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    • 2. 发明申请
    • ELECTRONIC DEVICE SOCKET
    • 电子设备插座
    • US20110171841A1
    • 2011-07-14
    • US13061808
    • 2009-08-05
    • Yuichi TsubakiMasahiko Kobayashi
    • Yuichi TsubakiMasahiko Kobayashi
    • H01R12/70
    • H01R12/7076G01R1/045G01R1/0483H01R12/714H01R13/2421H01R13/6599H01R2107/00
    • To provide an electronic device socket able to shorten conductive paths between terminals of an electronic device and contacts of a circuit board. An electronic device socket (1) wherein a socket part 10 electrically connecting a plurality of terminals of an electronic device to corresponding contacts of a circuit board has a plurality of through holes 105 arranged corresponding to the positions of the terminals. Each through hole 105 has an elastic member 107 comprised of a coil spring, provided with an upper part having elasticity along a longitudinal direction of the through hole and a lower part able to form a conductive path substantially parallel to an extension direction of the through hole, a plunger 108 having conductivity biased from the elastic member toward the top surface in a second state where the electronic device is attached and the terminals and contacts of the circuit board are electrically connected, and a conductive film 106 formed at an inner surface of the through hole so as to electrically connect with near a part of the elastic member where a upper part of the elastic member and the plunger contact each other, and a lower part of the elastic member when the elastic member is compressed.
    • 提供能够缩短电子设备的端子和电路板的触点之间的导电路径的电子设备插座。 一种电子设备插座(1),其中将电子设备的多个端子电连接到电路板的相应触点的插座部分10具有对应于端子的位置布置的多个通孔105。 每个通孔105具有由螺旋弹簧构成的弹性部件107,该螺旋弹簧设置有沿着贯通孔的长度方向具有弹性的上部,以及能够形成基本上平行于贯通孔的延伸方向的导电路径的下部 在安装有电子装置的第二状态和电路基板的端子与触点电连接的状态下,具有从弹性部件朝向上表面偏移的导柱的柱塞108以及形成在 通孔,以便弹性构件的上部与柱塞接触的弹性构件的一部分附近与弹性构件的压缩时的弹性构件的下部电连接。
    • 4. 发明授权
    • Electronic device socket
    • 电子设备插座
    • US08556638B2
    • 2013-10-15
    • US13061808
    • 2009-08-05
    • Yuichi TsubakiMasahiko Kobayashi
    • Yuichi TsubakiMasahiko Kobayashi
    • H01R12/00
    • H01R12/7076G01R1/045G01R1/0483H01R12/714H01R13/2421H01R13/6599H01R2107/00
    • To provide an electronic device socket able to shorten conductive paths between terminals of an electronic device and contacts of a circuit board. An electronic device socket (1) wherein a socket part 10 electrically connecting a plurality of terminals of an electronic device to corresponding contacts of a circuit board has a plurality of through holes 105 arranged corresponding to the positions of the terminals. Each through hole 105 has an elastic member 107 comprised of a coil spring, provided with an upper part having elasticity along a longitudinal direction of the through hole and a lower part able to form a conductive path substantially parallel to an extension direction of the through hole, a plunger 108 having conductivity biased from the elastic member toward the top surface in a second state where the electronic device is attached and the terminals and contacts of the circuit board are electrically connected, and a conductive film 106 formed at an inner surface of the through hole so as to electrically connect with near a part of the elastic member where a upper part of the elastic member and the plunger contact each other, and a lower part of the elastic member when the elastic member is compressed.
    • 提供能够缩短电子设备的端子和电路板的触点之间的导电路径的电子设备插座。 一种电子设备插座(1),其中将电子设备的多个端子电连接到电路板的相应触点的插座部分10具有对应于端子的位置布置的多个通孔105。 每个通孔105具有由螺旋弹簧构成的弹性部件107,该螺旋弹簧设置有沿着贯通孔的长度方向具有弹性的上部,以及能够形成基本上平行于贯通孔的延伸方向的导电路径的下部 在安装有电子装置的第二状态和电路基板的端子与触点电连接的状态下,具有从弹性部件朝向上表面偏移的导柱的柱塞108以及形成在 通孔,以便弹性构件的上部与柱塞接触的弹性构件的一部分附近与弹性构件的压缩时的弹性构件的下部电连接。
    • 5. 发明授权
    • Illumination device, method of assembling illumination device, and liquid crystal display device
    • 照明装置,照明装置的组装方法以及液晶显示装置
    • US08033708B2
    • 2011-10-11
    • US12352704
    • 2009-01-13
    • Yuichi Tsubaki
    • Yuichi Tsubaki
    • F21V7/04
    • G02B6/009G02B6/0068G02B6/0091
    • There is provided an illumination device equipped with a light guide plate, a light source unit having a plurality of point like light sources for supplying light to the light guide plate and a light source holding member for holding the point like light sources, the light source unit being disposed to oppose an edge face of the light guide plate, and a housing for holding the light guide plate and the light source unit. The light source unit is constituted so as to be inserted in and extracted from the housing by a slide mechanism that can be slid along the edge face of the light guide plate, and the light source unit is equipped with a spacer for assuring a gap between the edge face of the light guide plate and the light sources at a slide insertion side end of the light source unit with respect to the housing when the light source unit is slidingly inserted in the housing.
