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1. 发明授权

US5899759A Electrical connector for rigid circuit boards 失效
标题翻译：电路板用电连接器
公开(公告)号：US5899759A
公开(公告)日：1999-05-04
申请号：US999156
申请日：1997-12-29
申请人： Yew Thye Yeow , Cuong Van Pham
发明人： Yew Thye Yeow , Cuong Van Pham
IPC分类号： H01R12/57 , H01R12/72 , H05K3/34 , H01R9/09
CPC分类号： H01R12/57 , H01R12/721 , H05K3/3405 , H05K2201/09172 , H05K2201/10386
摘要： There is disclosed herein an electrically conductive coupling for connecting an electrical element to a conductive circuit trace on a printed circuit board, comprising: (1) a finger extending outward from an edge of a rigid printed circuit board, wherein the circuit trace terminates on a first surface of the finger; (2) an electrical connector formed from a metal stamping and comprising: a substantially rectotubular barrel portion being dimensioned so as to provide an interference fit with the finger when the finger is inserted therein; an engaging portion being removably connectable with the electrical element; and a transition portion integral with the barrel portion and engaging portion; wherein the finger is connectably inserted into the barrel portion; and (3) a solidified joint of electrically conductive bonding material disposed on the first surface of the finger, such that the joint electrically couples the circuit trace with the barrel portion of the electrical connector.
摘要翻译：这里公开了用于将电气元件连接到印刷电路板上的导电电路迹线的导电耦合器，其包括：（1）从刚性印刷电路板的边缘向外延伸的手指，其中电路迹线终止于手指的第一表面; （2）由金属冲压件形成的电连接器，包括：基本上直立的筒部，其尺寸被设计成当手指插入其中时提供与手指的过盈配合; 接合部分可拆卸地与电气元件连接; 以及与筒部和接合部一体的过渡部分; 其中所述手指可连接地插入到所述筒部中; 和（3）设置在手指的第一表面上的导电接合材料的固化接头，使得接头将电路迹线与电连接器的镜筒部分电耦合。

2. 发明授权

US06381837B1 Method for making an electronic circuit assembly 失效
标题翻译：制造电子电路组件的方法
公开(公告)号：US06381837B1
公开(公告)日：2002-05-07
申请号：US09148061
申请日：1998-09-04
申请人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
发明人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
IPC分类号： H05K334
CPC分类号： H05K3/4685 , H05K1/111 , H05K3/062 , H05K3/303 , H05K3/328 , H05K3/3442 , H05K3/4007 , H05K2201/0361 , H05K2201/0367 , H05K2201/0373 , H05K2201/09781 , H05K2201/10636 , H05K2201/2036 , H05K2203/049 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156
摘要： A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
摘要翻译：从蚀刻的三金属层结构制造电子电路组件（例如，电路板）的方法，其提供空气桥交叉和从三金属层结构的中间层蚀刻的特殊设计的凸起。凸起形成在特定的电路位置，以提供用于（1）重引线键合，（2）细线接合或（3）直接芯片附接的互连。或者提供（4）用于确保最小焊点间隙高度的提升器，或（5）阻止焊点裂纹扩展的障碍物。

3. 发明授权

US06326241B1 Solderless flip-chip assembly and method and material for same 失效
标题翻译：无焊料倒装芯片组装及方法与材料相同
公开(公告)号：US06326241B1
公开(公告)日：2001-12-04
申请号：US08999153
申请日：1997-12-29
申请人： Robert Edward Belke, Jr. , Brian John Hayden , Cuong Van Pham , Rosa Lynda Nuno , Michael George Todd
发明人： Robert Edward Belke, Jr. , Brian John Hayden , Cuong Van Pham , Rosa Lynda Nuno , Michael George Todd
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L21/563 , H01L24/29 , H01L2224/1134 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.
摘要翻译：一种用于将半导体电子倒装芯片器件组装到电互连衬底的无焊接方法，包括形成多个凸起的电触点和多个接触焊盘的步骤。焊盘的数量和物理位置与电触点对应。垫片和接触配合在一起时。在电气设备和基板之间插入一定数量的塑料材料。塑料材料被加热，使其软化和流动。电子装置和基板一起被推动。推动步骤使熔融的塑料材料从触点和焊盘之间移位。触点和焊盘直接连接，而没有任何粘合剂，焊料或导电填料，以电连接电子器件和衬底。允许塑料材料冷却，由此使电子器件和衬底粘合在一起并电连接。

