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1. 发明授权

US07240422B2 Apparatus for semiconductor chip detachment 有权
标题翻译：半导体芯片拆卸装置
公开(公告)号：US07240422B2
公开(公告)日：2007-07-10
申请号：US10843826
申请日：2004-05-11
申请人： Yiu Ming Cheung , Chou Kee Liu , Ching Hong Yiu , Chi Ming Chong
发明人： Yiu Ming Cheung , Chou Kee Liu , Ching Hong Yiu , Chi Ming Chong
IPC分类号： B23P19/00
CPC分类号： H01L21/6838 , H01L21/67132 , H01L21/67144 , H01L2221/68322 , Y10S156/943 , Y10T29/4913 , Y10T29/49815 , Y10T29/53091 , Y10T29/53191 , Y10T29/53274 , Y10T156/1978 , Y10T156/1983
摘要： An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.
摘要翻译：提供一种用于将半导体芯片从其上安装有的胶带分离的装置和方法。该装置包括适于在芯片的位置处接触粘合带的平台和联接到平台的保持力发生器，用于沿远离芯片的方向拉伸胶带。升降装置可从平台投射，该平台可横向跨越平台的表面并相对于平台垂直地移动以升高芯片。通过在提升芯片的同时将升降装置移动跨越芯片的宽度，可以实现芯片的控制提升和芯片与胶带之间的分层传播。

2. 发明申请

US20050274457A1 Peeling device for chip detachment 审中-公开
标题翻译：剥离装置用于芯片拆卸
公开(公告)号：US20050274457A1
公开(公告)日：2005-12-15
申请号：US10857067
申请日：2004-05-28
申请人： Yiu Ming Cheung , Chi Ming Chong , Ching Hong Yiu
发明人： Yiu Ming Cheung , Chi Ming Chong , Ching Hong Yiu
IPC分类号： H01L21/67 , H01L21/00 , H01L21/52 , C09J1/00 , B32B1/00 , H01L21/301
CPC分类号： H01L21/67132 , Y10T156/1179 , Y10T156/1983
摘要： A peeling device is provided for detachment of a chip from an adhesive tape on which it is mounted. The device comprises a platform including a first surface and a raised contact surface set at a determinate height with respect to the first surface. The raised contact surface has a width that is smaller than a width of the chip for contacting the adhesive tape at a position of the chip. Further, an elevation device is projectable from the raised contact surface and movable with respect to the platform for lifting the chip away from the adhesive tape.
摘要翻译：设置剥离装置用于从安装有胶带的胶带剥离芯片。该装置包括平台，该平台包括相对于第一表面设置在确定高度的第一表面和凸起的接触表面。凸起的接触表面的宽度小于在芯片的位置处与胶带接触的芯片的宽度。此外，升降装置可从凸起的接触表面突出并且相对于平台可移动以将芯片从胶带上提起。

3. 发明授权

US06886997B2 Apparatus and method for active alignment of optical components 有权
标题翻译：用于光学部件的主动对准的装置和方法
公开(公告)号：US06886997B2
公开(公告)日：2005-05-03
申请号：US10372362
申请日：2003-02-24
申请人： Yiu Ming Cheung , Chou Kee Peter Liu , Ching Hong Yiu
发明人： Yiu Ming Cheung , Chou Kee Peter Liu , Ching Hong Yiu
IPC分类号： G02B6/42 , G02B6/26
CPC分类号： G02B6/4225 , G02B6/4227 , G02B6/4237
摘要： The invention provides an apparatus and method for the active alignment and coupling of separate optical components consisting of a light-emitting component and a light-receiving component. It comprises first alignment means having a relatively lower optical resolving power stage that is adapted to perform coarse alignment of the light-emitting component to locate an approximate location of its point of highest intensity, and second alignment means having a relatively higher optical resolving power stage that is adapted to perform fine alignment of the light-emitting component to locate a more precise location of the said point of highest intensity. Accordingly, coarse alignment may be performed using a multi-mode fiber and fine alignment may be performed using a single-mode fiber that may further be coupled to the light-emitting component.
摘要翻译：本发明提供了一种用于主动对准和耦合由发光部件和光接收部件组成的分离的光学部件的装置和方法。它包括具有相对较低的光学分辨功率级的第一对准装置，其适于执行发光部件的粗略对准以定位其最高强度点的近似位置，以及具有相对较高的光学分辨功率级的第二对准装置其适于执行发光部件的精细对准以定位所述最高强度点的更精确的位置。因此，可以使用多模光纤执行粗略对准，并且可以使用可以进一步耦合到发光部件的单模光纤进行精细对准。

