专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100093260A1 Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method 有权
标题翻译：用于选择用于抛光终点检测的光的波长的图的制作方法，用于选择用于抛光终点检测的光的波长的选择方法和装置，抛光终点检测方法，抛光终点检测装置和抛光监测方法
公开(公告)号：US20100093260A1
公开(公告)日：2010-04-15
申请号：US12461533
申请日：2009-08-14
申请人： Yoichi Kobayashi , Noburu Shimizu , Shinrou Ohta , Toshifumi Kimba , Masaki Kinoshita
发明人： Yoichi Kobayashi , Noburu Shimizu , Shinrou Ohta , Toshifumi Kimba , Masaki Kinoshita
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.
摘要翻译：提供了一种制造用于选择光学抛光终点检测中的光的波长的图的方法。该方法包括通过抛光垫抛光具有膜的基板的表面; 在基板的研磨过程中将光施加到基板的表面并接收来自基板的反射光; 计算各波长的反射光的相对反射率; 确定反射光的波长，其指示随抛光时间变化的相对反射率的局部最大点和局部最小点; 识别指示表示局部最大点和局部最小点的波长的时间点; 并且将由波长相对应的波长和时间点指定的坐标绘制到具有指示光的波长和抛光时间的坐标轴的坐标系上。

2. 发明申请

US20090130956A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090130956A1
公开(公告)日：2009-05-21
申请号：US12292453
申请日：2008-11-19
申请人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
发明人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
IPC分类号： B24B49/12 , B24B7/00
CPC分类号： B24B37/005 , B24B49/12 , B24B49/16 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for holding a workpiece having a surface conductive film, and pressing the conductive film against the polishing surface to polish the conductive film; an optical sensor for monitoring the polishing state of the conductive film by emitting light toward the conductive film of the workpiece held by the top ring, receiving reflected light from the conductive film, and measuring a change in the reflectance of the reflected light; and a control section for controlling a pressure at which the workpiece is pressed on the polishing surface.
摘要翻译：抛光装置可以抛光和除去额外的导电膜，同时防止腐蚀的发生而不降低生产量。抛光装置包括：具有抛光表面的抛光台; 用于保持具有表面导电膜的工件的顶环，并将导电膜压靠在抛光表面上以抛光导电膜; 光传感器，用于通过向由顶环保持的工件的导电膜发射光，接收来自导电膜的反射光并测量反射光的反射率的变化来监测导电膜的抛光状态; 以及控制部，用于控制在抛光面上压入工件的压力。

3. 发明授权

US08388408B2 Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method 有权
标题翻译：用于选择用于抛光端点检测的光的波长的图的制作方法，用于选择用于抛光端点检测的光的波长的选择方法和抛光终点检测方法
公开(公告)号：US08388408B2
公开(公告)日：2013-03-05
申请号：US12461533
申请日：2009-08-14
申请人： Yoichi Kobayashi , Noburu Shimizu , Shinrou Ohta
发明人： Yoichi Kobayashi , Noburu Shimizu , Shinrou Ohta
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B49/12 , B24B37/013
摘要： A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.
摘要翻译：提供了一种制造用于选择光学抛光终点检测中的光的波长的图的方法。该方法包括通过抛光垫抛光具有膜的基板的表面; 在基板的研磨过程中将光施加到基板的表面并接收来自基板的反射光; 计算各波长的反射光的相对反射率; 确定反射光的波长，其指示随抛光时间变化的相对反射率的局部最大点和局部最小点; 识别指示表示局部最大点和局部最小点的波长的时间点; 并且将由波长相对应的波长和时间点指定的坐标绘制到具有指示光的波长和抛光时间的坐标轴的坐标系上。

