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    • 5. 发明授权
    • Semiconductor device
    • 半导体器件
    • US09035370B2
    • 2015-05-19
    • US13415010
    • 2012-03-08
    • Yoshiko KatoHiroyuki Kutsukake
    • Yoshiko KatoHiroyuki Kutsukake
    • H01L29/788H01L27/115
    • H01L27/11558H01L27/11531
    • A semiconductor device, includes: a semiconductor substrate; a first conductivity type well and a second conductivity type well; a first active area; a second active area; a first well contact layer; a plurality of first source/drain layers; a first gate insulating film; a first gate electrode; a second well contact layer; a plurality of second source/drain layers; a second gate insulating film; and a second gate electrode. The first well contact layer is formed in the first active area at one end part in the one direction. The one end parts in each of the first active areas and in each of the second active areas are mutually on the same side.
    • 一种半导体器件,包括:半导体衬底; 第一导电类型井和第二导电类型井; 第一个活跃区域; 第二个活跃区域; 第一阱接触层; 多个第一源极/漏极层; 第一栅极绝缘膜; 第一栅电极; 第二阱接触层; 多个第二源极/漏极层; 第二栅绝缘膜; 和第二栅电极。 第一阱接触层在一个方向上的一个端部的第一有源区域中形成。 第一有效区域和第二有源区域中的每一个中的一端部分彼此相同。
    • 6. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08698204B2
    • 2014-04-15
    • US13226763
    • 2011-09-07
    • Hiroyuki KutsukakeYoshiko Kato
    • Hiroyuki KutsukakeYoshiko Kato
    • H01L27/118H01L27/108H01L29/76H01L23/52H01L23/48H01L23/40
    • H01L27/11524H01L27/11519H01L2924/0002H01L2924/00
    • In one embodiment, a semiconductor memory device includes a substrate, and device regions in the substrate to extend in a first direction. The device further includes select gates on the substrate to extend in a second direction, and a contact region provided between the select gates and including contact plugs on the respective device regions. The contact region includes partial regions, in each of which N contact plugs are disposed on N successive device regions to be arranged on a straight line being non-parallel to the first and second directions, where N is an integer of 2 or more. The contact region includes the partial regions of at least two types whose values of N are different. Further, each of the contact plugs has a planar shape of an ellipse, and is arranged so that a major axis of the ellipse is tilted with respect to the first direction.
    • 在一个实施例中,半导体存储器件包括衬底以及衬底中沿第一方向延伸的器件区域。 该装置还包括在基板上沿第二方向延伸的选择栅极以及设置在选择栅极之间并包括各个器件区域上的接触插塞的接触区域。 接触区域包括部分区域,其中每个N个接触插塞设置在N个连续的器件区域上,以布置在不平行于第一和第二方向的直线上,其中N是2或更大的整数。 接触区域包括N值不同的至少两种类型的部分区域。 此外,每个接触插塞具有椭圆形的平面形状,并且被布置成使得椭圆的长轴相对于第一方向倾斜。
    • 7. 发明授权
    • Semiconductor device and method for manufacturing semiconductor device
    • 半导体装置及半导体装置的制造方法
    • US08232608B2
    • 2012-07-31
    • US12501726
    • 2009-07-13
    • Yoshiko KatoHiroyuki Kutsukake
    • Yoshiko KatoHiroyuki Kutsukake
    • H01L27/088
    • H01L21/823481H01L21/823462H01L27/088
    • A semiconductor device with a high-voltage transistor and a low-voltage transistor includes an isolation insulating film between a first element region of the high-voltage transistor and a second element region of the low-voltage transistor, a first gate insulating film on a semiconductor substrate in the first element region, a first gate electrode on the first gate insulating film, a second gate insulating film on the semiconductor substrate in the second element region, and a second gate electrode on the second gate insulating film. The isolation insulating film includes a first isolation region adjacent to a surrounding area of the first element region and a second isolation region adjacent to a surrounding area of the second element region. A bottom of the second isolation region is lower than a bottom of the first isolation region. The first gate insulating film is thicker than the second gate insulating film.
    • 具有高压晶体管和低压晶体管的半导体器件包括在高压晶体管的第一元件区域和低压晶体管的第二元件区域之间的隔离绝缘膜,第一栅极绝缘膜 第一元件区域中的半导体衬底,第一栅极绝缘膜上的第一栅极电极,第二元件区域中的半导体衬底上的第二栅极绝缘膜,以及第二栅极绝缘膜上的第二栅极电极。 隔离绝缘膜包括与第一元件区域的周围区域相邻的第一隔离区域和与第二元件区域的周围区域相邻的第二隔离区域。 第二隔离区域的底部低于第一隔离区域的底部。 第一栅极绝缘膜比第二栅极绝缘膜厚。
    • 8. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20120007192A1
    • 2012-01-12
    • US12952637
    • 2010-11-23
    • Yoshiko KatoHiroyuki KutsukakeMasayuki Ichige
    • Yoshiko KatoHiroyuki KutsukakeMasayuki Ichige
    • H01L27/105
    • H01L27/11521H01L27/11519
    • According to one embodiment, a semiconductor memory device includes a plurality of memory cell blocks, a plurality of first wirings, a plurality of second wirings, and a contact. Each of the memory cell blocks includes a plurality of memory cell units. Each of the plurality of memory cell units includes a plurality of memory cells and is provided in a first direction at a prescribed spacing. The plurality of memory cell blocks is arranged in a second direction intersecting with the first direction. The plurality of first wirings extends in the second direction and is provided in the first direction at a prescribed spacing. The plurality of second wirings is provided at least one of above and below the first wiring. The contact is provided at both end portions of the second wiring in the second direction and connects the first wiring to the second wiring. A width dimension of the second wiring along the first direction is larger than a width dimension of the first wiring along the first direction.
