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1. 发明申请

US20080145518A1 Element Mounting Substrate and Method for Manufacturing Same 有权
标题翻译：元件安装基板及其制造方法
公开(公告)号：US20080145518A1
公开(公告)日：2008-06-19
申请号：US11791595
申请日：2005-11-18
申请人： Masakatsu Maeda , Yasuyuki Yamamoto , Kunihiro Gotoh
发明人： Masakatsu Maeda , Yasuyuki Yamamoto , Kunihiro Gotoh
IPC分类号： B05D5/12
CPC分类号： H01L23/49822 , H01L21/4857 , H01L33/486 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/28 , H05K3/3452 , H05K2201/017 , H01L2924/00
摘要： An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 μm. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted. In addition, peeling or cracking of the electrode layer caused by impact during dicing can be prevented.
摘要翻译：元件安装衬底包括陶瓷衬底，形成在衬底上的电极层和形成在电极层的一部分上并具有5至50μm厚度的陶瓷涂层。一种用于制造元件安装基板的方法包括以下步骤：在陶瓷板或大直径的生片上形成电极层图案形状的电极前体层，在部件上形成陶瓷涂层前体层的电极前体层，然后烧结所得的前体。在该方法中，优选形成陶瓷被覆层，以覆盖烧制品的规定切断线上的电极层。根据其中电极层的一部分被陶瓷覆盖的元件安装基板，当安装元件时，可以防止由于陶瓷涂层的厚度而导致的元件的安装失败。此外，可以防止由切割期间的冲击引起的电极层的剥离或破裂。

2. 发明授权

US07888187B2 Element mounting substrate and method for manufacturing same 有权
标题翻译：元件安装基板及其制造方法
公开(公告)号：US07888187B2
公开(公告)日：2011-02-15
申请号：US11791595
申请日：2005-11-18
申请人： Masakatsu Maeda , Yasuyuki Yamamoto , Kunihiro Gotoh
发明人： Masakatsu Maeda , Yasuyuki Yamamoto , Kunihiro Gotoh
IPC分类号： H01L21/50 , H01L23/06
CPC分类号： H01L23/49822 , H01L21/4857 , H01L33/486 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/28 , H05K3/3452 , H05K2201/017 , H01L2924/00
摘要： An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 μm. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted. In addition, peeling or cracking of the electrode layer caused by impact during dicing can be prevented.
摘要翻译：元件安装衬底包括陶瓷衬底，形成在衬底上的电极层和形成在电极层的一部分上并具有5至50μm厚度的陶瓷涂层。一种用于制造元件安装基板的方法包括以下步骤：在陶瓷板或大直径的生片上形成电极层图案形状的电极前体层，在部件上形成陶瓷涂层前体层的电极前体层，然后烧结所得的前体。在该方法中，优选形成陶瓷被覆层，以覆盖烧制品的规定切断线上的电极层。根据其中电极层的一部分被陶瓷覆盖的元件安装基板，当安装元件时，可以防止由于陶瓷涂层的厚度而导致的元件的安装失败。此外，可以防止由切割期间的冲击引起的电极层的剥离或破裂。

3. 发明申请

US20080131673A1 Method for Producing Metallized Ceramic Substrate 审中-公开
标题翻译：生产金属化陶瓷基板的方法
公开(公告)号：US20080131673A1
公开(公告)日：2008-06-05
申请号：US11793185
申请日：2005-12-13
申请人： Yasuyuki Yamamoto , Masakatsu Maeda , Kunihiro Gotoh
发明人： Yasuyuki Yamamoto , Masakatsu Maeda , Kunihiro Gotoh
IPC分类号： C04B41/90 , H05K3/12
CPC分类号： C04B41/52 , C04B41/90 , H05K1/0306 , H05K1/092 , H05K3/1291 , H05K3/4667 , H05K2203/1126 , Y10T428/24926 , Y10T428/24942 , Y10T428/26
摘要： The process for producing a metallized ceramic substrate of the present invention comprises a step (A) of preparing a raw material substrate comprising a ceramic substrate which may have on its surface a conductive layer or a conductor paste layer, a step (B) of preparing a metallized ceramic substrate precursor, said step (B) comprising a step of forming a ceramic paste layer on the raw material substrate and a step of forming a conductive paste layer on the ceramic paste layer, and a step (C) of firing the metallized ceramic substrate precursor obtained in the previous step. In the step (B), formation of a ceramic paste layer and formation of a conductive paste layer may be alternately repeated plural times. According to the present invention, running or spreading of the conductive paste is prevented, and a metallized ceramic substrate which has a high degree of freedom of wiring design and high reliability and has a fine metallization pattern can be produced.
摘要翻译：本发明的金属化陶瓷基板的制造方法包括制备包括陶瓷基板的原料基板的工序（A），该陶瓷基板在其表面上可以具有导电层或导体糊层，制备步骤（B）金属化陶瓷基板前体，所述工序（B）包括在所述原料基板上形成陶瓷浆料层的步骤和在所述陶瓷浆料层上形成导电浆料层的工序，和对所述金属化陶瓷基板前体进行烧成的工序在前一步骤中获得的陶瓷衬底前体。在步骤（B）中，陶瓷浆料层的形成和导电糊层的形成可以交替重复多次。根据本发明，能够防止导电性糊料的运行或扩散，可以制造具有高自由度的布线设计和高可靠性且具有精细金属化图案的金属化陶瓷基板。

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