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1. 发明授权

US06158648A Method and apparatus for bonding using brazing material 失效
标题翻译：使用钎焊材料进行粘合的方法和装置
公开(公告)号：US06158648A
公开(公告)日：2000-12-12
申请号：US38783
申请日：1998-03-11
申请人： Yoshiaki Mori , Takuya Miyakawa , Yasuhiko Asano , Osamu Kurashina , Satoshi Miyamori , Yohei Kurashima , Makoto Anan
发明人： Yoshiaki Mori , Takuya Miyakawa , Yasuhiko Asano , Osamu Kurashina , Satoshi Miyamori , Yohei Kurashima , Makoto Anan
IPC分类号： B23K1/20 , B23K1/012 , B23K101/42 , C23G5/00 , H05K3/34 , B23K31/02
CPC分类号： B23K1/012 , B23K1/206 , C23G5/00 , B23K2201/40
摘要： High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film.
摘要翻译：在引入由诸如玻璃或陶瓷的电介质材料形成的气体导管的气体中产生使用微波的高频放电或非极性放电。通过将其暴露于含有由上述放电产生的活性物质的气流，对处于大气压下的组分进行表面处理。组件在施加表面处理之前，之中或之后进行焊接。组分的表面通过将组分直接暴露于放电或通过在其上喷射含有活性物质的反应性气流而暴露于活性物质。通过选择用于产生活性物质的适当气体，可以提高要焊接的组分的表面的润湿性，或者去除有机物质或氧化物膜。

2. 发明授权

US5735451A Method and apparatus for bonding using brazing material 失效
标题翻译：使用钎焊材料进行粘合的方法和装置
公开(公告)号：US5735451A
公开(公告)日：1998-04-07
申请号：US347398
申请日：1995-02-10
申请人： Yoshiaki Mori , Takuya Miyakawa , Yasuhiko Asano , Osamu Kurashina , Satoshi Miyamori , Yohei Kurashima , Makoto Anan
发明人： Yoshiaki Mori , Takuya Miyakawa , Yasuhiko Asano , Osamu Kurashina , Satoshi Miyamori , Yohei Kurashima , Makoto Anan
IPC分类号： B23K1/20 , B23K1/012 , B23K101/42 , C23G5/00 , H05K3/34 , B23K31/02 , B23K35/38
CPC分类号： B23K1/012 , B23K1/206 , C23G5/00 , B23K2201/40
摘要： High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. The components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by directing the reactive gas flow containing the active species at the component surfaces. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove organic substances or oxide film surfaces.
摘要翻译： PCT No.PCT / JP94 / 00562 Sec。 371日期1995年2月10日 102（e）1995年2月10日PCT PCT 1994年4月5日PCT公布。公开号WO94 / 22628 日期1994年10月13日在引入由电介质材料如玻璃或陶瓷形成的气体导管的气体中产生使用微波的高频放电或非极性放电。通过将其暴露于含有通过上述放电产生的活性物质的气流，对处于大气压下的组分进行表面处理。组件在施加该表面处理之前，期间或之后进行焊接。通过将组分直接暴露于放电，或通过将含有活性物质的反应性气流引导到组分表面，将组分的表面暴露于活性物质。通过选择用于产生活性物质的合适气体，可以提高要焊接的部件的表面的润湿性，或者去除有机物质或氧化物膜表面。

3. 发明授权

US6086710A Surface treatment apparatus 失效
标题翻译：表面处理装置
公开(公告)号：US6086710A
公开(公告)日：2000-07-11
申请号：US750397
申请日：1996-12-06
申请人： Takeshi Miyashita , Takuya Miyakawa , Yasutugu Aoki , Isao Kubota , Osamu Kurashina , Yasuhiko Asano , Yoshio Oda , Yoshiaki Mori
发明人： Takeshi Miyashita , Takuya Miyakawa , Yasutugu Aoki , Isao Kubota , Osamu Kurashina , Yasuhiko Asano , Yoshio Oda , Yoshiaki Mori
IPC分类号： H01J37/32 , H05H1/46 , H01L21/302
CPC分类号： H01J37/32834
摘要： In a surface treatment apparatus (30) of the face type, a porous dielectric (37) is supported by the outer periphery portion of the supporting member (45) under the bottom surface of a porous electrode (32). The dielectric can be supported by the supporting member to permit the thermal expansion deformation of the dielectric by forming an upward inclined-face (47) and a downward inclined-face (43) on the supporting member (45) and the dielectric (37), respectively. Further, a discharge gas can be supplied uniformly to a discharge region (51) through the electrode (32) and the dielectric (37), both of which are porous. Many gas exhaust ports (41), by which the flow rate of the gas can be regulated, are provided around the discharge region (51). Thus, the gas is uniformly exhausted around the discharge region (51). Especially, if the gap between the dielectric (37) and a work (39) depends on mounting accuracy or the like and varies with location, the gas can be exhausted uniformly around the discharge region (51).
摘要翻译： PCT No.PCT / JP96 / 00935 Sec。 371日期1996年12月6日第 102（e）日期1996年12月6日PCT PCT 1996年4月5日PCT公布。 WO96 / 31997 PCT出版物日期：1996年10月10日在表面处理装置（30）中，多孔电介质（37）由多孔电极（32）的底面下方的支撑部件（45）的外周部支撑。电介质可以由支撑构件支撑，以通过在支撑构件（45）和电介质（37）上形成向上的倾斜面（47）和向下倾斜面（43）来允许电介质的热膨胀变形，，分别。此外，放电气体可以通过电极（32）和电介质（37）均匀地供给到放电区域（51），两者都是多孔的。在排出区域51周围设置有可以调节气体流量的多个排气口41。因此，气体在排出区域51周围均匀排出。特别地，如果电介质（37）和工件（39）之间的间隙取决于安装精度等，并且随着位置而变化，则可以在放电区域（51）周围均匀地排出气体。

