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1. 发明申请

US20100065310A1 METHOD FOR MANUFACTURING METALLIZED CERAMIC SUBSTRATE CHIP 审中-公开
标题翻译：用于制造金属化陶瓷衬底芯片的方法
公开(公告)号：US20100065310A1
公开(公告)日：2010-03-18
申请号：US12516394
申请日：2007-11-29
申请人： Yasuyuki Yamamoto , Kouichi Yamamoto , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Kouichi Yamamoto , Masakatsu Maeda
IPC分类号： H05K1/03 , H01R43/00
CPC分类号： H05K3/0052 , H01L23/13 , H01L2924/0002 , H05K1/0306 , H05K2201/09036 , H05K2201/0909 , H05K2203/0228 , Y10T29/49117 , Y10T29/49124 , H01L2924/00
摘要： A method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 μm to 5 μm; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove. When manufacturing metallized ceramic substrate chips by cutting (dividing) the ceramic substrate on the surface of which wiring patterns made of a metal film is formed, the method is capable of effectively using the base material, inhibiting defects in the metallized portion, and efficiently manufacturing the substrate chips in high yield.
摘要翻译：一种用于制造衬底芯片的方法，包括以下步骤：将设置在原始衬底上的金属布线图案单元的至少一部分的厚度设定为0.1μm至5μm; 形成用于沿着规划的切割线在陶瓷基板的表面中至少形成裂纹的槽，该切割线穿过金属布线图案单元的一部分，通过使用具有切割刀的切割轮，该切割轮具有大致V形截面沿着盘旋转轮的圆周部分; 并通过从凹槽的后面施加载荷来切割原始基底。当通过在形成由金属膜制成的布线图案的表面上切割（分割）陶瓷基板来制造金属化陶瓷基板芯片时，该方法能够有效地使用基材，抑制金属化部分中的缺陷并有效地制造基片芯片产量高。

2. 发明授权

US07825422B2 Ceramic substrate for mounting a light emitting element and method for manufacturing the same 有权
标题翻译：用于安装发光元件的陶瓷基板及其制造方法
公开(公告)号：US07825422B2
公开(公告)日：2010-11-02
申请号：US11660476
申请日：2005-08-16
申请人： Masakatsu Maeda , Yasuyuki Yamamoto
发明人： Masakatsu Maeda , Yasuyuki Yamamoto
IPC分类号： H01L33/58
CPC分类号： C04B41/009 , C04B41/5031 , C04B41/5063 , C04B41/5064 , C04B41/87 , C04B2111/80 , H01L33/60 , H01L33/641 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H05K1/0274 , H05K1/0306 , H05K1/181 , H05K2201/017 , H05K2201/10106 , H05K2201/2054 , C04B41/0072 , C04B41/4556 , C04B41/4539 , C04B41/5045 , C04B35/58 , C04B35/581 , H01L2924/00014 , H01L2924/00
摘要： A ceramic substrate for mounting a light emitting element. The ceramic substrate has a placement surface for placing a light emitting element having an electrode; and an electrode electrically-connected with the electrode of the light emitting element, wherein the ceramic substrate comprises a substrate body consisting of a nitride ceramics; and a coat layer coating at least a part of a surface of the substrate body and consisting of a ceramics different from the nitride ceramics forming the substrate body; and the coat layer has an optical reflectance of 50% or more for any light having a wavelength of from 300 to 800 nm, which can increase a luminance of the light emitting element by reflecting the light emitted from the element efficiently with certainty, and which has a high heat radiation property; and a manufacturing method therefor.
摘要翻译：一种用于安装发光元件的陶瓷基板。陶瓷基板具有用于放置具有电极的发光元件的放置面; 以及与所述发光元件的电极电连接的电极，其中，所述陶瓷基板包括由氮化物陶瓷构成的基板主体; 以及涂覆在所述基板主体的表面的至少一部分上并由与形成所述基板主体的所述氮化物陶瓷不同的陶瓷构成的涂层; 并且涂层对于具有300至800nm波长的任何光都具有50％或更高的光学反射率，这可以通过有效地反映从元件发射的光来增加发光元件的亮度，并且其中具有较高的散热性能; 及其制造方法。

