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    • 9. 发明授权
    • Method of coating semiconductor wafer with resin and mold used therefor
    • 用树脂和模具涂覆半导体晶片的方法
    • US06346433B1
    • 2002-02-12
    • US09523420
    • 2000-03-10
    • Keiji MaedaShigeru Miyagawa
    • Keiji MaedaShigeru Miyagawa
    • H01L2150
    • H01L21/565H01L2924/0002H01L2924/00
    • In a method of coating a semiconductor wafer with a resin of the present invention, first, a semiconductor wafer is placed on a bottom surface of a cavity provided in a molding surface of a lower mold of a mold with its surface having a bump facing upward. Thereafter, a required amount of resin material is supplied to cavity, and a film for exposing the bump is applied to a molding surface of the upper one of the molds. In this state, molds are closed together. Resin material is heated to melt in cavity. Then, film is pressed against the bottom surface of cavity by a pressing member provided on the molding surface of the upper mold, so that film is abutted against a leading edge of bump in cavity. A pressure is applied to the resin in cavity through film, and the surface having the bump of semiconductor wafer is coated with resin. According to the method, pressing member is provided on the upper mold, so that melted resin does not enter a sliding portion. Accordingly, productivity of the resin-coated wafer increases and a resin-coated wafer with high quality and reliability is obtained.
    • 在利用本发明的树脂涂覆半导体晶片的方法中,首先,将半导体晶片放置在设置在模具的下模具的模制表面中的空腔的底表面上,其表面具有朝上的凸起 。 此后,将所需量的树脂材料供应到空腔中,并且将用于暴露凸块的膜施加到上模具的模制表面。 在这种状态下,模具封闭在一起。 将树脂材料在空腔中加热熔化。 然后,通过设置在上模的模制表面上的按压构件将膜压在空腔的底表面上,使得膜抵住空腔中凸起的前缘。 在空腔通过膜中对树脂施加压力,并且用树脂涂覆具有半导体晶片的凸块的表面。 根据该方法,在上模具上设置按压部件,使熔融树脂不进入滑动部。 因此,树脂涂覆的晶片的生产率增加,并且获得了具有高质量和可靠性的树脂涂覆的晶片。