4. 发明授权

US07780503B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07780503B2
公开(公告)日：2010-08-24
申请号：US12292453
申请日：2008-11-19
申请人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
发明人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/005 , B24B49/12 , B24B49/16 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for holding a workpiece having a surface conductive film, and pressing the conductive film against the polishing surface to polish the conductive film; an optical sensor for monitoring the polishing state of the conductive film by emitting light toward the conductive film of the workpiece held by the top ring, receiving reflected light from the conductive film, and measuring a change in the reflectance of the reflected light; and a control section for controlling a pressure at which the workpiece is pressed on the polishing surface.
摘要翻译：抛光装置可以抛光和除去额外的导电膜，同时防止腐蚀的发生而不降低生产量。抛光装置包括：具有抛光表面的抛光台; 用于保持具有表面导电膜的工件的顶环，并且将导电膜压靠在抛光表面上以抛光导电膜; 光传感器，用于通过向由顶环保持的工件的导电膜发射光，接收来自导电膜的反射光并测量反射光的反射率的变化来监测导电膜的抛光状态; 以及控制部，用于控制在抛光面上压入工件的压力。

5. 发明授权

US07960188B2 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US07960188B2
公开(公告)日：2011-06-14
申请号：US12465024
申请日：2009-05-13
申请人： Shinrou Ohta , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
发明人： Shinrou Ohta , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
IPC分类号： H01L21/00 , H01L21/302 , G01R31/26
CPC分类号： H01L22/26 , H01L21/3212 , H01L21/67219 , H01L22/14
摘要： A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.
摘要翻译：描述了在其上抛光具有金属膜的基板的方法。基板具有由金属膜的一部分形成的金属互连。抛光方法包括进行第一抛光处理，在第一抛光处理之后，在第二抛光处理之后进行去除阻挡膜的第二抛光工艺，进行抛光绝缘膜的第三抛光工艺。在第二抛光工艺和第三抛光工艺期间，用涡流传感器监测衬底的抛光状态，并且当涡流传感器的输出信号达到预定阈值时，第三抛光处理结束。

6. 发明申请

US20090286332A1 POLISHING METHOD 有权
标题翻译：抛光方法
公开(公告)号：US20090286332A1
公开(公告)日：2009-11-19
申请号：US12465024
申请日：2009-05-13
申请人： Shinrou OHTA , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
发明人： Shinrou OHTA , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
IPC分类号： H01L21/66
CPC分类号： H01L22/26 , H01L21/3212 , H01L21/67219 , H01L22/14
摘要： A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film, during the second polishing process and the third polishing process, monitoring a polishing state of the substrate with an eddy current sensor, and terminating the third polishing process when an output signal of the eddy current sensor reaches a predetermined threshold.
摘要翻译：描述了在其上抛光具有金属膜的基板的方法。基板具有由金属膜的一部分形成的金属互连。抛光方法包括：进行第一抛光处理后的第一抛光处理，在第一抛光处理之后，在第二抛光处理之后执行去除阻挡膜的第二抛光工艺，进行抛光绝缘膜的第三抛光处理第二抛光工艺和第三抛光工艺，用涡流传感器监测衬底的抛光状态，并且当涡流传感器的输出信号达到预定阈值时终止第三抛光处理。

7. 发明授权

US09401293B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US09401293B2
公开(公告)日：2016-07-26
申请号：US13330881
申请日：2011-12-20
申请人： Itsuki Kobata , Yoichi Kobayashi , Katsutoshi Ono , Masaki Kinoshita , Toshifumi Kimba
发明人： Itsuki Kobata , Yoichi Kobayashi , Katsutoshi Ono , Masaki Kinoshita , Toshifumi Kimba
IPC分类号： B24B49/12 , B24B37/10 , B24B37/30 , B24B37/013 , H01L21/67 , H01L21/687 , B24B37/04 , B24B37/005
CPC分类号： B24B37/26 , B24B37/005 , B24B37/013 , B24B37/04 , B24B37/042 , B24B37/10 , B24B49/12 , H01L21/31053 , H01L21/67075 , H01L21/67092 , H01L21/67253 , H01L21/68721 , H01L22/26
摘要： A polishing apparatus for polishing a substrate includes a polishing table holding a polishing pad, a top ring configured to press the substrate against the polishing pad, and first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate. The polishing apparatus also includes spectroscopes each configured to measure at each wavelength an intensity of the reflected light received, and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.
摘要翻译：用于抛光基板的抛光装置包括：保持抛光垫的抛光台，被配置为将基板压靠在抛光垫上的顶环;以及第一和第二光学头，每个被配置为将光施加到基板并且接收来自底物。抛光装置还包括分别被配置成在每个波长处测量接收到的反射光的强度，以及处理器，被配置为产生指示反射光的强度和波长之间的关系的光谱。第一光学头被布置为面对基板的中心，并且第二光学头被布置成面对基板的周边部分。