4. 发明授权

US07182118B2 Pick and place assembly for transporting a film of material 有权
标题翻译：拾取和放置用于运输材料膜的组装
公开(公告)号：US07182118B2
公开(公告)日：2007-02-27
申请号：US10452993
申请日：2003-06-02
申请人： Yiu Ming Cheung , Chi Ming Chong
发明人： Yiu Ming Cheung , Chi Ming Chong
IPC分类号： B29C65/78
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/6838 , H01L24/29 , H01L24/743 , H01L2224/27334 , H01L2224/2919 , H01L2224/83101 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2224/8388 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , Y10T156/171 , Y10T156/1744 , H01L2924/00
摘要： The invention provides a pick and place assembly for transferring a film of material. The assembly comprises a collet having a substantially convex contact surface for contacting the film, the collet including a vacuum suction device operative to generate a force to hold the film. The film may comprise a thermoplastic adhesive tape or B-stage thermoset epoxy coated film.
摘要翻译：本发明提供了一种用于转移材料膜的拾取和放置组件。组件包括具有用于接触薄膜的基本凸形的接触表面的夹头，该夹头包括用于产生保持薄膜的力的真空抽吸装置。该膜可以包含热塑性胶带或B级热固性环氧涂层膜。

5. 发明授权

US08026126B2 Apparatus and method for thin die detachment 有权
标题翻译：薄型脱模装置及方法
公开(公告)号：US08026126B2
公开(公告)日：2011-09-27
申请号：US10628503
申请日：2003-07-28
申请人： Yiu Ming Cheung , Chi Ming Chong , Tat Wing Lee , Ka Lok Leung
发明人： Yiu Ming Cheung , Chi Ming Chong , Tat Wing Lee , Ka Lok Leung
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L2221/68322
摘要： The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die.
摘要翻译：本发明提供了一种用于薄模拆卸的装置和方法，其涉及使用夹头来保持和拆卸安装在粘合剂膜的粘合剂表面上的模具。包括多个顶出销的喷射器装置用于使所述模具从粘合剂表面部分地分层，以便由夹头分离。每个推顶销可操作以在基本上在模具的角落处的位置处接触和升起与粘合剂表面相对的第二表面，以在距离所述模具的边缘预定距离内分离。

6. 发明授权

US07470120B2 Configurable die detachment apparatus 有权
标题翻译：可配置的脱模装置
公开(公告)号：US07470120B2
公开(公告)日：2008-12-30
申请号：US11292901
申请日：2005-12-01
申请人： Yiu Ming Cheung
发明人： Yiu Ming Cheung
IPC分类号： B29C43/50 , B29C45/40 , B29C51/44
CPC分类号： H01L21/67132 , H01L21/6836 , H01L2221/68327
摘要： A configurable die detachment apparatus is provided that can be used to handle a wide range of die sizes. The apparatus comprises a pin mounting assembly having a plurality of pin sites for selectively mounting ejector pins in a desired configuration on some of the pin sites and a vacuum enclosure enclosing the pin mounting assembly. The vacuum enclosure has a support platform comprising a plurality of openings that are sized and arranged to accommodate different configurations of ejector pins mounted on the pin mounting assembly, the ejector pins being drivable to project through the openings towards a die to be detached.
摘要翻译：提供了一种可配置的脱模装置，可用于处理各种模具尺寸。该装置包括销安装组件，其具有多个销位置，用于选择性地将推出销置于一些销位置上的期望配置中，以及封闭销安装组件的真空外壳。所述真空外壳具有支撑平台，所述支撑平台包括多个开口，所述多个开口的尺寸和布置适于容纳安装在所述销钉安装组件上的顶出销的不同构型，所述顶出销可被驱动以穿过所述开口朝向待分离的模具突出。

7. 发明授权

US06711873B2 Apparatus for loading electronic packages of varying sizes 有权
标题翻译：用于装载不同尺寸的电子封装的装置
公开(公告)号：US06711873B2
公开(公告)日：2004-03-30
申请号：US10041426
申请日：2001-11-07
申请人： Yiu Ming Cheung , Hoi Fung Tsang , Yui Ko Wong
发明人： Yiu Ming Cheung , Hoi Fung Tsang , Yui Ko Wong
IPC分类号： B65B5710
CPC分类号： H01L21/67271 , H01L21/67796
摘要： Packages of varying dimensions are loaded into a plurality of electrical package tubes. A guide arrangement is provided, which is programmable to receive the electrical packages by automatically configuring to accommodate the varying dimensions of the electrical packages, the configuring being performed without manual intervention, and a receiving arrangement is provided to receive the electrical package tubes and configured to individually align the electrical package tubes with the guide arrangement to receive the electrical packages. Upon application of a feeding force to the electrical packages, the guide arrangement guides the electrical packages into the electrical package tubes.
摘要翻译：不同尺寸的包装被装载到多个电气包装管中。提供了一种引导装置，其可编程以通过自动配置以容纳电气封装的变化尺寸来接收电气封装，该配置在没有手动干预的情况下进行，并且提供接收装置以接收电气封装管并且被配置为将电气封装管与引导装置单独对准以接收电气封装。当向电气包装件施加进给力时，引导装置将电气包装引导到电气包装管中。