    • 提供了一种配备有导光板的照明装置,具有用于向导光板供给光的多个点状光源的光源单元和用于保持点状光源的光源保持部件,光源 设置成与导光板的边缘面相对的单元,以及用于保持导光板和光源单元的壳体。 光源单元构成为通过能够沿着导光板的边缘面滑动的滑动机构插入壳体内并从壳体中取出,并且光源单元配备有用于确保导光板之间的间隙的间隔件 当光源单元滑动地插入到壳体中时,导光板的边缘面和光源在光源单元的滑动插入侧端部相对于壳体的光源。
    • 6. 发明授权
    • IC device testing socket
    • IC器件测试插座
    • US08957693B2
    • 2015-02-17
    • US13497132
    • 2010-09-21
    • Yuichi Tsubaki
    • Yuichi Tsubaki
    • G01R31/26G01R1/04G01R1/073
    • G01R1/0483G01R1/07314
    • To provide an IC device testing socket, capable of improving signal transmission efficiency during testing an IC device, without deteriorating the replacement workability of contact pins. A substrate 2 has dielectric layers 22-25 embedded in a base material 21 constituted by dielectric material such as glass epoxy. Each dielectric layer has a conductive layer, such as copper, formed on both sides thereof. Each of contact pins 3 extends generally perpendicular to surfaces 26 and 27 of substrate 2, and penetrates substrate 2. A through hole 28, into which each contact pin may be pressed, is formed in base material 21 of substrate 2, each high-dielectric layer and conductive layer. A conductive material 281, such as copper, is formed on an inner surface of each through hole 28.
    • 提供一种IC器件测试插座,能够在测试IC器件期间提高信号传输效率,而不会降低接触针的替代可操作性。 基板2具有嵌入由介电材料如玻璃环氧树脂构成的基材21中的电介质层22-25。 每个电介质层在其两侧形成有诸如铜的导电层。 每个接触销3大致垂直于基板2的表面26和27延伸,并且穿透基板2.每个接触销可被按压在其中的通孔28形成在基板2的基底材料21中,每个高电介质 层和导电层。 在每个通孔28的内表面上形成诸如铜的导电材料281。
    • 8. 发明申请
    • IC DEVICE TESTING SOCKET
    • IC器件测试插座
    • US20120182037A1
    • 2012-07-19
    • US13497132
    • 2010-09-21
    • Yuichi Tsubaki
    • Yuichi Tsubaki
    • G01R31/26
    • G01R1/0483G01R1/07314
    • To provide an IC device testing socket, capable of improving signal transmission efficiency during testing an IC device, without deteriorating the replacement workability of contact pins. A substrate 2 has dielectric layers 22-25 embedded in a base material 21 constituted by dielectric material such as glass epoxy. Each dielectric layer has a conductive layer, such as copper, formed on both sides thereof. Each of contact pins 3 extends generally perpendicular to surfaces 26 and 27 of substrate 2, and penetrates substrate 2. A through hole 28, into which each contact pin may be pressed, is formed in base material 21 of substrate 2, each high-dielectric layer and conductive layer. A conductive material 281, such as copper, is formed on an inner surface of each through hole 28.
    • 提供一种IC器件测试插座,能够在测试IC器件期间提高信号传输效率,而不会降低接触针的替代可操作性。 基板2具有嵌入由介电材料如玻璃环氧树脂构成的基材21中的电介质层22-25。 每个电介质层在其两侧形成有诸如铜的导电层。 每个接触销3大致垂直于基板2的表面26和27延伸,并且穿透基板2.每个接触销可被按压在其中的通孔28形成在基板2的基底材料21中,每个高电介质 层和导电层。 在每个通孔28的内表面上形成诸如铜的导电材料281。