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1. 发明授权

US07308757B2 Intermediate product manufacturing apparatus, and intermediate product manufacturing method 有权
标题翻译：中间产品制造装置和中间产品制造方法
公开(公告)号：US07308757B2
公开(公告)日：2007-12-18
申请号：US10794778
申请日：2004-03-05
申请人： Keiji Fukuhara , Yasutsugu Aoki , Yoshitake Kobayashi , Hisashi Fujimura
发明人： Keiji Fukuhara , Yasutsugu Aoki , Yoshitake Kobayashi , Hisashi Fujimura
IPC分类号： H01L21/673 , H01L21/677
CPC分类号： H01L21/67727 , H01L21/67736 , H01L21/67766 , Y10T29/5313 , Y10T29/53178 , Y10T29/53187 , Y10T29/53261
摘要： An intermediate product manufacturing apparatus for carrying intermediate products and processing the intermediate products with a plurality of processing apparatuses is provided, the apparatus comprising: a plurality of carrying means for carrying the intermediate products to the processing apparatuses; a common processing apparatus provided between the plurality of carrying means, for carrying out a common process on the intermediate products carried by the carrying means; and intermediate product transfer sections provided between the plurality of carrying means, for transferring the intermediate products between the common processing apparatus and the carrying means.
摘要翻译：提供一种用于承载中间产品并用多个处理装置处理中间产品的中间产品制造装置，该装置包括：多个承载装置，用于将中间产品运送到处理装置; 一种通常的处理装置，设置在多个承载装置之间，用于对由承载装置承载的中间产品执行共同的处理; 以及设置在所述多个运送装置之间的用于在所述公共处理装置和所述运送装置之间传送所述中间产品的中间产品转运部。

2. 发明授权

US06604672B2 Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent 有权
公开(公告)号：US06604672B2
公开(公告)日：2003-08-12
申请号：US09799931
申请日：2001-03-05
申请人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
发明人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
IPC分类号： C09J500
CPC分类号： C03C27/04
摘要： A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

3. 发明授权

US07051863B2 Transferring apparatus, carrying apparatus, and transferring method 有权
标题翻译：转运装置，运送装置和转运方法
公开(公告)号：US07051863B2
公开(公告)日：2006-05-30
申请号：US10798975
申请日：2004-03-11
申请人： Hisashi Fujimura , Shuji Tanaka , Yoshitake Kobayashi , Yasutsugu Aoki
发明人： Hisashi Fujimura , Shuji Tanaka , Yoshitake Kobayashi , Yasutsugu Aoki
IPC分类号： B65G43/10
CPC分类号： H01L21/67736 , B65G37/02 , H01L21/67766
摘要： A transferring apparatus is provided between a plurality of carrying apparatuses, each carrying apparatus comprising support means for supporting carried products Wf, guide means for controlling the moving direction of the support means, the guide means being provided along processing apparatuses for processing the carried products Wf, and moving means for moving the support means along the guide means. The transferring apparatus includes synchronization control means for synchronizing the moving means of the one carrying apparatus with the moving means of the other carrying apparatus; and at least one hand-over means for receiving the carried products Wf from the support means of the one carrying apparatus and handing over the carried products Wf to the support means of the other carrying apparatus.
摘要翻译：传送装置设置在多个搬运装置之间，每个搬运装置包括用于支撑被携带物品Wf的支撑装置，用于控制支撑装置的移动方向的引导装置，沿着处理装置设置的引导装置，用于处理被承载物品Wf 以及用于沿着引导装置移动支撑装置的移动装置。传送装置包括同步控制装置，用于使一个传送装置的移动装置与另一个传送装置的移动装置同步; 以及至少一个切换装置，用于从所述一个运送装置的支撑装置接收所携带的产品Wf，并将所携带的产品Wf移交到另一个运送装置的支撑装置。

