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    • 7. 发明授权
    • Apparatus for manufacturing semiconductor wafer
    • 半导体晶片制造装置
    • US06578589B1
    • 2003-06-17
    • US09937525
    • 2001-09-24
    • Masanori MayusumiMasato ImaiKazutoshi InoueShinji NakaharaShintoshi Gima
    • Masanori MayusumiMasato ImaiKazutoshi InoueShinji NakaharaShintoshi Gima
    • B08B704
    • H01L21/67115H01L21/67034H01L21/6704Y10S134/902
    • Disclosed is a compact apparatus for manufacturing semiconductor wafers, which is aimed at complete removing of moisture from the wafers after final cleaning while reducing the manufacturing time. The apparatus includes a cleaning chamber (1) for final cleaning, a storage chamber (3) for storing wafers, a transfer chamber (2) communicating with the both cleaning and storage chambers (1, 3), and formed in its upper wall with a heat-conducting window (7), a robot hand (5) and a robot arm (4) for transporting the wafer (W) from the cleaning chamber (1) to the storage chamber (3) within the transfer chamber, infrared lamps (6) arranged to face the window (7) outside the transfer chamber (2) so as to heat the wafer (W) in the course of transportation within the transfer chamber, gas supply ports (8) for producing a laminar flow of inert gas from the storage chamber (3) to the cleaning chamber (1) to expose wafers (W) with the gas, and exhaust ports (9) for exhausting the moisture removed from wafers.
    • 公开了一种用于制造半导体晶片的紧凑装置,其目的是在最终清洁之后从晶片完全除去水分,同时减少制造时间。 该设备包括用于最终清洁的清洁室(1),用于存储晶片的储存室(3),与清洁和储存室(1,3)连通的传送室(2),并在其上壁形成 传导窗(7),机器人手(5)和用于将晶片(W)从清洁室(1)传送到传送室内的储存室(3)的机械臂(4),红外灯 (6),布置成面对转移室(2)外部的窗口(7),以在输送室内的运输过程中加热晶片(W),用于产生惰性层流的气体供给口(8) 从储存室(3)到清洁室(1)的气体,以便与气体一起露出晶片(W),以及用于排出从晶片去除的水分的排气口(9)。