3. 发明申请

US20080145518A1 Element Mounting Substrate and Method for Manufacturing Same 有权
标题翻译：元件安装基板及其制造方法
公开(公告)号：US20080145518A1
公开(公告)日：2008-06-19
申请号：US11791595
申请日：2005-11-18
申请人： Masakatsu Maeda , Yasuyuki Yamamoto , Kunihiro Gotoh
发明人： Masakatsu Maeda , Yasuyuki Yamamoto , Kunihiro Gotoh
IPC分类号： B05D5/12
CPC分类号： H01L23/49822 , H01L21/4857 , H01L33/486 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/28 , H05K3/3452 , H05K2201/017 , H01L2924/00
摘要： An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 μm. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted. In addition, peeling or cracking of the electrode layer caused by impact during dicing can be prevented.
摘要翻译：元件安装衬底包括陶瓷衬底，形成在衬底上的电极层和形成在电极层的一部分上并具有5至50μm厚度的陶瓷涂层。一种用于制造元件安装基板的方法包括以下步骤：在陶瓷板或大直径的生片上形成电极层图案形状的电极前体层，在部件上形成陶瓷涂层前体层的电极前体层，然后烧结所得的前体。在该方法中，优选形成陶瓷被覆层，以覆盖烧制品的规定切断线上的电极层。根据其中电极层的一部分被陶瓷覆盖的元件安装基板，当安装元件时，可以防止由于陶瓷涂层的厚度而导致的元件的安装失败。此外，可以防止由切割期间的冲击引起的电极层的剥离或破裂。

4. 发明授权

US08138428B2 Lead-embedded metallized ceramics substrate and package 失效
标题翻译：铅嵌入式金属化陶瓷基板和封装
公开(公告)号：US08138428B2
公开(公告)日：2012-03-20
申请号：US12279073
申请日：2007-02-07
申请人： Masakatsu Maeda , Yasuyuki Yamamoto
发明人： Masakatsu Maeda , Yasuyuki Yamamoto
IPC分类号： H05K1/11
CPC分类号： H01L23/10 , H01L23/15 , H01L24/48 , H01L33/483 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H05K1/0306 , H05K3/3447 , H05K3/3452 , H05K2201/09909 , H05K2201/10106 , H05K2201/10303 , Y10T29/49139 , Y10T29/49165 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity.
摘要翻译：一种金属化陶瓷基板，包括：陶瓷体; 形成在陶瓷体的一个表面上的布线图案; 以及电连接到布线图案的引线。陶瓷体具有通孔，引线穿透通孔并从陶瓷体的另一表面伸出，并且通过在引线和通孔之间填充导电填料来固定引线，以保持气密性。金属化陶瓷基板不会产生层间剥离的问题，气密性和导电性优异。

5. 发明授权

US08071187B2 Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package 有权
标题翻译：用于制造金属化陶瓷衬底的方法，通过该方法制造的金属化陶瓷衬底和封装
公开(公告)号：US08071187B2
公开(公告)日：2011-12-06
申请号：US12161193
申请日：2007-01-23
申请人： Yasuyuki Yamamoto , Osamu Yatabe , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Osamu Yatabe , Masakatsu Maeda
IPC分类号： B29D22/00 , B32B7/02 , H01L23/15 , H05K5/06 , H05K7/02
CPC分类号： H01L23/15 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H05K1/092 , H05K3/4667 , H05K2201/0266 , H05K2201/0352 , Y10T428/131 , Y10T428/24355 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/31 , H01L2924/00
摘要： A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.
摘要翻译：一种金属化陶瓷基板的制造方法，包括以下步骤：在烧结陶瓷基板上形成含有金属粉末的第一导电浆料层; 形成含有与构成第一导电糊层的金属粉末的平均粒径不同的金属粉末的第二导电膏层; 以及形成第一导电层和第二导电糊层。第一导电层和第二导电层的表面粗糙度不同。通过这种方法，即使是具有多个金属化层的多层基板，也可以确保金属化陶瓷基板的气密性。

