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    • 8. 发明授权
    • Image forming apparatus
    • 图像形成装置
    • US5438397A
    • 1995-08-01
    • US216867
    • 1994-03-24
    • Yoshiaki OkanoTetsuya Nakamura
    • Yoshiaki OkanoTetsuya Nakamura
    • G03G21/00G03G15/06
    • G03G21/0064G03G2221/0005
    • An image forming apparatus includes a brush member arranged along a photosensitive member and arranged between a transfer roller means and a charger. The image forming apparatus further includes a first voltage supply for supplying a first voltage which is sufficient to attract residual toner remaining on the photosensitive member to the brush member during a first period when an exposed area that is to be exposed by the exposing means passes the brush member, the first period occurring before the exposed area reaches the exposing means, and a second voltage supply for supplying a second voltage which is sufficient to spit the attracted toner attracted in the brush member at the photosensitive member during at least a part of a second period when a non-exposed area that is on a different area of the photosensitive member from the exposed area passes the brush member, the second period occurring before the non-exposed area reaches the exposing means.
    • 图像形成装置包括沿感光部件布置并布置在转印辊装置和充电器之间的刷部件。 图像形成装置还包括第一电压源,用于在第一时间段期间提供足以将残留在感光构件上的剩余调色剂吸引到刷构件的第一电压,当暴露装置暴露的暴露区域通过时 电刷构件,在暴露区域到达曝光装置之前出现的第一时段;以及第二电压源,用于提供第二电压,该第二电压足以在至少一部分时间期间吸引到刷构件中的吸引调色剂吸附在感光构件处 在曝光区域的与曝光区域不同的区域上的非曝光区域通过刷子部件的第二期间,在非曝光区域到达曝光装置之前的第二期间。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE AND TEST METHOD
    • 半导体器件和测试方法
    • US20130015587A1
    • 2013-01-17
    • US13482146
    • 2012-05-29
    • Akihiko OkutsuHitoshi SaitoYoshiaki Okano
    • Akihiko OkutsuHitoshi SaitoYoshiaki Okano
    • H01L21/66H01L23/522
    • G01R31/275G01R31/2601G01R31/2884H01L22/32H01L23/522H01L23/564H01L23/585H01L2224/05554H01L2924/0002H01L2924/00
    • A semiconductor device includes a semiconductor substrate including an element region, an inner sealing and an outer sealing which are formed on the element region and have a first opening part and a second opening part, respectively, a multilayer interconnection structure which is formed on the substrate and stacks multiple inter-layer insulation films each including a wiring layer, a moisture resistant film formed between a first inter-layer insulation film and a second inter-layer insulation film which are included in the multilayer interconnection structure, a first portion which extended from a first side of the moisture resistant film and passes the first opening part, a second portion which extended from a second side of the moisture resistant film and passes through the second opening part, and a wiring pattern including a via plug which penetrates the moisture resistant film and connects the first portion and the second portion.
    • 半导体器件包括:半导体衬底,包括元件区域,内部密封件和外部密封件,所述元件区域,内部密封件和外部密封件分别形成在所述元件区域上并具有第一开口部分和第二开口部分,所述多层互连结构分别形成在所述衬底上 并且堆叠多个层间绝缘膜,每个层间绝缘膜包括布线层,形成在包括在多层互连结构中的第一层间绝缘膜和第二层间绝缘膜之间的防潮膜,第一部分从 所述防潮膜的第一面通过所述第一开口部,所述第二部分从所述防湿膜的第二侧延伸并穿过所述第二开口部;以及布线图案,其包括穿过所述防潮膜的通孔塞 并且连接第一部分和第二部分。