4. 发明授权

US6126459A Substrate and electrical connector assembly 失效
标题翻译：基板和电连接器组件
公开(公告)号：US6126459A
公开(公告)日：2000-10-03
申请号：US822535
申请日：1997-03-24
申请人： Prathap Amerwai Reddy , Cuong Van Pham , Brian John Hayden , Daniel Edward Farnstrom
发明人： Prathap Amerwai Reddy , Cuong Van Pham , Brian John Hayden , Daniel Edward Farnstrom
IPC分类号： H01R12/65 , H05K1/11 , H01R9/09
CPC分类号： H05K1/119 , H01R12/65 , H05K2201/0191 , H05K2201/09118 , H05K2201/10303
摘要： A substrate and electrical connector assembly including a unitary panel structure with metal conductors having a rigid main body portion, a rigid marginal edge portion, and a thin flexible section extending between the rigid main body portion and the rigid marginal edge portion. The assembly also includes an at least one conductive lead deposited on a surface of the plastic panel structure which extends from the rigid main body portion across the flexible section to the rigid marginal edge portion. Further included is an at least one conductive terminal affixed to the rigid marginal edge portion which is in electrical connection with the at least one conductive lead. The at least one conductive terminal is adapted to receive a mating connector. The flexible section enables the rigid marginal edge portion to move relative to the rigid main body portion.
摘要翻译：一种基板和电连接器组件，包括具有金属导体的整体面板结构，金属导体具有刚性主体部分，刚性边缘部分以及在刚性主体部分和刚性边缘部分之间延伸的薄柔性部分。组件还包括沉积在塑料板结构的表面上的至少一个导电引线，该导电引线从刚性主体部分穿过柔性部分延伸到刚性边缘部分。还包括至少一个固定到刚性边缘部分的导电端子，该刚性边缘部分与至少一个导电引线电连接。所述至少一个导电端子适于接收配合连接器。柔性部分使得刚性边缘部分相对于刚性主体部分移动。

5. 发明授权

US06303992B1 Interposer for mounting semiconductor dice on substrates 失效
标题翻译：用于将半导体裸片安装在基板上的插入器
公开(公告)号：US06303992B1
公开(公告)日：2001-10-16
申请号：US09347542
申请日：1999-07-06
申请人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
IPC分类号： H01L2348
CPC分类号： H01L23/473 , H01L2224/16225
摘要： An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20. The interposer 10 may also include: a sealed cooling channel 28 defined within the interposer body 12; a fluid medium 30 generally filling the cooling channel 28; and a piezoelectric element 26 attached to the interposer body such that the piezoelectric element communicates with the cooling channel 28 and the fluid medium 30, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits 22.
摘要翻译：一种用于将半导体管芯50电耦合到衬底70的插入器10，包括：由介电材料制成并具有接触表面14和相对的接合表面16的插入体本体12; 布置在接触表面14周围的多个接触垫18; 布置在接合表面16的整个区域的多个接合焊盘20; 以及大体上设置在插入体内部的多个导电管道22，使得每个导管22将相应的一个接触焊盘18与相应的一个接合焊盘20连接。插入器10还可以包括：密封的冷却通道 28; 通常填充冷却通道28的流体介质30; 以及压电元件26，其连接到中介体，使得压电元件与冷却通道28和流体介质30连通，压电元件可操作地耦合到至少两个导电导管22。