6. 发明授权

US07973481B2 Nitride sintered body and method for manufacturing thereof 有权
公开(公告)号：US07973481B2
公开(公告)日：2011-07-05
申请号：US12767254
申请日：2010-04-26
申请人： Yasuyuki Yamamoto , Yukihiro Kanechika , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Yukihiro Kanechika , Masakatsu Maeda
IPC分类号： H01J17/16 , C04B35/00
CPC分类号： C04B35/64 , C04B35/581 , C04B35/62625 , C04B35/6264 , C04B35/6303 , C04B2235/3205 , C04B2235/3222 , C04B2235/3224 , C04B2235/3225 , C04B2235/5436 , C04B2235/5445 , C04B2235/652 , C04B2235/656 , C04B2235/658 , C04B2235/77 , C04B2235/85 , C04B2235/9607 , C04B2235/9646 , Y10T428/249921 , Y10T428/268
摘要： An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature.

7. 发明申请

US20100178461A1 METHOD FOR FABRICATING METALLIZED CERAMICS SUBSTRATE, METALLIZED CERAMICS SUBSTRATE FABRICATED BY THE METHOD, AND PACKAGE 有权
标题翻译：金属化陶瓷基板的制造方法，由该方法制成的金属化陶瓷基板和封装
公开(公告)号：US20100178461A1
公开(公告)日：2010-07-15
申请号：US12161193
申请日：2007-01-23
申请人： Yasuyuki Yamamoto , Osamu Yatabe , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Osamu Yatabe , Masakatsu Maeda
IPC分类号： B32B3/02 , B05D3/02
CPC分类号： H01L23/15 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H05K1/092 , H05K3/4667 , H05K2201/0266 , H05K2201/0352 , Y10T428/131 , Y10T428/24355 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/31 , H01L2924/00
摘要： A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.
摘要翻译：一种金属化陶瓷基板的制造方法，包括以下步骤：在烧结陶瓷基板上形成含有金属粉末的第一导电浆料层; 形成含有与构成第一导电糊层的金属粉末的平均粒径不同的金属粉末的第二导电膏层; 以及形成第一导电层和第二导电糊层。第一导电层和第二导电层的表面粗糙度不同。通过这种方法，即使是具有多个金属化层的多层基板，也可以确保金属化陶瓷基板的气密性。

8. 发明授权

US08115114B2 Ceramic substrate manufacturing method and ceramic substrate 失效
标题翻译：陶瓷基板制造方法和陶瓷基板
公开(公告)号：US08115114B2
公开(公告)日：2012-02-14
申请号：US12439233
申请日：2007-09-05
申请人： Yasuyuki Yamamoto , Ken Sugawara , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Ken Sugawara , Masakatsu Maeda
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , B32B18/00 , C04B35/632 , C04B35/634 , C04B35/63404 , C04B35/63408 , C04B35/63416 , C04B35/6342 , C04B35/63424 , C04B35/63436 , C04B35/63488 , C04B35/6365 , C04B2235/656 , C04B2235/6567 , C04B2235/658 , C04B2235/6582 , C04B2235/6588 , C04B2235/661 , C04B2237/30 , C04B2237/32 , C04B2237/341 , C04B2237/343 , C04B2237/361 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/706 , C04B2237/84 , H01L21/486 , H01L21/4867 , H05K3/4061 , H05K3/46 , H05K2201/017 , H05K2201/096
摘要： A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate a sintered ceramic layer having a hole(s) or opening(s) whose bottom is configured to be at least a part of an exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion.
摘要翻译：一种陶瓷基板的制造方法，该陶瓷基板具有与通路孔电连接的通路孔和表面布线图案。该方法包括：制备具有通孔的烧结陶瓷基板; 在烧结陶瓷基体上形成具有孔或开口的烧结陶瓷层，其底部通过后焙烧方法构成为通孔的暴露端面的至少一部分; 在所述孔或开口内部形成导电部分，所述导电部分电连接所述烧结陶瓷层的表面和所述通孔; 以及在所述烧结陶瓷层的表面上形成电连接到所述导电部分的表面布线图案。