8. 发明申请

US20120164917A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20120164917A1
公开(公告)日：2012-06-28
申请号：US13330881
申请日：2011-12-20
申请人： Itsuki KOBATA , Yoichi Kobayashi , Katsutoshi Ono , Masaki Kinoshita , Toshifumi Kimba
发明人： Itsuki KOBATA , Yoichi Kobayashi , Katsutoshi Ono , Masaki Kinoshita , Toshifumi Kimba
IPC分类号： B24B49/00
CPC分类号： B24B37/26 , B24B37/005 , B24B37/013 , B24B37/04 , B24B37/042 , B24B37/10 , B24B49/12 , H01L21/31053 , H01L21/67075 , H01L21/67092 , H01L21/67253 , H01L21/68721 , H01L22/26
摘要： A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.
摘要翻译：提供了用于研磨衬底的抛光装置。抛光装置包括：抛光台，其保持抛光垫; 顶环，构造成将衬底压靠在抛光垫上; 第一和第二光学头，每个被配置为将光施加到衬底并且接收来自衬底的反射光; 每个光谱分别被配置成在每个波长处测量接收到的反射光的强度; 以及处理器，被配置为产生指示反射光的强度和波长之间的关系的光谱。第一光学头被布置为面对基板的中心，并且第二光学头被布置成面对基板的周边部分。

9. 发明授权

US09068814B2 Polishing monitoring method, polishing apparatus and monitoring apparatus 有权
标题翻译：抛光监测方法，抛光装置和监测装置
公开(公告)号：US09068814B2
公开(公告)日：2015-06-30
申请号：US12285674
申请日：2008-10-10
申请人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
发明人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
IPC分类号： G01B7/06
CPC分类号： G01B7/105
摘要： A method monitors a change in thickness of a conductive film brought into sliding contact with a polishing surface of a polishing pad using an eddy current sensor. The output signal of the eddy current sensor includes two signals corresponding to a resistance component and an inductive reactance component of an impedance of an electric circuit including a coil of the eddy current sensor. The method includes acquiring the output signal of the eddy current sensor when the eddy current sensor is facing the conductive film, defining the two signals as coordinates on a coordinate system, repeating the acquiring of the output signal and the defining of the coordinates, determining a center of curvature of an arc specified by at least three sets of coordinates on the coordinate system, determining an angle of inclination of a line connecting the center of curvature and a latest one of the at least three sets of coordinates, and monitoring a change in thickness of the conductive film by monitoring a change in the angle of inclination.
摘要翻译：一种方法使用涡流传感器监测与抛光垫的抛光表面滑动接触的导电膜的厚度变化。涡电流传感器的输出信号包括对应于包括涡流传感器的线圈的电路的阻抗的电阻分量和电抗分量的两个信号。该方法包括当涡流传感器面向导电膜时获取涡流传感器的输出信号，将两个信号定义为坐标系上的坐标，重复获取输出信号和定义坐标，确定由坐标系上的至少三组坐标指定的圆弧的曲率中心，确定连接曲率中心的直线和最小三个坐标系中的最近一个的线的倾斜角度，通过监测倾斜角度的变化来确定导电膜的厚度。

10. 发明授权

US07214122B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07214122B2
公开(公告)日：2007-05-08
申请号：US11274112
申请日：2005-11-16
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.
摘要翻译：基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。抛光垫在其中形成有通孔。基板研磨装置还具有发光和接收装置，用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光，以测量半导体衬底上的膜。发光和接收装置设置在抛光台中。衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。供给通道具有可拆卸地安装在抛光台上的出口部分。衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式