4. 发明授权

US06180253B2 Brazing or soldering material and production method thereof 失效
标题翻译：钎焊或焊接材料及其制造方法
公开(公告)号：US06180253B2
公开(公告)日：2001-01-30
申请号：US09054237
申请日：1998-04-02
申请人： Yoshiaki Mori , Katsuhiro Takahashi , Takuya Miyakawa
发明人： Yoshiaki Mori , Katsuhiro Takahashi , Takuya Miyakawa
IPC分类号： B32B1504
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , B23K35/3616 , B32B15/01 , C23C14/0694 , Y10T428/12486 , Y10T428/12583
摘要： The present invention provides a joining, brazing or soldering material wherein solderability is effectively improved without using a flux, and a production method thereof. In production of a joining material, a halogen compound is mixed, a film is formed on the surface of a solder molding or the surface of a solder molding is halogenated. In production of a joining material, a halogen compound is added to a solder melt, a film of a halogen compound is formed on the surface of a processed joining material, or the surface layer of the processed joining material is converted to a halogen compound layer by halogenation. Film formation or surface treatment may be carried out either a dry or wet method.
摘要翻译：本发明提供一种在不使用助熔剂的情况下有效改善可焊性的接合，钎焊或焊接材料及其制造方法。在制造接合材料时，混合卤素化合物，在焊料成型体的表面上形成膜，或者将焊料成型体的表面卤化。在制造接合材料时，在焊料熔融物中添加卤素化合物，在加工的接合材料的表面上形成卤素化合物的膜，或者将加工的接合材料的表面层转变为卤素化合物层通过卤化。成膜或表面处理可以以干法或湿法进行。

5. 发明授权

US06620282B2 Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent 有权
标题翻译：用于固体接合的方法和装置，导体接合方法，包装方法和接合剂以及粘合剂的制造方法
公开(公告)号：US06620282B2
公开(公告)日：2003-09-16
申请号：US09799761
申请日：2001-03-05
申请人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
发明人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
IPC分类号： C23C1400
CPC分类号： C03C27/04
摘要： A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.
摘要翻译：提供了一种用于不使用粘合剂的固体粘合的方法和装置。通过暴露于来自HF气体供给单元24的HF气体和来自氟化处理部分12中的来自蒸气发生器26的水蒸汽的混合物，金属，玻璃或其它结合构件16a和16b的表面被氟化。粘结构件16a 然后将16b与接合处理部分14中的台36上的氟化表面接触。然后将氩引入接合室34.然后通过气缸46将压力施加到第一接合构件16a和第二接合构件16b，并且通过加热器48加热至低于熔点，以将第一和第二粘结构件粘合在一起。

6. 发明授权

US07148148B2 Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method 有权
标题翻译：掩模形成和去除方法，半导体器件，电路，显示模块，滤色器和通过相同方法制造的发射器件
公开(公告)号：US07148148B2
公开(公告)日：2006-12-12
申请号：US10309198
申请日：2002-12-04
申请人： Yoshiaki Mori , Takuya Miyakawa , Mitsuru Sato , Shintaro Asuke , Kenichi Takagi
发明人： Yoshiaki Mori , Takuya Miyakawa , Mitsuru Sato , Shintaro Asuke , Kenichi Takagi
IPC分类号： H01L21/302
CPC分类号： H01L21/76838 , C25D5/022 , C25D7/12 , H01L21/0272 , H01L21/0274 , H01L21/288 , H01L21/31127 , H01L21/31133
摘要： A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.
摘要翻译：公开了一种降低制造成本的掩模形成方法。该方法在待加工构件的表面上形成掩模，以便使用液体材料形成图案化所需的图案。该方法还包括将抗蚀剂施加到待加工构件的整个表面，干燥所施加的抗蚀剂，通过使用光刻法去除图案形成区域中的抗蚀剂，并加热抗蚀剂来进行图案化。

