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    • 1. 发明申请
    • DISPLAY PANEL
    • 显示面板
    • US20130044046A1
    • 2013-02-21
    • US13471480
    • 2012-05-15
    • Yen-Shih HuangChia-Yuan YehBo-Feng LeeTa-Wei Chiu
    • Yen-Shih HuangChia-Yuan YehBo-Feng LeeTa-Wei Chiu
    • G09G3/30
    • H01L51/524H01L27/3258H01L27/3276
    • A display panel includes a substrate, a TFT device, a patterned dielectric layer, a patterned metal layer and a bridge line. The TFT device is disposed in a display region. The patterned dielectric layer includes an ILD layer disposed over the TFT device, and a sealant stage disposed in a peripheral region. The patterned metal layer includes a signal line disposed on the ILD layer, and a first connecting line and a second connecting line. The first connecting line is disposed in an inner side of the sealant stage facing the display region, and the first connecting line is electrically connected to the signal line. The second connecting line is disposed in an outer side of the sealant stage opposite to the display region. The bridge line is disposed under the sealant stage, and the first connecting line and the second connecting line are electrically connected through the bridge line.
    • 显示面板包括基板,TFT器件,图案化电介质层,图案化金属层和桥接线。 TFT器件设置在显示区域中。 图案化电介质层包括设置在TFT器件上的ILD层和设置在周边区域中的密封剂级。 图案化金属层包括设置在ILD层上的信号线,以及第一连接线和第二连接线。 第一连接线设置在面向显示区域的密封剂阶段的内侧,并且第一连接线电连接到信号线。 第二连接线设置在与显示区域相对的密封剂台的外侧。 桥接线设置在密封剂阶段下方,第一连接线和第二连接线通过桥接线电连接。
    • 2. 发明授权
    • Display panel
    • 显示面板
    • US09070897B2
    • 2015-06-30
    • US13471480
    • 2012-05-15
    • Yen-Shih HuangChia-Yuan YehBo-Feng LeeTa-Wei Chiu
    • Yen-Shih HuangChia-Yuan YehBo-Feng LeeTa-Wei Chiu
    • H01L27/12H01L51/52H01L27/32
    • H01L51/524H01L27/3258H01L27/3276
    • A display panel includes a substrate, a TFT device, a patterned dielectric layer, a patterned metal layer and a bridge line. The TFT device is disposed in a display region. The patterned dielectric layer includes an ILD layer disposed over the TFT device, and a sealant stage disposed in a peripheral region. The patterned metal layer includes a signal line disposed on the ILD layer, and a first connecting line and a second connecting line. The first connecting line is disposed in an inner side of the sealant stage facing the display region, and the first connecting line is electrically connected to the signal line. The second connecting line is disposed in an outer side of the sealant stage opposite to the display region. The bridge line is disposed under the sealant stage, and the first connecting line and the second connecting line are electrically connected through the bridge line.
    • 显示面板包括基板,TFT器件,图案化电介质层,图案化金属层和桥接线。 TFT器件设置在显示区域中。 图案化电介质层包括设置在TFT器件上的ILD层和设置在周边区域中的密封剂级。 图案化金属层包括设置在ILD层上的信号线,以及第一连接线和第二连接线。 第一连接线设置在面向显示区域的密封剂阶段的内侧,并且第一连接线电连接到信号线。 第二连接线设置在与显示区域相对的密封剂台的外侧。 桥接线设置在密封剂阶段下方,第一连接线和第二连接线通过桥接线电连接。
    • 4. 发明申请
    • Semiconductor Structure of Liquid Crystal Display and Manufacturing Method Thereof
    • 液晶显示器的半导体结构及其制造方法
    • US20080224142A1
    • 2008-09-18
    • US12017162
    • 2008-01-21
    • Yi-Sheng ChengTa-Wei Chiu
    • Yi-Sheng ChengTa-Wei Chiu
    • H01L33/00H01L21/00
    • H01L27/1288H01L27/1255
    • A semiconductor structure of a liquid crystal display and the manufacturing method thereof are described. The manufacturing method includes the following steps. A patterned polysilicon layer and a first dielectric layer are formed on a substrate. A first patterned metal layer is formed to construct a gate electrode and a capacitor electrode. An ion implantation is conducted on the polysilicon layer to form drain and source electrodes. A second dielectric layer and a second patterned metal layer are formed thereon. Sequentially, a third dielectric layer is formed thereon. A plurality of via openings are formed by a patterned photoresist layer, and a third metal layer is formed thereon and filled into the via openings. The patterned photoresist layer and the redundant third metal layer are stripped from the substrate to form via plugs in the via openings. A patterned transparent conductive layer is formed thereon to connect the via plugs.