6. 发明授权

US06251219B1 Method and apparatus for use in assembling electronic devices 失效
标题翻译：用于组装电子设备的方法和装置
公开(公告)号：US06251219B1
公开(公告)日：2001-06-26
申请号：US09160202
申请日：1998-09-17
申请人： Philip H. Chen , Dennis M. Gibson , Cuong Van Pham
发明人： Philip H. Chen , Dennis M. Gibson , Cuong Van Pham
IPC分类号： H05K330
CPC分类号： H01L21/52 , Y10T29/4913 , Y10T29/53178 , Y10T156/1092 , Y10T156/1744
摘要： A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an electronic device. An adhesive applying device, such as a screen printer, applies adhesive to the backside of each circuit component. The circuit components may then be transferred onto a substrate by the use of a piston transfer device, for instance. Preferably, all the circuit components are transferred substantially simultaneously.
摘要翻译：固定装置将多个电路组件以基本上共面的关系保持在电路组件之间相同的空间关系中，组件旨在具有作为电子设备的一部分的电路板或衬底。诸如丝网印刷机的粘合剂施加装置将粘合剂施加到每个电路部件的背面。然后可以通过使用例如活塞传送装置将电路部件转移到基板上。优选地，所有电路组件基本上同时传送。

7. 发明授权

US5921460A Method of soldering materials supported on low-melting substrates 失效
标题翻译：焊接在低熔点基材上的材料的方法
公开(公告)号：US5921460A
公开(公告)日：1999-07-13
申请号：US870049
申请日：1997-06-05
申请人： Mark Stephen Topping , Cuong Van Pham , Brian John Hayden
发明人： Mark Stephen Topping , Cuong Van Pham , Brian John Hayden
IPC分类号： B23K20/10 , H01L21/607 , H05K3/34 , H05K3/36
CPC分类号： H01L24/80 , B23K20/10 , H05K3/3494 , H05K3/363 , B23K2201/36 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K2203/0195 , H05K2203/0285 , H05K3/3421 , H05K3/3463
摘要： A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate. The method facilitates making electrical connections for completing an electronic circuit unit that is supported on a low temperature melting substrate and comprises (a) positioning together first and second conductive terminals for said circuit with a solder deposit therebetween to form an assembly, at least one of the terminals of such assembly being supported directly on such low temperature melting substrate; (b) gripping the assembly between an ultrasonic motion generating horn and an anvil, while exciting the horn to apply ultrasonic vibration to the first terminal to provide sufficient shearing energy that frictionally rubs at least one surface of the solder deposit in a rubbing direction generally parallel to said one surface to rapidly heat and melt the solder deposit; and (c) essentially immediately upon the completion melting of the solder deposit, ceasing the application of ultrasonic shearing energy to allow the solder to solidify and form a soldered diffusion joint between the terminals.
摘要翻译：一种通过控制超声能量来焊接材料的方法，以在仅在低温熔融基底上承载的待接合组件中仅熔化焊料。该方法有助于进行电连接以完成支撑在低温熔融基板上的电子电路单元，并且包括（a）将第一和第二导电端子定位在所述电路之间，其间具有焊料沉积物以形成组件，至少一个这种组件的端子直接支撑在这种低温熔融基板上; （b）在超声波发生喇叭和砧座之间夹持组件，同时激励喇叭以对第一端子施加超声波振动，以提供足够的剪切能量，其摩擦方向大致平行于摩擦方向摩擦焊料沉积物的至少一个表面使所述一个表面快速加热和熔化所述焊料沉积物; 和（c）基本上在焊料沉积物完成熔化之后立即停止超声剪切能量的施加，以允许焊料固化并在端子之间形成焊接的扩散接头。

