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    • 7. 发明授权
    • Memory device including resistance change layer as storage node and method(s) for making the same
    • 存储器件包括作为存储节点的电阻变化层及其制造方法
    • US07507674B2
    • 2009-03-24
    • US11270565
    • 2005-11-10
    • Yoon-Dong ParkWon-Joo KimSang-Hun Jeon
    • Yoon-Dong ParkWon-Joo KimSang-Hun Jeon
    • H01L21/461
    • H01L27/24Y10S438/947
    • A method for manufacturing a memory device including a resistance change layer as a storage node according to example embodiment(s) of the present invention and a memory device made by the method(s) are provided. Pursuant to example embodiments of the present invention, the method may include stacking (sequentially or otherwise) a conductive material layer, a diode layer and a data storage layer on a bottom layer, forming a first material layer on the data storage layer, forming a first hole exposing the data storage layer in the first material layer, forming a first spacer with a second material layer on the sidewall of the first hole, filling the first hole with a third material layer and covering the first spacer; removing the first material layer, forming a second spacer with a fourth material layer on the sidewall of the first spacer; removing the third material layer, and forming a second hole exposing the bottom layer in a first stack structure using the first and second spacers as a mask. These operations may result in the formation of bit lines and word lines as described.
    • 提供一种用于制造包括根据本发明的示例性实施例的作为存储节点的电阻变化层的存储器件的方法和由该方法制造的存储器件。 根据本发明的示例性实施例,该方法可以包括在底层上层叠(顺序地或以其他方式)导电材料层,二极管层和数据存储层,在数据存储层上形成第一材料层,形成 第一孔暴露第一材料层中的数据存储层,在第一孔的侧壁上形成具有第二材料层的第一间隔物,用第三材料层填充第一孔并覆盖第一间隔物; 去除所述第一材料层,在所述第一间隔物的侧壁上形成具有第四材料层的第二间隔物; 去除第三材料层,并且使用第一和第二间隔件作为掩模,形成以第一堆叠结构暴露底层的第二孔。 这些操作可能导致如所描述的位线和字线的形成。