8. 发明授权

US07303647B2 Driving mechanism for chip detachment apparatus 有权
标题翻译：排屑装置的驱动机构
公开(公告)号：US07303647B2
公开(公告)日：2007-12-04
申请号：US10977674
申请日：2004-10-29
申请人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
发明人： Yiu Ming Cheung , Shiqiang Yao , Gary Peter Widdowson
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , H01L21/67132 , H01L21/67144 , H01L2221/68381 , H01L2221/68386 , Y10S156/932 , Y10S438/976 , Y10T156/1179 , Y10T156/1978 , Y10T156/1983
摘要： A driving mechanism and method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism includes a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axis perpendicular to the first axis. The first actuator is configured for programmable movement along the first axis with respect to the chip in conjunction with the second actuator for movement adjacent the width of the chip to provide controlled lifting of the chip for propagation of delamination between the chip and the adhesive tape.
摘要翻译：提供驱动机构和方法，用于驱动适于将芯片从安装有芯片的胶带剥离的拆卸工具。该机构包括联接到分离工具的第一致动器并且可操作地驱动分离工具沿着基本上垂直于芯片的表面的第一轴线移动;以及第二致动器，其联接到分离工具并且可操作以驱动拆卸工具沿垂直于第一轴线的第二轴线相邻于芯片的宽度移动。第一致动器被配置用于相对于芯片与第二致动器相关的第一轴线的可编程移动，以便相邻于芯片的宽度移动，以提供芯片的受控提升，以在芯片和胶带之间传播分层。

9. 发明授权

US08967452B2 Thermal compression bonding of semiconductor chips 有权
标题翻译：半导体芯片的热压接
公开(公告)号：US08967452B2
公开(公告)日：2015-03-03
申请号：US13448866
申请日：2012-04-17
申请人： Yiu Ming Cheung , Tsan Yin Peter Lo , Ming Li , Yick Hong Mak , Ka San Lam
发明人： Yiu Ming Cheung , Tsan Yin Peter Lo , Ming Li , Yick Hong Mak , Ka San Lam
IPC分类号： B23K31/02 , B23K26/20
CPC分类号： H01L24/81 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/75251 , H01L2224/75263 , H01L2224/75744 , H01L2224/75753 , H01L2224/78252 , H01L2224/78253 , H01L2224/81048 , H01L2224/81121 , H01L2224/81191 , H01L2224/81203 , H01L2224/81224 , H01L2224/81907 , H01L2224/81986 , H01L2224/9205 , H01L2924/07802 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要： A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.
摘要翻译：通过首先将芯片上的电触点对准到将要安装裸片的基板上的接合焊盘，准备用于热压接的裸片。这些电触头用接合工具保持在基板上的接合焊盘上。通过向模具的一部分提供热量将模具部分地粘合到基板上，以将其温度升高到电触点中焊料的熔点以使熔化至少一些焊料。然后热压整个模头并将其加热到电触头的焊料的熔点以上，使得电接触部分外部的电触点的焊料也被熔化，以将模具结合到衬底。

10. 发明申请

US20090032186A1 VIBRATION-INDUCED DIE DETACHMENT SYSTEM 有权
标题翻译：振动诱导的DIE分离系统
公开(公告)号：US20090032186A1
公开(公告)日：2009-02-05
申请号：US11830986
申请日：2007-07-31
申请人： Yiu Ming Cheung , Man Kit Chow
发明人： Yiu Ming Cheung , Man Kit Chow
IPC分类号： B29C63/00
CPC分类号： H01L21/67132 , Y10S438/976 , Y10T156/1121 , Y10T156/1179 , Y10T156/1922 , Y10T156/1983
摘要： A die is detachable from an adhesive tape on which the die is mounted with a die detachment tool comprising a vacuum enclosure that is operative to provide a vacuum suction on the adhesive tape. One or more ejector pins are housed in the vacuum enclosure and are projectable from the vacuum enclosure for lifting the die and adhesive tape. A vibrational tool is housed in the vacuum enclosure adjacent to the ejector pins and it is projectable from the vacuum enclosure to contact a portion of the adhesive tape at which the die is located. The vibrational tool is further operative to oscillate the adhesive tape and die for promoting delamination of the die from the adhesive tape.
摘要翻译：模具可从其上安装有模具的胶带拆卸，其中模具拆卸工具包括真空外壳，该真空外壳可用于在胶带上提供真空吸力。一个或多个推出销被容纳在真空外壳中，并且可从真空外壳中投射以提升模具和胶带。振动工具被容纳在与排出销相邻的真空外壳中，并且可从真空外壳中投射以接触模具所在的粘合带的一部分。振动工具进一步操作以使粘合带和模具振动，以促进模具从胶带剥离。

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