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    • 1. 发明授权
    • Thermoplastic resin composition and use thereof
    • 热塑性树脂组合物及其用途
    • US5424104A
    • 1995-06-13
    • US178616
    • 1994-01-07
    • Yoshikatsu AmimotoFumitoshi IkejiriSanehiro YamamotoAkinori ToyotaKatunari NishimuraMasahiro KandaTetsuo Kato
    • Yoshikatsu AmimotoFumitoshi IkejiriSanehiro YamamotoAkinori ToyotaKatunari NishimuraMasahiro KandaTetsuo Kato
    • C08L51/06C08K5/49C08K5/524C08L77/00C08L77/06H01R13/46B29D22/00B29D23/00
    • C08L77/00
    • Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).
    • 公开了一种热塑性树脂组合物,其包含(A)包含二羧酸单元的芳族聚酰胺,所述二羧酸单元包含50-100摩尔%的由对苯二甲酸衍生的单元,以及0-50摩尔%的衍生自除对苯二甲酸之外的芳族二羧酸的单元和/ 或具有4-20个碳原子的脂族二羧酸,以及衍生自脂族二胺和/或脂环族二胺的二胺单元,所述芳族聚酰胺的特性粘度为浓度为0.5-3.0dl / g。 硫酸在30℃,熔点高于300℃,(B)接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物和( C)脂肪族聚酰胺,其中所述热塑性树脂组合物包含10-80重量份的接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物(B)和5- 基于100重量份的芳族聚酰胺(A),80重量份的脂肪族聚酰胺(C)。
    • 5. 发明授权
    • Resin composition for forming plated layer and use thereof
    • 用于形成镀层的树脂组合物及其用途
    • US5324766A
    • 1994-06-28
    • US138390
    • 1993-10-20
    • Fumitoshi IkejiriSanehiro YamamotoKeiji Kawamoto
    • Fumitoshi IkejiriSanehiro YamamotoKeiji Kawamoto
    • C08K3/00H05K1/03H05K9/00C08J5/08C08K3/18C08K3/22C08L77/00
    • H05K9/0083C08K3/0033H05K1/0346
    • The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.
    • 本文公开的用于形成镀层的树脂组合物包含由二羧酸组分回收单元组成的聚酰胺和衍生自具有4至25个碳原子的亚烷基的二胺组分单元和至少一种无机填料的重复单元。 还公开了在由树脂组合物形成的树脂模塑制品的表面上形成有镀层的树脂模塑制品,电磁波屏蔽材料,装饰性树脂模塑制品和通过形成镀层制成的连接材料。 此外,公开了通过在由所述树脂组合物形成的树脂模塑制品的表面上的布线电路部分中选择性地金属化层形成的印刷电路板和用于镀覆其上镀有层的这些制品的方法。
    • 10. 发明授权
    • Cycloolefin type random copolymer compositions
    • 环烯烃型无规共聚物组合物
    • US4918133A
    • 1990-04-17
    • US363884
    • 1989-06-07
    • Satoru MoriyaAkio IshimotoYoshinori AkanaYozo YamamotoKotaro KishimuraFumitoshi Ikejiri
    • Satoru MoriyaAkio IshimotoYoshinori AkanaYozo YamamotoKotaro KishimuraFumitoshi Ikejiri
    • C08L23/16C08L65/00
    • C08L23/16C08L23/0823C08L65/00
    • In accordance with the present invention, there are provided cycloolefin type random copolymer compositions excellent in heat resistance, chemical resistance, rigidity, impact resistance, etc., which comprise(A) a cycloolefin type random copolymer containing an ethylene component and a cycloolefin component and having an intrinsic viscosity [.eta.] of 0.05-10 dl/g as measured at 135.degree. C. in decalin and a softening temperature (TMA) of not lower than 70.degree. C., and(B) one or more non-rigid copolymers selected from the group consisting of:(i) a cycloolefin type random copolymer containing an ethylene component, at least one other .alpha.-olefin component and a cycloolefin component and having an intrinsic viscosity [.eta.] of 0.01-10 dl/g as measured at 135.degree. C. in decalin and a softening temperature (TMA) of below 70.degree. C.,(ii) a non-crystalline to low crystalline .alpha.-olefin type elastomeric copolymer formed from at least two .alpha.-olefins,(iii) an .alpha.-olefin-diene type elastomeric copolymer formed from at least two .alpha.-olefins and at least one non-conjugated diene, and(iv) an aromatic vinyl type hydrocarbon-conjugated diene copolymer or a hydrogenated product thereof, and optionally(c) an inorganic filler or organic filler.
    • PCT No.PCT / JP88 / 01027 Sec。 371日期1989年6月7日第 102(e)日期1989年6月7日PCT提交1988年10月7日PCT公布。 第WO89 / 03413号公报 根据本发明,提供了耐热性,耐化学性,刚性,耐冲击性等优异的环烯烃型无规共聚物组合物,其包含(A)含有 乙烯组分和环烯烃组分,并且在135℃下在十氢化萘中测得的特性粘度η为0.05-10dl / g,软化温度(TMA)不低于70℃,(B) 一种或多种选自以下的非刚性共聚物:(i)含有乙烯组分,至少一种其它α-烯烃组分和环烯烃组分的环烯烃型无规共聚物,其特性粘度η为0.01- 在135℃下在十氢化萘中测得的10dl / g,软化温度(TMA)低于70℃,(ii)由至少两个α - 烯烃形成的非结晶至低结晶的α-烯烃型弹性体共聚物, 烯烃,(iii)α 由至少两种α-烯烃和至少一种非共轭二烯形成的α-烯烃 - 二烯型弹性体共聚物,和(iv)芳族乙烯基型烃 - 共轭二烯共聚物或其氢化产物,和任选地(c)无机 填料或有机填料。