4. 发明授权

US07182201B2 Wafer carrying apparatus and wafer carrying method 有权
标题翻译：晶圆承载装置和晶片承载方式
公开(公告)号：US07182201B2
公开(公告)日：2007-02-27
申请号：US10792665
申请日：2004-03-03
申请人： Hisashi Fujimura , Shuji Tanaka , Yoshitake Kobayashi , Yasutsugu Aoki
发明人： Hisashi Fujimura , Shuji Tanaka , Yoshitake Kobayashi , Yasutsugu Aoki
IPC分类号： B65G49/06
CPC分类号： H01L21/67742 , H01L21/67712 , H01L21/67718 , Y10S414/135
摘要： A wafer carrying apparatus 20 for carrying intermediate products comprises: a conveyer 40 for carrying the intermediate products in the carrying direction; and a plurality of platforms 41 arranged in the conveyer 40 along the carrying direction of the intermediate products on the conveyer 40, each platform 41 being capable of mounting at least one intermediate product at a position in a direction crossing the carrying direction of the intermediate products on the conveyer 40.
摘要翻译：用于承载中间产品的晶片承载装置20包括：用于在运送方向上运送中间产品的输送机40; 以及沿输送机40上的中间产品的运送方向布置在输送机40中的多个平台41，每个平台41能够在与中间产品的运送方向交叉的方向上的位置处安装至少一个中间产品在输送机40上。

5. 发明申请

US20060163037A1 Transferring apparatus, carrying apparatus, and transferring method 有权
公开(公告)号：US20060163037A1
公开(公告)日：2006-07-27
申请号：US11368061
申请日：2006-03-03
申请人： Hisashi Fujimura , Shuji Tanaka , Yoshitake Kobayashi , Yasutsugu Aoki
发明人： Hisashi Fujimura , Shuji Tanaka , Yoshitake Kobayashi , Yasutsugu Aoki
IPC分类号： B65G43/10
CPC分类号： H01L21/67736 , B65G37/02 , H01L21/67766
摘要： A transferring apparatus is provided between a plurality of carrying apparatuses, each carrying apparatus comprising support means for supporting carried products Wf, guide means for controlling the moving direction of the support means, the guide means being provided along processing apparatuses for processing the carried products Wf, and moving means for moving the support means along the guide means. The transferring apparatus includes synchronization control means for synchronizing the moving means of the one carrying apparatus with the moving means of the other carrying apparatus; and at least one hand-over means for receiving the carried products Wf from the support means of the one carrying apparatus and handing over the carried products Wf to the support means of the other carrying apparatus.

6. 发明授权

US07032739B2 Intermediate product carrying apparatus, and intermediate product carrying method 失效
标题翻译：中间产品运输装置和中间产品运输方式
公开(公告)号：US07032739B2
公开(公告)日：2006-04-25
申请号：US10813569
申请日：2004-03-30
申请人： Shuji Tanaka , Yoshitake Kobayashi , Hisashi Fujimura , Yasutsugu Aoki
发明人： Shuji Tanaka , Yoshitake Kobayashi , Hisashi Fujimura , Yasutsugu Aoki
IPC分类号： B65G29/00
CPC分类号： H01L21/67727 , H01L21/67736 , H01L21/67766 , Y10S414/135 , Y10S414/137
摘要： An intermediate product carrying apparatus is provided for loading a carrier, which is carried between a plurality of process systems and stores a plurality of intermediate products, into the corresponding process system, and then transferring the plurality of intermediate products of the carrier to a single wafer carrying conveyer, which carries the intermediate products in a single wafer state to an intermediate product manufacturing apparatus provided in the process system. The intermediate product carrying apparatus comprising: an intermediate product transfer means provided in the process system, for loading the carrier, which is carried between process systems and which stores the plurality of intermediate products, into the corresponding process system, and transferring the intermediate products.
摘要翻译：提供了一种中间产品运送装置，用于将承载在多个处理系统之间并将多个中间产品储存在相应的处理系统中的载体，然后将载体的多个中间产物转移到单个晶片将单个晶片状态的中间产品运送到设置在处理系统中的中间产品制造装置。所述中间产品运送装置包括：中间产品传送装置，设置在所述处理系统中，用于将承载在处理系统之间并将多个中间产品存储在其中的载体装载到相应的处理系统中并传送中间产品。

7. 发明授权

US06620282B2 Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent 有权
标题翻译：用于固体接合的方法和装置，导体接合方法，包装方法和接合剂以及粘合剂的制造方法
公开(公告)号：US06620282B2
公开(公告)日：2003-09-16
申请号：US09799761
申请日：2001-03-05
申请人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
发明人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
IPC分类号： C23C1400
CPC分类号： C03C27/04
摘要： A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.
摘要翻译：提供了一种用于不使用粘合剂的固体粘合的方法和装置。通过暴露于来自HF气体供给单元24的HF气体和来自氟化处理部分12中的来自蒸气发生器26的水蒸汽的混合物，金属，玻璃或其它结合构件16a和16b的表面被氟化。粘结构件16a 然后将16b与接合处理部分14中的台36上的氟化表面接触。然后将氩引入接合室34.然后通过气缸46将压力施加到第一接合构件16a和第二接合构件16b，并且通过加热器48加热至低于熔点，以将第一和第二粘结构件粘合在一起。

