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1. 发明授权

US07100681B1 Heat dissipation device having heat pipe 有权
标题翻译：具有热管的散热装置
公开(公告)号：US07100681B1
公开(公告)日：2006-09-05
申请号：US11263322
申请日：2005-10-31
申请人： Yi-Qiang Wu , Wei Deng , Liang-Hui Zhao , Gen-Ping Deng
发明人： Yi-Qiang Wu , Wei Deng , Liang-Hui Zhao , Gen-Ping Deng
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/32 , F28F2215/12 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, a plurality of first fins, a plate, a plurality of second fins and two heat pipes. Each heat pipe includes a heat-receiving portion sandwiched between the base and the first fins, a heat-exchange portion sandwiched between the plate and the first fins, a connecting portion connecting the heat-receiving portion and the heat-exchange portion, a heat-discharging portion extending through the plate and inserted into the second fins. At least one of the heat pipes defines two different planes which intercross at the heat-exchange portion of the at least one of the heat pipes.
摘要翻译：散热装置包括基座，多个第一翅片，板，多个第二翅片和两个热管。每个热管包括夹在基座和第一翅片之间的热接收部分，夹在板和第一翅片之间的热交换部分，连接热接收部分和热交换部分的连接部分，热量 - 充电部分延伸穿过板并插入第二鳍片。至少一个热管限定了在至少一个热管的热交换部分处交叉的两个不同的平面。

2. 发明申请

US20070146995A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20070146995A1
公开(公告)日：2007-06-28
申请号：US11306415
申请日：2005-12-27
申请人： Liang-Hui Zhao , Yi-Qiang Wu , Chun-Chi Chen
发明人： Liang-Hui Zhao , Yi-Qiang Wu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat spreader (100) for contacting a heat-generating component, a heat sink (200) mounted on the heat spreader, a fan (300) mounted on the heat sink, a heat-dissipating component (400), and a heat pipe (500) thermally connecting the heat spreader, the heat sink and the heat-dissipating component together. The heat sink comprises a core (210) having an axis substantially perpendicular to the heat spreader, and a plurality of fins (220) outwardly and radially extending from the core.
摘要翻译：散热装置包括用于接触发热部件的散热器（100），安装在散热器上的散热器（200），安装在散热器上的风扇（300），散热部件（400），以及将散热器，散热器和散热部件热连接在一起的热管（500）。散热器包括具有基本上垂直于散热器的轴线的芯部（210）和从芯部向外并径向延伸的多个翅片（220）。

3. 发明申请

US20070121298A1 LOCKING DEVICE FOR HEAT SINK 失效
标题翻译：用于散热的锁定装置
公开(公告)号：US20070121298A1
公开(公告)日：2007-05-31
申请号：US11164593
申请日：2005-11-30
申请人： Liang-Hui Zhao , Yi-Qiang Wu
发明人： Liang-Hui Zhao , Yi-Qiang Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44017 , Y10T24/44026 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a retention module and a clip. The retention module includes a plurality of locking portions. The clip includes a main piece, an operating piece pivotally connecting with the main piece, and a buckling piece pivotally connecting with the operating piece. The main piece includes a pressing beam resting on the heat sink and a clamping portion engaging with a corresponding locking portion of the retention module. By operating the operating piece, the heat dissipation device has two positions, at a first of which a clamping portion of the buckling piece engages with a corresponding locking portion of the retention module and the pressing beam of the main piece presses the heat sink toward the retention module; at a second of the two positions, the clamping portion of the buckling piece disengages from the retention module.
摘要翻译：散热装置包括散热器，保持模块和夹子。保持模块包括多个锁定部分。夹具包括主件，与主件枢转地连接的操作件以及与操作件枢转连接的弯曲件。主件包括搁置在散热器上的按压梁和与保持模块的相应锁定部分接合的夹紧部分。通过操作操作件，散热装置具有两个位置，第一个位置处，该弯曲件的夹持部分与保持模块的相应的锁定部分接合，并且主体的按压杆将散热片朝向保留模块; 在两个位置的第二位置处，弯曲件的夹紧部分与保持模块脱开。