7. 发明授权

US07098121B2 Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device 有权
标题翻译：在表面上形成预定图案的膜的方法以及使用该膜的装置以及制造装置的方法
公开(公告)号：US07098121B2
公开(公告)日：2006-08-29
申请号：US10367854
申请日：2003-02-19
申请人： Yoshiaki Mori , Takuya Miyakawa , Mitsuru Sato , Shintaro Asuke , Kenichi Takagi
发明人： Yoshiaki Mori , Takuya Miyakawa , Mitsuru Sato , Shintaro Asuke , Kenichi Takagi
IPC分类号： H01L21/22
CPC分类号： H01L21/3127 , H01L21/0212 , H01L21/02274 , H01L21/0272 , H01L21/0273 , H01L21/288 , H01L21/76838 , H01L27/1292
摘要： An object is to provide a mask formation method, which can curtail a manufacturing cost.A method of forming a film of predetermined pattern on the front surface of a member to-be-processed is so constructed as to carry out the step (S178) of improving the adherence of a pattern material solution to the member to-be-processed, the step (S180) of filling up a pattern forming recess provided in a mask on the surface of the member to-be-processed with a pattern material solution, the step (S186) of improving the film quality of the pattern film to-be-formed by processing the pattern material solution, the step (S188) of removing the pattern material solution having adhered on the mask, the step (S190) of drying the pattern material solution, and the step (S196) of subjecting the pattern film to annealing processing.
摘要翻译：目的在于提供掩模形成方法，可以减少制造成本。在待处理构件的正面上形成预定图案的膜的方法被构造成执行改善图案材料溶液与要被加工的构件的粘附的步骤（S 178）在图案材料溶液的待处理部件的表面上填充设置在掩模中的图案形成用凹部的工序（S180），提高图案的膜质量的工序（S188）通过处理图案材料溶液形成的薄膜，去除已经粘附在掩模上的图案材料溶液的步骤（S 188），干燥图案材料溶液的步骤（S190）和步骤（S1996））对图案膜进行退火处理。

8. 发明授权

US06221197B1 Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent 有权
公开(公告)号：US06221197B1
公开(公告)日：2001-04-24
申请号：US09203464
申请日：1998-12-02
申请人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
发明人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
IPC分类号： C09J502
CPC分类号： C03C27/04
摘要： A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

9. 发明授权

US06183883B2 Brazing or soldering material and manufacturing method therefor 失效
标题翻译：钎焊或焊接材料及其制造方法
公开(公告)号：US06183883B2
公开(公告)日：2001-02-06
申请号：US09098777
申请日：1998-06-16
申请人： Yoshiaki Mori , Katsuhiro Takahashi , Takuya Miyakawa , Yasushi Karasawa
发明人： Yoshiaki Mori , Katsuhiro Takahashi , Takuya Miyakawa , Yasushi Karasawa
IPC分类号： B32B1504
CPC分类号： B23K35/0227 , B23K1/20 , B23K35/0222 , C23C14/0694 , Y10S428/926 , Y10T428/12493 , Y10T428/12535
摘要： Brazing or soldering materials which effectively improve the wettability of the brazing alloy or solder without using flux and a method of manufacturing such materials are provided. A metallic base is placed on turntable inside a vacuum chamber. A copper target is affixed to a sputtering electrode above the metallic base. Air is removed from the vacuum chamber through a vacuum outlet to increase the vacuum therein to a specific pressure, and carbon tetrafluoride and argon are introduced from a gas inlet to control the sputter pressure. Thereafter, turntable is rotated while a high frequency voltage is applied between the target and the metallic base to form a halide layer, such as a layer of copper fluoride, on a surface of metallic base.
摘要翻译：提供了有效地提高钎焊合金或焊料的润湿性而不使用焊剂的钎焊或焊接材料以及制造这种材料的方法。金属底座放置在真空室内的转台上。在金属基体上方的溅射电极上附着有铜靶。通过真空出口将空气从真空室中移出，以将其中的真空增加至特定压力，并且从气体入口引入四氟化碳和氩气以控制溅射压力。此后，转盘转动，同时在靶和金属基体之间施加高频电压，以在金属基体的表面上形成卤化物层，例如氟化铜层。

10. 发明授权

US06604672B2 Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent 有权
公开(公告)号：US06604672B2
公开(公告)日：2003-08-12
申请号：US09799931
申请日：2001-03-05
申请人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
发明人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
IPC分类号： C09J500
CPC分类号： C03C27/04
摘要： A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

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