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1. 发明申请

US20050274457A1 Peeling device for chip detachment 审中-公开
标题翻译：剥离装置用于芯片拆卸
公开(公告)号：US20050274457A1
公开(公告)日：2005-12-15
申请号：US10857067
申请日：2004-05-28
申请人： Yiu Ming Cheung , Chi Ming Chong , Ching Hong Yiu
发明人： Yiu Ming Cheung , Chi Ming Chong , Ching Hong Yiu
IPC分类号： H01L21/67 , H01L21/00 , H01L21/52 , C09J1/00 , B32B1/00 , H01L21/301
CPC分类号： H01L21/67132 , Y10T156/1179 , Y10T156/1983
摘要： A peeling device is provided for detachment of a chip from an adhesive tape on which it is mounted. The device comprises a platform including a first surface and a raised contact surface set at a determinate height with respect to the first surface. The raised contact surface has a width that is smaller than a width of the chip for contacting the adhesive tape at a position of the chip. Further, an elevation device is projectable from the raised contact surface and movable with respect to the platform for lifting the chip away from the adhesive tape.
摘要翻译：设置剥离装置用于从安装有胶带的胶带剥离芯片。该装置包括平台，该平台包括相对于第一表面设置在确定高度的第一表面和凸起的接触表面。凸起的接触表面的宽度小于在芯片的位置处与胶带接触的芯片的宽度。此外，升降装置可从凸起的接触表面突出并且相对于平台可移动以将芯片从胶带上提起。

2. 发明授权

US07240422B2 Apparatus for semiconductor chip detachment 有权
标题翻译：半导体芯片拆卸装置
公开(公告)号：US07240422B2
公开(公告)日：2007-07-10
申请号：US10843826
申请日：2004-05-11
申请人： Yiu Ming Cheung , Chou Kee Liu , Ching Hong Yiu , Chi Ming Chong
发明人： Yiu Ming Cheung , Chou Kee Liu , Ching Hong Yiu , Chi Ming Chong
IPC分类号： B23P19/00
CPC分类号： H01L21/6838 , H01L21/67132 , H01L21/67144 , H01L2221/68322 , Y10S156/943 , Y10T29/4913 , Y10T29/49815 , Y10T29/53091 , Y10T29/53191 , Y10T29/53274 , Y10T156/1978 , Y10T156/1983
摘要： An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.
摘要翻译：提供一种用于将半导体芯片从其上安装有的胶带分离的装置和方法。该装置包括适于在芯片的位置处接触粘合带的平台和联接到平台的保持力发生器，用于沿远离芯片的方向拉伸胶带。升降装置可从平台投射，该平台可横向跨越平台的表面并相对于平台垂直地移动以升高芯片。通过在提升芯片的同时将升降装置移动跨越芯片的宽度，可以实现芯片的控制提升和芯片与胶带之间的分层传播。

3. 发明授权

US06886997B2 Apparatus and method for active alignment of optical components 有权
标题翻译：用于光学部件的主动对准的装置和方法
公开(公告)号：US06886997B2
公开(公告)日：2005-05-03
申请号：US10372362
申请日：2003-02-24
申请人： Yiu Ming Cheung , Chou Kee Peter Liu , Ching Hong Yiu
发明人： Yiu Ming Cheung , Chou Kee Peter Liu , Ching Hong Yiu
IPC分类号： G02B6/42 , G02B6/26
CPC分类号： G02B6/4225 , G02B6/4227 , G02B6/4237
摘要： The invention provides an apparatus and method for the active alignment and coupling of separate optical components consisting of a light-emitting component and a light-receiving component. It comprises first alignment means having a relatively lower optical resolving power stage that is adapted to perform coarse alignment of the light-emitting component to locate an approximate location of its point of highest intensity, and second alignment means having a relatively higher optical resolving power stage that is adapted to perform fine alignment of the light-emitting component to locate a more precise location of the said point of highest intensity. Accordingly, coarse alignment may be performed using a multi-mode fiber and fine alignment may be performed using a single-mode fiber that may further be coupled to the light-emitting component.
摘要翻译：本发明提供了一种用于主动对准和耦合由发光部件和光接收部件组成的分离的光学部件的装置和方法。它包括具有相对较低的光学分辨功率级的第一对准装置，其适于执行发光部件的粗略对准以定位其最高强度点的近似位置，以及具有相对较高的光学分辨功率级的第二对准装置其适于执行发光部件的精细对准以定位所述最高强度点的更精确的位置。因此，可以使用多模光纤执行粗略对准，并且可以使用可以进一步耦合到发光部件的单模光纤进行精细对准。

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