4. 发明申请

US20070051501A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20070051501A1
公开(公告)日：2007-03-08
申请号：US11308472
申请日：2006-03-28
申请人： Yi-Qiang Wu , Liang-Hui Zhao
发明人： Yi-Qiang Wu , Liang-Hui Zhao
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/4006 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (10), a first heat sink (20) disposed on the base (10), a second heat sink (30) attached on top of the first heat sink and a first heat pipe (40) connecting the base and the first heat sink and a pair of second heat pipes (50) connecting the base and the second heat sink.
摘要翻译：散热装置包括基座（10），设置在基座（10）上的第一散热器（20），安装在第一散热器顶部的第二散热器（30）和连接在第一散热器基座和第一散热器以及连接基座和第二散热器的一对第二热管（50）。

5. 发明申请

US20070236885A1 THERMAL MODULE 有权
标题翻译：热模块
公开(公告)号：US20070236885A1
公开(公告)日：2007-10-11
申请号：US11308598
申请日：2006-04-10
申请人： Liang-Hui Zhao , Yi-Qiang Wu
发明人： Liang-Hui Zhao , Yi-Qiang Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a heat spreader (50) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink (60), a heat pipe (70) thermally connecting the heat spreader and the heat sink. A frame (80) is detachably mounted on the heat spreader, for fixing the heat spreader to the printed circuit board so that the heat spreader can thermally contact with the heat-generating device on the printed circuit board. The heat spreader has a simple polygonal configuration. The frame is formed by stamping a metal sheet or plastics injection molding.
摘要翻译：热模块包括用于与安装在印刷电路板上的发热电子装置接触的散热器（50），散热器（60），热连接散热器和散热器的热管（70）。框架（80）可拆卸地安装在散热器上，用于将散热器固定到印刷电路板上，使得散热器能够与印刷电路板上的发热装置热接触。散热器具有简单的多边形配置。框架通过冲压金属板或塑料注射成型而形成。

6. 发明授权

US07542293B2 Thermal module 有权
标题翻译：散热模块
公开(公告)号：US07542293B2
公开(公告)日：2009-06-02
申请号：US11308598
申请日：2006-04-10
申请人： Liang-Hui Zhao , Yi-Qiang Wu
发明人： Liang-Hui Zhao , Yi-Qiang Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a heat spreader (50) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink (60), a heat pipe (70) thermally connecting the heat spreader and the heat sink. A frame (80) is detachably mounted on the heat spreader, for fixing the heat spreader to the printed circuit board so that the heat spreader can thermally contact with the heat-generating device on the printed circuit board. The heat spreader has a simple polygonal configuration. The frame is formed by stamping a metal sheet or plastics injection molding.
摘要翻译：热模块包括用于与安装在印刷电路板上的发热电子装置接触的散热器（50），散热器（60），热连接散热器和散热器的热管（70）。框架（80）可拆卸地安装在散热器上，用于将散热器固定到印刷电路板上，使得散热器能够与印刷电路板上的发热装置热接触。散热器具有简单的多边形配置。框架通过冲压金属板或塑料注射成型而形成。

7. 发明申请

US20050263264A1 Heat sink mounting device 失效
标题翻译：散热片安装装置
公开(公告)号：US20050263264A1
公开(公告)日：2005-12-01
申请号：US10990069
申请日：2004-11-16
申请人： Chun-Chi Chen , Yi-Qiang Wu , Liang-Hui Zhao
发明人： Chun-Chi Chen , Yi-Qiang Wu , Liang-Hui Zhao
IPC分类号： B21B37/58 , G06F1/20 , H01L23/34 , H01L23/40
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A mounting device for a heat sink includes a basis and a pair of operating bodies. Two pair of supporting members are provided on opposite sides of the basis. The operating body includes a pole connecting the supporting members, a pivot member pivotably attached to the pole, and at least a spring member encircling the pole. The pivot member includes a pressing portion adapted for pressing the heat sink. One end of the spring member is fixed on one of the supporting members, and the other end of the spring member is secured with the pivot member. The pivot member is pivotable from a first position to a second position under action of a force and returns back to the first position from the second position under action of the spring member after withdrawing the force.
摘要翻译：用于散热器的安装装置包括基座和一对操作体。在基础的相对侧设置两对支撑构件。操作体包括连接支撑构件的杆，可枢转地附接到杆的枢轴构件和至少围绕杆的弹簧构件。枢轴构件包括适于按压散热器的按压部分。弹簧构件的一端固定在一个支撑构件上，弹簧构件的另一端用枢转构件固定。枢转构件在力的作用下可从第一位置枢转到第二位置，并且在撤回力之后在弹簧构件的作用下从第二位置返回到第一位置。