9. 发明授权

US07737461B2 Package for storing light emitting element and method for producing package for storing light emitting element 失效
标题翻译：用于存储发光元件的封装和用于制造用于存储发光元件的封装的方法
公开(公告)号：US07737461B2
公开(公告)日：2010-06-15
申请号：US11659158
申请日：2005-08-03
申请人： Masakatsu Maeda , Yasuyuki Yamamoto , Yukihiro Kanechika
发明人： Masakatsu Maeda , Yasuyuki Yamamoto , Yukihiro Kanechika
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , C04B35/581 , C04B35/583 , C04B35/587 , C04B35/6342 , C04B35/63424 , C04B35/6365 , C04B2235/3208 , C04B2235/3212 , C04B2235/3222 , C04B2235/3224 , C04B2235/3225 , C04B2235/442 , C04B2235/443 , C04B2235/445 , C04B2235/5436 , C04B2235/5445 , C04B2235/6025 , C04B2235/652 , C04B2235/6587 , C04B2235/723 , C04B2235/77 , C04B2235/9661 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041
摘要： A light-emitting element storing package which ensures the efficient reflection of light emitted by a light-emitting element by a reflector frame and thereby improves the brightness of the emitted light, and a method of manufacturing the same are provided. In a light-emitting element storing package includes: an insulating substrate consisting of a ceramic board, a reflector frame composed of a ceramic material, joined to the upper surface of the substrate along its outer edge and having an inner wall surface defining a light-reflecting surface, and a wiring pattern layer formed on the upper surface of the substrate for connection with a light-emitting element, a light-emitting element storing concave portion, which is defined by the substrate and the reflector frame, and in which the light-emitting element is mounted on the wiring pattern layer, the reflector frame is mainly composed of nitride ceramics and its light-reflecting surface is composed of white ceramics.
摘要翻译：一种发光元件存储包，其确保了由反射器框架有效地反射由发光元件发出的光，从而提高了发光的亮度，并提供了其制造方法。在发光元件存储包装中，包括：由陶瓷板构成的绝缘基板，由陶瓷材料构成的反射器框架，沿着其外缘与基板的上表面接合，并具有限定发光元件的内壁面，反射面，以及形成在与发光元件连接的基板的上表面上的布线图案层，由基板和反射器框架限定的存储凹部的发光元件，其中，光配线元件安装在布线图案层上，反射框架主要由氮化物陶瓷组成，其光反射表面由白色陶瓷组成。

10. 发明申请

US20100012368A1 CERAMIC SUBSTRATE MANUFACTURING METHOD AND CERAMIC SUBSTRATE 失效
标题翻译：陶瓷基板制造方法和陶瓷基板
公开(公告)号：US20100012368A1
公开(公告)日：2010-01-21
申请号：US12439233
申请日：2007-09-05
申请人： Yasuyuki Yamamoto , Ken Sugawara , Masakatsu Maeda
发明人： Yasuyuki Yamamoto , Ken Sugawara , Masakatsu Maeda
IPC分类号： H05K1/11 , C04B33/32 , B05D5/12
CPC分类号： H05K1/115 , B32B18/00 , C04B35/632 , C04B35/634 , C04B35/63404 , C04B35/63408 , C04B35/63416 , C04B35/6342 , C04B35/63424 , C04B35/63436 , C04B35/63488 , C04B35/6365 , C04B2235/656 , C04B2235/6567 , C04B2235/658 , C04B2235/6582 , C04B2235/6588 , C04B2235/661 , C04B2237/30 , C04B2237/32 , C04B2237/341 , C04B2237/343 , C04B2237/361 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/706 , C04B2237/84 , H01L21/486 , H01L21/4867 , H05K3/4061 , H05K3/46 , H05K2201/017 , H05K2201/096
摘要： A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate a sintered ceramic layer having a hole(s) or opening(s) whose bottom is configured to be at least a part of an exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion.
摘要翻译：一种陶瓷基板的制造方法，该陶瓷基板具有与通路孔电连接的通路孔和表面布线图案。该方法包括：制备具有通孔的烧结陶瓷基板; 在烧结陶瓷基体上形成具有孔或开口的烧结陶瓷层，其底部通过后焙烧方法构成为通孔的暴露端面的至少一部分; 在所述孔或开口内部形成导电部分，所述导电部分电连接所述烧结陶瓷层的表面和所述通孔; 以及在所述烧结陶瓷层的表面上形成电连接到所述导电部分的表面布线图案。

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