8. 发明授权

US07222721B2 Transferring apparatus, carrying apparatus, and transferring method 有权
标题翻译：转运装置，运送装置和转运方法
公开(公告)号：US07222721B2
公开(公告)日：2007-05-29
申请号：US11368061
申请日：2006-03-03
申请人： Hisashi Fujimura , Shuji Tanaka , Yoshitake Kobayashi , Yasutsugu Aoki
发明人： Hisashi Fujimura , Shuji Tanaka , Yoshitake Kobayashi , Yasutsugu Aoki
IPC分类号： B65G43/10
CPC分类号： H01L21/67736 , B65G37/02 , H01L21/67766
摘要： A transferring apparatus is provided between a plurality of carrying apparatuses, each carrying apparatus comprising support means for supporting carried products Wf, guide means for controlling the moving direction of the support means, the guide means being provided along processing apparatuses for processing the carried products Wf, and moving means for moving the support means along the guide means. The transferring apparatus includes synchronization control means for synchronizing the moving means of the one carrying apparatus with the moving means of the other carrying apparatus; and at least one hand-over means for receiving the carried products Wf from the support means of the one carrying apparatus and handing over the carried products Wf to the support means of the other carrying apparatus.
摘要翻译：传送装置设置在多个搬运装置之间，每个搬运装置包括用于支撑被携带物品Wf的支撑装置，用于控制支撑装置的移动方向的引导装置，沿着处理装置设置的引导装置，用于处理被承载物品Wf 以及用于沿着引导装置移动支撑装置的移动装置。传送装置包括同步控制装置，用于使一个传送装置的移动装置与另一个传送装置的移动装置同步; 以及至少一个切换装置，用于从所述一个运送装置的支撑装置接收所携带的产品Wf，并将所携带的产品Wf移交到另一个运送装置的支撑装置。

9. 发明授权

US06221197B1 Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent 有权
公开(公告)号：US06221197B1
公开(公告)日：2001-04-24
申请号：US09203464
申请日：1998-12-02
申请人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
发明人： Yoshiaki Mori , Yasutsugu Aoki , Takuya Miyakawa
IPC分类号： C09J502
CPC分类号： C03C27/04
摘要： A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

10. 发明授权

US5753886A Plasma treatment apparatus and method 失效
标题翻译：等离子体处理装置及方法
公开(公告)号：US5753886A
公开(公告)日：1998-05-19
申请号：US598082
申请日：1996-02-07
申请人： Naoyuki Iwamura , Yasutsugu Aoki
发明人： Naoyuki Iwamura , Yasutsugu Aoki
IPC分类号： H05H1/46 , B08B7/00 , C23F4/00 , H01J37/32 , H01L21/027 , H01L21/302 , H01L21/3065 , B23K10/00
CPC分类号： H01J37/32357 , B08B7/0042
摘要： A plasma treatment and apparatus which enables improved uniform plasma treatment over the entire surface of an object to be treated, improved yield, and higher treatment speed is provided. In a gas introduction passage, the gas capable of plasma discharge is preexcited to raise its level of excitation. A first pair of plasma generation electrodes downstream along the gas flow passage use the preexcited gas to generate a plasma in a first plasma generation position. Further downstream, a second pair of plasma generation electrodes positioned in a second plasma generation position, where the activated state of the gas activated in the first plasma region is maintained, activates the gas to generate a plasma containing activated gas species. The object to be treated is treated by the activated gas species in the second plasma region.
摘要翻译：提供了能够改善待处理物体的整个表面上的均匀等离子体处理，提高产量和更高处理速度的等离子体处理和设备。在气体导入通道中，能够等离子体放电的气体预先激发以提高其激发水平。沿着气体流动通道下游的第一对等离子体产生电极使用预激发气体在第一等离子体产生位置中产生等离子体。进一步下游，位于第二等离子体产生位置的第二对等离子体产生电极，其中维持在第一等离子体区域中激活的气体的激活状态，激活气体以产生含有活性气体物质的等离子体。待处理的物体由第二等离子体区域中的活化气体物质处理。

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