disposed apart from the light source portion and the heat radiation portion, and a spring member that is disposed between the outside wall of the case and the heat radiation portion.
摘要翻译：光源单元包括：包括LED元件的光源部分，连接到光源部分的散热部分，包括与光源部分和散热部分隔开的外壁的壳体;以及弹簧构件设置在壳体的外壁和散热部之间。

5. 发明授权

US09653661B2 Light-emitting device, method of manufacturing the same, method of mounting the same and lighting device 有权
公开(公告)号：US09653661B2
公开(公告)日：2017-05-16
申请号：US12926253
申请日：2010-11-04
申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
发明人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
IPC分类号： H01L21/603 , H01L33/56 , H01L33/54 , H01L23/00 , H01L25/075 , H01L33/48
CPC分类号： H01L33/56 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L33/54 , H01L2224/16225 , H01L2924/01322 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2933/005 , H01L2924/00
摘要： A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.

6. 发明授权

US09640730B2 Light emitting device 有权
公开(公告)号：US09640730B2
公开(公告)日：2017-05-02
申请号：US13550510
申请日：2012-07-16
申请人： Yoshinobu Suehiro , Koji Tasumi
发明人： Yoshinobu Suehiro , Koji Tasumi
IPC分类号： H01L33/52 , H01L33/50 , H01L33/46
CPC分类号： H01L33/46 , H01L33/507 , H01L2224/16225 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： A light emitting device, comprises an element mounting substrate with a circuit pattern at least on an element mounting surface of the element mounting substrate, a light emitting element mounted on the element mounting surface of the element mounting substrate and connected with the circuit pattern, a sealing member that seals the light emitting element and is bonded on the element mounting surface, and a coating layer that covers the element mounting side of the element mounting substrate inside the sealing member, wherein the coating layer has its refractive index smaller than that of the sealing member.

7. 发明申请

US20130033870A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20130033870A1
公开(公告)日：2013-02-07
申请号：US13550510
申请日：2012-07-16
申请人： Yoshinobu Suehiro , Koji Tasumi
发明人： Yoshinobu Suehiro , Koji Tasumi
IPC分类号： F21V31/00 , F21V13/02 , F21V5/00
CPC分类号： H01L33/46 , H01L33/507 , H01L2224/16225 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： A light emitting device, comprises an element mounting substrate with a circuit pattern at least on an element mounting surface of the element mounting substrate, a light emitting element mounted on the element mounting surface of the element mounting substrate and connected with the circuit pattern, a sealing member that seals the light emitting element and is bonded on the element mounting surface, and a coating layer that covers the element mounting side of the element mounting substrate inside the sealing member, wherein the coating layer has its refractive index smaller than that of the sealing member.
摘要翻译：一种发光器件，包括至少在元件安装基板的元件安装表面上具有电路图案的元件安装基板，安装在元件安装基板的元件安装表面上并与电路图案连接的发光元件，密封构件，其密封所述发光元件并且接合在所述元件安装表面上;以及涂层，其覆盖所述密封构件内的所述元件安装基板的元件安装侧，其中所述涂层的折射率小于密封件。

8. 发明申请

US20070064131A1 Solid-state element device and light-emitting apparatus using same 有权
标题翻译：固态元件器件和使用其的发光装置
公开(公告)号：US20070064131A1
公开(公告)日：2007-03-22
申请号：US11517588
申请日：2006-09-08
申请人： Naruhito Sawanobori , Masaaki Ohtsuka , Kazuya Aida , Hiroko Sakaji , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro , Koji Tasumi
发明人： Naruhito Sawanobori , Masaaki Ohtsuka , Kazuya Aida , Hiroko Sakaji , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro , Koji Tasumi
IPC分类号： H04N5/335
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/60 , H01L2224/16225
摘要： A solid-state element device having: a solid-state element; a power receiving/supplying portion for mounting thereto the solid-state element, and receiving/supplying a power from/to the solid-state element; and a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of the power receiving/supplying portion for sealing the solid-state element, the phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.
摘要翻译：一种具有固态元件的固态元件器件; 用于安装固体元件的电力接收/供应部分，以及从固态元件接收/供给电力的装置; 以及波长转换部分，其具有形成在具有与用于密封固态元件的受电/供应部分相同的热膨胀系数的密封玻璃内的荧光体层，所述荧光体层通过将玻璃和荧光体相互融合，融化玻璃。

9. 发明申请

US20060049335A1 Solid state device and light-emitting element 有权
标题翻译：固态器件和发光元件
公开(公告)号：US20060049335A1
公开(公告)日：2006-03-09
申请号：US11220405
申请日：2005-09-07
申请人： Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
发明人： Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
IPC分类号： H01L31/00
CPC分类号： H01L31/0203 , H01L23/3121 , H01L33/08 , H01L33/38 , H01L33/486 , H01L33/56 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
摘要翻译：一种固态器件，具有：倒装芯片安装的固态元件; 电源接收/馈送部分，具有安装基板，以允许固态元件的安装表面与安装基板的表面形成大致相同的平面; 以及由无机密封材料制成的无机密封部分，该无机密封材料的热膨胀系数等于用于密封固态元件的电力接收/供给部分的热膨胀系数。

10. 发明授权

US08309969B2 Light emitting device and method of making same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US08309969B2
公开(公告)日：2012-11-13
申请号：US12623135
申请日：2009-11-20
申请人： Yoshinobu Suehiro , Koji Tasumi
发明人： Yoshinobu Suehiro , Koji Tasumi
IPC分类号： H01L27/15 , H01L29/26 , H01L31/12 , H01L33/00
CPC分类号： H05K1/021 , F21K9/00 , F21K9/232 , F21K9/90 , F21V5/043 , F21V7/005 , F21V29/505 , F21V29/70 , F21V29/75 , F21V29/763 , F21V29/767 , F21Y2103/10 , F21Y2115/10 , G02B6/0068 , G02B6/0085 , H01L33/642 , H01L2224/48091 , H01L2924/01019 , H01L2924/09701 , H05K3/341 , H05K2201/0347 , H05K2201/0373 , H05K2201/10106 , H05K2201/10969 , H01L2924/00014
摘要： A light emitting device includes a light-emitting portion including a metal part including a metal able to be bonded to a solder material, and a heat dissipation member that includes aluminum, aluminum alloy, magnesium or magnesium alloy and a bonding portion processed to be bonded to the solder material. The metal part of the light-emitting portion is bonded via the solder material to the bonding portion of the heat dissipation member. The solder material includes a material unable to be directly bonded to the heat dissipation member, the metal part of the light-emitting portion is formed by metalizing an insulation of ceramic or semiconductor, and the bonding portion includes a thermal expansion coefficient between that of the heat dissipation member and that of the insulation.
摘要翻译：发光装置包括：发光部，其包括具有能够与焊料接合的金属的金属部，以及包含铝，铝合金，镁或镁合金的散热构件和加工成粘合的接合部焊接材料。发光部的金属部通过焊料粘合到散热部件的接合部。焊料材料包括不能直接接合到散热构件的材料，发光部分的金属部分通过金属化陶瓷或半导体的绝缘体而形成，并且接合部分包括热膨胀系数散热构件和隔热构件。

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