    • 根据一个实施例,半导体存储器件包括多个存储器单元块,多个第一布线,多个第二布线和一个触点。 每个存储单元块包括多个存储单元单元。 多个存储单元单元中的每一个包括多个存储单元,并且以规定间隔沿第一方向设置。 多个存储单元块被布置在与第一方向交叉的第二方向上。 多个第一配线在第二方向上延伸并且以规定间隔沿第一方向设置。 多个第二布线被设置在第一布线的上方和下方中的至少一个。 在第二方向的第二配线的两端设置接点,将第一配线连接到第二配线。 沿着第一方向的第二布线的宽度尺寸大于沿着第一方向的第一布线的宽度尺寸。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110220996A1
    • 2011-09-15
    • US12885031
    • 2010-09-17
    • Hiroyuki KUTSUKAKEKenji GomikawaYoshiko KatoNorihisa AraiTomoaki Hatano
    • Hiroyuki KUTSUKAKEKenji GomikawaYoshiko KatoNorihisa AraiTomoaki Hatano
    • H01L27/088H01L21/762
    • H01L27/11519H01L21/76229H01L27/11521H01L27/11526H01L27/11546
    • According to one embodiment, a semiconductor device includes a semiconductor substrate, an element isolation insulating film, a source layer, a drain layer, a gate electrode, a gate insulating film, a first punch-through stopper layer, and a second punch-through stopper layer. The semiconductor substrate is a first conductivity type. The element isolation insulating film divides an upper layer portion of the semiconductor substrate into a plurality of first active regions. The source layer and the drain layer are a second conductivity type and are formed in spaced to each other in an upper portion of each of the first active regions. The gate electrode is provided in a region directly above a channel region on the semiconductor substrate located between the source layer and the drain layer. The gate insulating film is provided between the semiconductor substrate and the gate electrode. The first punch-through stopper layer of the first conductivity type is formed in a region of the first active region directly below the source layer and the second punch-through stopper layer of the first conductivity type is formed in a region of the first active region directly below the drain layer. The first punch-through stopper layer and the second punch-through stopper layer each has an effective impurity concentration higher than the semiconductor substrate. The first punch-through stopper layer and the source layer are separated in the channel region. The second punch-through stopper layer and the drain layer are separated in the channel region.
    • 根据一个实施例,半导体器件包括半导体衬底,元件隔离绝缘膜,源极层,漏极层,栅电极,栅极绝缘膜,第一穿通阻挡层和第二穿通 塞层。 半导体衬底是第一导电类型。 元件隔离绝缘膜将半导体衬底的上层部分分成多个第一有源区。 源层和漏极层是第二导电类型,并且在每个第一有源区的上部彼此间隔开形成。 栅电极设置在位于源层和漏极层之间的半导体衬底上的沟道区的正上方的区域中。 栅极绝缘膜设置在半导体衬底和栅电极之间。 第一导电类型的第一穿通阻挡层形成在源极的正下方的第一有源区的区域中,并且第一导电类型的第二穿通阻挡层形成在第一有源区的区域中 直接在漏极层下面。 第一穿通阻止层和第二穿通阻止层各自具有高于半导体衬底的有效杂质浓度。 第一穿通阻止层和源极层在沟道区域中分离。 第二穿通阻止层和漏极层在沟道区域中分离。
    • 10. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08294221B2
    • 2012-10-23
    • US12952637
    • 2010-11-23
    • Yoshiko KatoHiroyuki KutsukakeMasayuki Ichige
    • Yoshiko KatoHiroyuki KutsukakeMasayuki Ichige
    • H01L21/70
    • H01L27/11521H01L27/11519
    • According to one embodiment, a semiconductor memory device includes a plurality of memory cell blocks, a plurality of first wirings, a plurality of second wirings, and a contact. Each of the memory cell blocks includes a plurality of memory cell units. Each of the plurality of memory cell units includes a plurality of memory cells and is provided in a first direction at a prescribed spacing. The plurality of memory cell blocks is arranged in a second direction intersecting with the first direction. The plurality of first wirings extends in the second direction and is provided in the first direction at a prescribed spacing. The plurality of second wirings is provided at least one of above and below the first wiring. The contact is provided at both end portions of the second wiring in the second direction and connects the first wiring to the second wiring. A width dimension of the second wiring along the first direction is larger than a width dimension of the first wiring along the first direction.
    • 根据一个实施例,半导体存储器件包括多个存储器单元块,多个第一布线,多个第二布线和一个触点。 每个存储单元块包括多个存储单元单元。 多个存储单元单元中的每一个包括多个存储单元,并且以规定间隔沿第一方向设置。 多个存储单元块被布置在与第一方向交叉的第二方向上。 多个第一配线在第二方向上延伸并且以规定间隔沿第一方向设置。 多个第二布线被设置在第一布线的上方和下方中的至少一个。 在第二方向的第二配线的两端设置接点,将第一配线连接到第二配线。 沿着第一方向的第二布线的宽度尺寸大于沿着第一方向的第一布线的宽度尺寸。