专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070224920A1 POLISHING PAD, METHOD OF POLISHING AND POLISHING APPARATUS 审中-公开
标题翻译：抛光垫，抛光和抛光装置的方法
公开(公告)号：US20070224920A1
公开(公告)日：2007-09-27
申请号：US11691566
申请日：2007-03-27
申请人： Yasutada Nakagawa , Eijiro Koike
发明人： Yasutada Nakagawa , Eijiro Koike
IPC分类号： B24B7/30 , B24B1/00
CPC分类号： B24B37/26
摘要： A polishing pad according to the invention comprises a pad body having a polishing surface and a support surface and a plurality of hole apertures extending from the polishing surface to the support surface, each of the plurality of apertures having a noncircular shaped opening oriented at a predetermined angle with respect to a radial direction of the polishing pad.
摘要翻译：根据本发明的抛光垫包括具有抛光表面和支撑表面的垫体，以及从抛光表面延伸到支撑表面的多个孔孔，多个孔中的每一个具有以预定的方向取向的非圆形形状的开口相对于抛光垫的径向的角度。

2. 发明授权

US06640795B1 Dresser, polishing apparatus and method for producing an article 失效
标题翻译：修整器，抛光装置和制造物品的方法
公开(公告)号：US06640795B1
公开(公告)日：2003-11-04
申请号：US09671263
申请日：2000-09-28
申请人： Eijiro Koike , Yasutada Nakagawa , Masatoshi Higuchi
发明人： Eijiro Koike , Yasutada Nakagawa , Masatoshi Higuchi
IPC分类号： B24B5353
CPC分类号： B24B53/017 , B24B53/12 , Y10S977/777 , Y10S977/888
摘要： A polishing apparatus comprise a lower surface plate rotatably provided and having a polishing surface for polishing an object, and an upper surface plate for pressing the object against the lower surface plate, wherein the polishing surface can be dressed by a dresser comprising a dressing member approachable to and separable from the polishing surface, the dressing member having a dressing surface to be brought into contact with the polishing surface, the dressing surface being shaped as a hollow oval.
摘要翻译：抛光装置包括可旋转地设置并具有用于抛光物体的抛光表面的下表面板和用于将物体压靠在下表面板上的上表面板，其中抛光表面可以由修整器修整，该修整器包括可接近的修整构件并且可以与抛光表面分离，修整构件具有与抛光表面接触的修整表面，修整表面成形为中空椭圆形。

3. 发明授权

US06267646B1 Polishing machine 失效
标题翻译：抛光机
公开(公告)号：US06267646B1
公开(公告)日：2001-07-31
申请号：US09621489
申请日：2000-07-21
申请人： Eijiro Koike
发明人： Eijiro Koike
IPC分类号： B24B100
CPC分类号： B24B37/08 , B24B1/005
摘要： A polishing machine comprise a support unit for horizontally supporting a work piece at an outer peripheral edge thereof, to be freely rotatable with a central axis thereof serving as a center of the rotation, a rotation driving unit for driving rotation of the work piece with the central axis thereof serving as a center of the rotation, a polishing plate provided to be opposite to a surface of the work piece and reciprocate along a direction of a diameter of the work piece, and pressed onto the surface of the work piece at a predetermined force and polishing cloth provided between the polishing plate and the surface of the work piece.
摘要翻译：抛光机包括用于在其外周边缘处水平地支撑工件的支撑单元，其可以以其作为旋转中心的中心轴线自由旋转;旋转驱动单元，用于驱动工件的旋转，作为旋转中心的中心轴，设置成与工件的表面相对的抛光板，沿着工件的直径方向往复运动，并以预定的方式压在工件的表面上在抛光板和工件表面之间提供的力和抛光布。

4. 发明申请

US20090022036A1 DIFFRACTION OPTICAL ELEMENT, MOLDING DIE FOR THE OPTICAL ELEMENT AND MANUFACTURING METHOD THEREOF 有权
标题翻译：衍射光学元件，光学元件成型模具及其制造方法
公开(公告)号：US20090022036A1
公开(公告)日：2009-01-22
申请号：US12175557
申请日：2008-07-18
申请人： Hideki Ide , Masahiro Uekita , Eijiro Koike
发明人： Hideki Ide , Masahiro Uekita , Eijiro Koike
IPC分类号： G11B7/00
CPC分类号： G02B5/1866 , G02B5/1847 , G02B27/0018
摘要： A diffraction optical element is provided to reduce harmful lights and also suppress deterioration in the optical characteristics of the element. The diffraction optical element 22 is formed with a plurality of diffraction gratings 17′, 18′, 19′ and 20′. From these diffraction gratings, there are selected the diffraction gratings 18′, 19′ and 20′ whose groove apex angles are less than a predetermined angle. The diffraction gratings 18′, 19′ and 20′ has chamfer surfaces 18c′, 19c′ and 20c′ formed on the lower side of respective slanted surfaces 18a′, 19a′ and 20a′. The chamfer surfaces 18c′, 19c′ and 20c′ are slanted to the slanted surfaces 18a′, 19a′ and 20a′, respectively.
摘要翻译：提供衍射光学元件以减少有害光并且还抑制元件的光学特性的劣化。衍射光学元件22形成有多个衍射光栅17'，18'，19'和20'。从这些衍射光栅中，选择其凹槽顶角小于预定角度的衍射光栅18'，19'和20'。衍射光栅18'，19'和20'具有形成在相应倾斜表面18a'，19a'和20a'的下侧上的倒角表面18c'，19c'和20c'。倒角表面18c'，19c'和20c'分别倾斜到倾斜表面18a'，19a'和20a'。