    • 对液晶显示器的半导体结构及其制造方法进行说明。 该制造方法包括以下步骤。 在基板上形成图形化的多晶硅层和第一介质层。 形成第一图案化金属层以构成栅电极和电容器电极。 在多晶硅层上进行离子注入以形成漏极和源极。 在其上形成第二介电层和第二图案化金属层。 接着,在其上形成第三电介质层。 通过图案化的光致抗蚀剂层形成多个通路孔,并且在其上形成第三金属层并填充到通孔中。 图案化的光致抗蚀剂层和冗余的第三金属层从基板剥离以在通孔开口中形成通孔塞。 在其上形成图案化的透明导电层以连接通孔塞。
    • 5. 发明授权
    • Pixel structure
    • 像素结构
    • US08093596B2
    • 2012-01-10
    • US12815394
    • 2010-06-14
    • Ta-Wei ChiuYi-Sheng ChengShih-Yi Yen
    • Ta-Wei ChiuYi-Sheng ChengShih-Yi Yen
    • H01L29/04H01L31/036
    • H01L28/60G02F2001/136231H01L27/1255H01L27/1288
    • A pixel structure includes a patterned semiconductor layer disposed on a transistor region of the substrate, a first capacitor electrode disposed on a capacitor region of the substrate, a gate dielectric layer disposed on the first capacitor electrode, a gate disposed on a channel region of the patterned semiconductor layer, a second capacitor electrode, a dielectric layer, and an aluminum capacitor electrode sequentially disposed on the gate dielectric layer of the capacitor region, a first dielectric layer disposed on the gate and the aluminum capacitor electrode, at least one first wire disposed in the first dielectric layer for electrically connecting source/drain region of the patterned semiconductor layer and the aluminum capacitor electrode, a second dielectric layer disposed on the first wire, and a first transparent conductive layer disposed on the second dielectric layer and connected to the first wire.
    • 像素结构包括设置在基板的晶体管区域上的图案化半导体层,设置在基板的电容器区域上的第一电容器电极,设置在第一电容器电极上的栅极介电层,设置在第一电容器电极的沟道区上的栅极 图案化半导体层,第二电容器电极,电介质层和依次设置在电容器区的栅极电介质层上的铝电容器电极,设置在栅极和铝电容器电极上的第一电介质层,至少一个第一布线 在用于电连接图案化半导体层的源极/漏极区域和铝电容器电极的第一电介质层中,设置在第一线路上的第二电介质层和设置在第二电介质层上并连接到第一电介质层的第一透明导电层 线。
    • 8. 发明申请
    • PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF
    • 像素结构及其制造方法
    • US20120049197A1
    • 2012-03-01
    • US13004034
    • 2011-01-11
    • Hsiu-Chun HsiehYi-Wei ChenTa-Wei ChiuChung-Tao Chen
    • Hsiu-Chun HsiehYi-Wei ChenTa-Wei ChiuChung-Tao Chen
    • H01L29/12H01L21/336
    • H01L27/1288H01L27/1237
    • A pixel structure is provided. A first insulating pattern is on the first polysilicon pattern. A second insulating pattern is on the second polysilicon pattern and separated from the first insulating pattern. An insulating layer covers the first and the second insulating patterns. A first gate and a second gate are on the insulating layer. A first covering layer covers the first and the second gates. A first source metal layer and a first drain metal layer are on the first covering layer and electrically connected to a first source region and a first drain region. A second source metal layer and a second drain metal layer are on the first covering layer and electrically connected to a second source region and a second drain region. A pixel electrode is electrically connected to the first drain metal layer.
    • 提供像素结构。 第一绝缘图案在第一多晶硅图案上。 第二绝缘图案在第二多晶硅图案上并且与第一绝缘图案分离。 绝缘层覆盖第一和第二绝缘图案。 第一栅极和第二栅极位于绝缘层上。 第一覆盖层覆盖第一和第二栅极。 第一源极金属层和第一漏极金属层在第一覆盖层上并且电连接到第一源极区域和第一漏极区域。 第二源极金属层和第二漏极金属层在第一覆盖层上并且电连接到第二源极区域和第二漏极区域。 像素电极电连接到第一漏极金属层。
    • 9. 发明授权
    • Semiconductor structure of liquid crystal display and manufacturing method thereof
    • 液晶显示器的半导体结构及其制造方法
    • US07601552B2
    • 2009-10-13
    • US12017162
    • 2008-01-21
    • Yi-Sheng ChengTa-Wei Chiu
    • Yi-Sheng ChengTa-Wei Chiu
    • H01L21/00
    • H01L27/1288H01L27/1255
    • A semiconductor structure of a liquid crystal display and the manufacturing method thereof are described. The manufacturing method includes the following steps. A patterned polysilicon layer and a first dielectric layer are formed on a substrate. A first patterned metal layer is formed to construct a gate electrode and a capacitor electrode. An ion implantation is conducted on the polysilicon layer to form drain and source electrodes. A second dielectric layer and a second patterned metal layer are formed thereon. Sequentially, a third dielectric layer is formed thereon. A plurality of via openings are formed by a patterned photoresist layer, and a third metal layer is formed thereon and filled into the via openings. The patterned photoresist layer and the redundant third metal layer are stripped from the substrate to form via plugs in the via openings. A patterned transparent conductive layer is formed thereon to connect the via plugs.
    • 对液晶显示器的半导体结构及其制造方法进行说明。 该制造方法包括以下步骤。 在基板上形成图形化的多晶硅层和第一介质层。 形成第一图案化金属层以构成栅电极和电容器电极。 在多晶硅层上进行离子注入以形成漏极和源极。 在其上形成第二介电层和第二图案化金属层。 接着,在其上形成第三电介质层。 通过图案化的光致抗蚀剂层形成多个通路孔,并且在其上形成第三金属层并填充到通孔中。 图案化的光致抗蚀剂层和冗余的第三金属层从基板剥离以在通孔开口中形成通孔塞。 在其上形成图案化的透明导电层以连接通孔塞。