8. 发明授权

US06893300B2 Connector assembly for electrical interconnection 失效
标题翻译：用于电气互连的连接器组件
公开(公告)号：US06893300B2
公开(公告)日：2005-05-17
申请号：US10195203
申请日：2002-07-15
申请人： Hong Zhou , Cuong Van Pham
发明人： Hong Zhou , Cuong Van Pham
IPC分类号： H01R13/05 , H01R13/10 , H01R13/631 , H01R4/48
CPC分类号： H01R13/052 , H01R13/10 , H01R13/6315
摘要： The present invention involves a universal connector assembly for electronic interconnection. The connector assembly includes a printed circuit board to which a male insert is in electrical communication. The male insert includes a strain relief tail connected to the printed circuit board and extends to a contact head. The assembly further includes a female socket for receiving the contact head of the male insert. The female socket has receiving members extending from a base to respective ends. The ends are biasingly spaced apart to define an opening through which the male insert is disposed for electrical contact with the female socket. The receiving members have an inside contact surface and an outside surface wherein the inside surface is configured to complement the outer contact wall of the male insert for electrical engagement when the male insert is disposed through the opening. The assembly further comprises a connector housing to which the base of the female socket is attached.
摘要翻译：本发明涉及用于电子互连的通用连接器组件。连接器组件包括印刷电路板，阳插入件与电连通。阳插入件包括连接到印刷电路板并延伸到接触头的应变消除尾部。组件还包括用于接收阳插入件的接触头的阴插座。阴插座具有从基部延伸到相应端部的接收构件。端部被偏置地间隔开以限定开口，阳插入物通过该开口设置用于与母插座电接触。接收构件具有内接触表面和外表面，其中当阳插入件穿过开口设置时，内表面构造成与阳插入件的外接触壁互补以进行电接合。组件还包括连接器壳体，母插座的底座附接到该壳体。

9. 发明授权

US06826829B2 Method for attaching a die with a low melting metal 失效
标题翻译：用低熔点金属附着模具的方法
公开(公告)号：US06826829B2
公开(公告)日：2004-12-07
申请号：US10093153
申请日：2002-03-07
申请人： Cuong Van Pham , Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amervai Reddy , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amervai Reddy , Vivek Amir Jairazbhoy
IPC分类号： H05K334
CPC分类号： H01L23/42 , H01L21/54 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01057 , H01L2924/01068 , H01L2924/10253 , H01L2924/14 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49171 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.
摘要翻译：公开了一种将电子管芯附接到基板的方法。优选地，该方法包括将管芯固定到衬底上，将电子管芯与衬底上的至少一个焊盘相互连接以形成电连接，用电绝缘涂层涂覆互连件和电子管芯，并覆盖电子管芯具有低温熔融金属。因此，本发明的方法提高了电子管芯的可靠性。

10. 发明授权

US06505665B1 Method and apparatus for use in assembling electronic devices 失效
标题翻译：用于组装电子设备的方法和装置
公开(公告)号：US06505665B1
公开(公告)日：2003-01-14
申请号：US09154810
申请日：1998-09-17
申请人： Kenneth R. Ulmer , Cuong Van Pham
发明人： Kenneth R. Ulmer , Cuong Van Pham
IPC分类号： B31B3100
CPC分类号： H01L24/27 , H01L24/29 , H01L2224/32014 , H01L2224/83191 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , Y10T156/1744 , H01L2924/00
摘要： A first fixture holds a plurality of circuit components backside up in a substantially coplanar relationship. An adhesive applying device, such as screen printer, applies adhesive to the backside of each circuit component. A second fixture is aligned with and placed on the first fixture. The fixtures are then flipped so that the circuit components are supported in a right side up position by the second fixture. A device such as a pick and place machine, may then be used to transfer the circuit components from the second fixture to a substrate.
摘要翻译：第一灯具将多个电路元件保持在基本上共面的关系中背面。诸如丝网印刷机的粘合剂施加装置将粘合剂施加到每个电路部件的背面。第二夹具与第一夹具对准并放置在第一夹具上。然后将夹具翻转，使得电路部件由第二固定装置支撑在右侧向上位置。然后可以使用诸如拾放机的装置将电路部件从第二固定装置传送到基板。

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