5. 发明授权

US07911921B2 Diffraction optical element, molding die for the optical element and manufacturing method thereof 有权
$Diffraction optical element, molding die for the optical element and manufacturing method thereof$
标题翻译：衍射光学元件，用于光学元件的成型模具及其制造方法
公开(公告)号：US07911921B2
公开(公告)日：2011-03-22
申请号：US12175557
申请日：2008-07-18
申请人： Hideki Ide , Masahiro Uekita , Eijiro Koike
发明人： Hideki Ide , Masahiro Uekita , Eijiro Koike
IPC分类号： G11B7/00
CPC分类号： G02B5/1866 , G02B5/1847 , G02B27/0018
摘要： A diffraction optical element is provided to reduce harmful lights and also suppress deterioration in the optical characteristics of the element. The diffraction optical element 22 is formed with a plurality of diffraction gratings 17′, 18′, 19′ and 20′. From these diffraction gratings, there are selected the diffraction gratings 18′, 19′ and 20′ whose groove apex angles are less than a predetermined angle. The diffraction gratings 18′, 19′ and 20′ has chamfer surfaces 18c′, 19c′ and 20c′ formed on the lower side of respective slanted surfaces 18a′, 19a′ and 20a′. The chamfer surfaces 18c′, 19c′ and 20c′ are slanted to the slanted surfaces 18a′, 19a′ and 20a′, respectively.
摘要翻译：提供衍射光学元件以减少有害光并且还抑制元件的光学特性的劣化。衍射光学元件22形成有多个衍射光栅17'，18'，19'和20'。从这些衍射光栅中，选择其凹槽顶角小于预定角度的衍射光栅18'，19'和20'。衍射光栅18'，19'和20'具有形成在相应倾斜表面18a'，19a'和20a'的下侧上的倒角表面18c'，19c'和20c'。倒角表面18c'，19c'和20c'分别倾斜到倾斜表面18a'，19a'和20a'。

6. 发明授权

US6113467A Polishing machine and polishing method 失效
标题翻译：抛光机和抛光方法
公开(公告)号：US6113467A
公开(公告)日：2000-09-05
申请号：US251909
申请日：1999-02-19
申请人： Eijiro Koike
发明人： Eijiro Koike
IPC分类号： B24B1/00 , B24B37/00 , B24B37/08 , H01L21/304 , H01L21/306
CPC分类号： B24B37/08 , B24B1/005
摘要： A method of polishing which includes rotatably supporting a workpiece, positioning polishing plates in such a manner that flat surfaces of the polishing plates oppose one another and are in contact with a surface of the workpiece, and polishing the workpiece by rotating the workpiece around a central axis thereof by use of a workpiece rotator. The method also includes reciprocating the polishing plates on the surface of the workpiece in a radial direction of the workpiece while pressing the workpiece between the flat surfaces of the polishing plates.
摘要翻译：一种抛光方法，其包括可旋转地支撑工件，以使得抛光板的平坦表面彼此相对并且与工件的表面接触的方式定位抛光板，并且通过围绕中心旋转工件来抛光工件使用工件旋转体。该方法还包括在工件的径向方向上使抛光板在工件的表面上往复运动，同时在抛光板的平坦表面之间挤压工件。

7. 发明授权

US09303976B2 Substrate processing system and substrate processing program 有权
标题翻译：基板加工系统和基板加工程序
公开(公告)号：US09303976B2
公开(公告)日：2016-04-05
申请号：US13456458
申请日：2012-04-26
申请人： Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
发明人： Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
IPC分类号： G06F19/00 , G06F15/00 , G01B11/06 , G01N21/64 , G01N21/66
CPC分类号： G01B11/06 , G01N21/64 , G01N21/66 , G01N2021/6421 , H01L2933/0041
摘要： According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.
摘要翻译：根据一个实施例，基板处理系统包括测量单元，数据处理单元和处理单元。测量单元被配置为测量与衬底的厚度尺寸有关的信息。基板包括发光单元和波长转换单元。波长转换单元包括荧光体。数据处理单元被配置为基于与基板的厚度尺寸相关的测量信息，并且基于与从发光单元发射的光的特性相关的信息来确定与波长转换单元的厚度方向有关的处理信息。处理单元被配置为基于所确定的处理信息来执行波长转换单元的处理。

8. 发明申请

US20120277896A1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING PROGRAM 有权
标题翻译：基板处理系统和基板处理程序
公开(公告)号：US20120277896A1
公开(公告)日：2012-11-01
申请号：US13456458
申请日：2012-04-26
申请人： Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
发明人： Masahiro Uekita , Hiroshi Koizumi , Tomomichi Naka , Naoaki Sakurai , Eijiro Koike
IPC分类号： G06F19/00 , G06F15/00 , G01B11/06
CPC分类号： G01B11/06 , G01N21/64 , G01N21/66 , G01N2021/6421 , H01L2933/0041
摘要： According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.
摘要翻译：根据一个实施例，基板处理系统包括测量单元，数据处理单元和处理单元。测量单元被配置为测量与衬底的厚度尺寸有关的信息。基板包括发光单元和波长转换单元。波长转换单元包括荧光体。数据处理单元被配置为基于与基板的厚度尺寸相关的测量信息，并且基于与从发光单元发射的光的特性相关的信息来确定与波长转换单元的厚度方向有关的处理信息。处理单元被配置为基于所确定的处理信息来执行波长转换单元的处理。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式