8. 发明授权

US07493937B2 Heat sink mounting device 失效
标题翻译：散热片安装装置
公开(公告)号：US07493937B2
公开(公告)日：2009-02-24
申请号：US10990069
申请日：2004-11-16
申请人： Chun-Chi Chen , Yi-Qiang Wu , Liang-Hui Zhao
发明人： Chun-Chi Chen , Yi-Qiang Wu , Liang-Hui Zhao
IPC分类号： F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A mounting device for a heat sink includes a basis and a pair of operating bodies. Two pair of supporting members are provided on opposite sides of the basis. The operating body includes a pole connecting the supporting members, a pivot member pivotably attached to the pole, and at least a spring member encircling the pole. The pivot member includes a pressing portion adapted for pressing the heat sink. One end of the spring member is fixed on one of the supporting members, and the other end of the spring member is secured with the pivot member. The pivot member is pivotable from a first position to a second position under action of a force and returns back to the first position from the second position under action of the spring member after withdrawing the force.
摘要翻译：用于散热器的安装装置包括基座和一对操作体。在基础的相对侧设置两对支撑构件。操作体包括连接支撑构件的杆，可枢转地附接到杆的枢轴构件和至少围绕杆的弹簧构件。枢轴构件包括适于按压散热器的按压部分。弹簧构件的一端固定在一个支撑构件上，弹簧构件的另一端用枢转构件固定。枢转构件在力的作用下可从第一位置枢转到第二位置，并且在撤回力之后在弹簧构件的作用下从第二位置返回到第一位置。

9. 发明授权

US07333333B2 Locking device for heat sink 失效
标题翻译：散热器锁定装置
公开(公告)号：US07333333B2
公开(公告)日：2008-02-19
申请号：US11164593
申请日：2005-11-30
申请人： Liang-Hui Zhao , Yi-Qiang Wu
发明人： Liang-Hui Zhao , Yi-Qiang Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44017 , Y10T24/44026 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a retention module and a clip. The retention module includes a plurality of locking portions. The clip includes a main piece, an operating piece pivotally connecting with the main piece, and a buckling piece pivotally connecting with the operating piece. The main piece includes a pressing beam resting on the heat sink and a clamping portion engaging with a corresponding locking portion of the retention module. By operating the operating piece, the heat dissipation device has two positions, at a first of which a clamping portion of the buckling piece engages with a corresponding locking portion of the retention module and the pressing beam of the main piece presses the heat sink toward the retention module; at a second of the two positions, the clamping portion of the buckling piece disengages from the retention module.
摘要翻译：散热装置包括散热器，保持模块和夹子。保持模块包括多个锁定部分。夹具包括主件，与主件枢转地连接的操作件以及与操作件枢转连接的弯曲件。主件包括搁置在散热器上的按压梁和与保持模块的相应锁定部分接合的夹紧部分。通过操作操作件，散热装置具有两个位置，第一个位置处，弯曲件的夹紧部分与保持模块的相应的锁定部分接合，并且主体的按压杆将散热片朝向保留模块; 在两个位置的第二位置处，弯曲件的夹紧部分与保持模块脱开。

10. 发明申请

US20070217155A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070217155A1
公开(公告)日：2007-09-20
申请号：US11308280
申请日：2006-03-15
申请人： Liang-Hui Zhao , Yi-Qiang Wu
发明人： Liang-Hui Zhao , Yi-Qiang Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic element includes a heat spreader (12) for contacting with the electronic element, a conducting member (30) having a lower base plate (32) thermally contacting with the heat spreader and an upper base plate (34) with a plurality of first fins (36) extending downwardly from the upper base plate towards the lower base plate and a connecting portion (33) interconnecting the lower and upper base plate. A plurality of second fins (38) is mounted on the conducting member. A plurality of heat pipes (40) thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins. A fan (20) is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages.
摘要翻译：用于从电子元件散热的散热装置包括用于与电子元件接触的散热器（12），具有与散热器热接触的下基板（32）的导电构件（30）和上基板（34），其具有从所述上基板朝向下基板向下延伸的多个第一散热片（36）和连接所述下基板和上基板的连接部分（33）。多个第二翅片（38）安装在导电构件上。多个热管（40）热连接散热器和导电构件和第二翅片，以将热量从散热器传递到导电构件和第二翅片。风扇（20）安装在第一和第二散热片的空气通道附近，以产生通过空气通道的强制气流。

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