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    • 4. 发明授权
    • Semiconductor ingot machining method
    • 半导体锭加工方法
    • US5484326A
    • 1996-01-16
    • US159501
    • 1993-11-30
    • Yoshihiro HiranoAtsushi Ozaki
    • Yoshihiro HiranoAtsushi Ozaki
    • B24B1/00B23D5/00B28D1/22B28D5/00B28D5/02C30B33/00G01N23/207H01L21/304B24B7/00
    • B24B5/50B23D5/00C30B33/00
    • The cutting process is executed after the grinding process and for one semiconductor ingot, one grinding device and one inner diameter saw slicing machine are used to perform grinding process and cutting process respectively. During the grinding process, the entirety of the cylindrical body portion of the semiconductor ingot is cylindrically ground, a portion of the tail end is cylindrically ground, the orientation flat position is determined and an orientation flat is formed by surface grinding. During the cutting process the tail portion is cut off and a sample for lifetime measurement is taken and a wafer sample is cut off from the end of the cylindrical body portion on the tail side. The semiconductor ingot is reversed in the direction of the axis and the head portion of the semiconductor ingot is cut off and a wafer sample is cut off from the cylindrical body portion on the head side. Wafer samples are cut off from the end of the cylindrical body portion on the head side and from the middle portion of cylindrical body portion to divide the cylindrical body portion into two blocks.
    • 在研磨过程之后执行切割过程,并且对于一个半导体锭,一个研磨装置和一个内径锯切机分别进行研磨处理和切割处理。 在研磨过程中,半导体锭的圆筒体部分的整体是圆柱形的,尾端的一部分是圆柱形的,确定取向平面位置,并通过表面研磨形成取向平面。 在切割过程中,尾部被切断,并且进行寿命测量的样品,并且从尾侧的圆柱体部分的端部切下晶片样品。 半导体锭在轴线方向上反转,并且半导体锭的头部被切断,并且晶片样品从头侧的圆柱形主体部分切除。 将晶片样品从头侧的圆筒体部分的端部和圆筒体部分的中间部分切除,以将圆柱体部分分成两个块。
    • 7. 发明授权
    • Machining error correction apparatus
    • 加工纠错装置
    • US5405285A
    • 1995-04-11
    • US187769
    • 1994-01-28
    • Yoshihiro HiranoAtsushi Ozaki
    • Yoshihiro HiranoAtsushi Ozaki
    • B23Q15/04B24B49/02B24B49/03C30B33/00G05B19/401G05B19/418H01L21/304B24B1/02
    • C30B29/06B24B49/02C30B33/00G05B19/401G05B19/4189Y02P90/10Y02P90/28
    • The diameter, the orientation flat width/notch depth and the length of the block 10p are measured by the measuring devices 71a, 71b and 71c respectively and then the machining errors .DELTA.Dp, .DELTA.Wp and .DELTA.Lp in the measured values against the set values are calculated at the error calculation unit 833. Then .DELTA.Dp, .DELTA.Wp and .DELTA.Lp are stored in memory at the memory unit 834 in correspondence with the identification codes IDi and IDj of the grinding device 5i (i=1-N) and the cutting device 6j (j=1-M) that performed the machining. Then at the average value calculation unit 835, the average values of .DELTA.Dp and .DELTA.Wp for each of the grinding devices 51-5N and the average value of the .DELTA.Lp for each of the cutting devices 61-6M are calculated. The average values of .DELTA.Dp and .DELTA.Wp are supplied to the corresponding grinding device 5i as the diameter correction value and the width/depth correction value respectively and the average value of .DELTA.Lp is sent to the corresponding cutting device 6j as the length correction value from the transmission unit 836.
    • 通过测量装置71a,71b和71c测量直径,取向平坦宽度/切口深度和块10p的长度,然后根据设定值测量测量值中的加工误差DELTA Dp,DELTA Wp和DELTA Lp 在误差计算单元833处计算。然后,DELTA Dp,DELTA Wp和DELTA Lp根据研磨装置5i(i = 1-N)的识别码IDi和IDj存储在存储器单元834的存储器中,并且 切割装置6j(j = 1-M)进行加工。 然后在平均值计算单元835中,计算每个研磨装置51-5N的DELTA Dp和DELTA Wp的平均值以及每个切割装置61-6M的DELTA Lp的平均值。 将DELTA Dp和DELTA Wp的平均值作为直径校正值和宽度/深度校正值分别提供给相应的研磨装置5i,并且将DELTA Lp的平均值发送到相应的切割装置6j作为长度校正值 从传输单元836。
    • 9. 发明授权
    • Display device having two display units
    • 具有两个显示单元的显示装置
    • US06570628B1
    • 2003-05-27
    • US09657941
    • 2000-09-08
    • Yoshihiro Hirano
    • Yoshihiro Hirano
    • G02F11335
    • B60K35/00B60K2350/405
    • A display device 1 includes an enclosure 2, a first display unit 3 and a second display unit 6. The enclosure 2 is provided with an opening portion 2a through which the first display unit 3 is loaded/unloaded. The first display unit 3 is movably provided between a loading position where said first display unit is completely loaded in the enclosure and a viewing position where information is visually recognized by a driver. The second unit 6 is pivotally supported at its end potion 6c by a pivotal shaft 7 attached to the enclosure 2. The second display unit 6 includes a display 6a and a frame member 6b. When the first display unit 6 is located at both loading position and the viewing position, an end face 6d of the frame member 6b is opposite to said opening portion 2a of the enclosure.
    • 显示装置1包括外壳2,第一显示单元3和第二显示单元6.外壳2设置有第一显示单元3通过其加载/卸载的开口部2a。 第一显示单元3可移动地设置在所述第一显示单元被完全装载在外壳中的装载位置和驾驶员视觉识别信息的观看位置之间。 第二单元6通过附接到外壳2的枢转轴7在其端部6c枢转地支撑。第二显示单元6包括显示器6a和框架构件6b。 当第一显示单元6位于加载位置和观看位置两者时,框架构件6b的端面6d与外壳的所述开口部分2a相对。