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    • 9. 发明授权
    • Propeller/blade MRI with non-linear mapping to K-space
    • 螺旋桨/叶片MRI与K空间的非线性映射
    • US08610432B2
    • 2013-12-17
    • US13010001
    • 2011-01-20
    • Takashi ShigetaMasao Yui
    • Takashi ShigetaMasao Yui
    • G01V3/00
    • G01R33/4824
    • A magnetic resonance imaging apparatus and method acquires NMR signal data for a periodically rotated data acquisition region in k-space wherein the acquisition region is caused to have non-linear acquisition loci. As an example, the width of the data acquisition region at a point distant from the origin of k-space is made larger than at a point nearer the origin of k-space thereby more fully filling k-space with acquired NMR data even if the number of RF pulse shots is reduced and/or the number of data acquisition region positions is reduce. A magnetic resonance image is reconstructed based on the acquired NMR signal data in k-space.
    • 磁共振成像装置和方法获取在k空间中周期性旋转的数据采集区域的NMR信号数据,其中获取区域被引入具有非线性采集轨迹。 作为示例,在远离k空间的原点的位置处的数据采集区域的宽度大于在更接近k空间的原点的点,从而用所获得的NMR数据更充分地填充k空间,即使 射频脉冲数的减少和/或数据采集区位置的数量减少。 基于在k空间中获取的NMR信号数据重建磁共振图像。
    • 10. 发明申请
    • SAPPHIRE POLISHING SLURRY AND SAPPHIRE POLISHING METHOD
    • SAPPHIRE抛光浆料和SAPPHIRE抛光方法
    • US20130037515A1
    • 2013-02-14
    • US13643404
    • 2011-04-27
    • Daisuke HosoiTakashi Shigeta
    • Daisuke HosoiTakashi Shigeta
    • C09K13/00B44C1/22
    • C09G1/02
    • Disclosed is a polishing slurry for sapphire polishing that is capable of obtaining polishing speeds and smooth surfaces during the polishing of sapphire substrates that are equivalent to or better than in prior polishing processes even if the number of polishers and polishing hours are reduced. Also disclosed is a sapphire substrate polishing method. The slurry includes alumina abrasives and has a pH adjusted to the range of 10.0 to 14.0, and the sapphire is polished by means of the CMP technique by applying said slurry. The aforementioned alumina abrasives more preferably include at least α-alumina, and the content thereof is more preferably 0.01 to 50 wt %. The mean particle size of the aforementioned alumina abrasives is preferably 0.05 to 10 μm.
    • 公开了一种用于蓝宝石抛光的抛光浆料,即使抛光剂的数量和抛光时间减少,在抛光过程中能够获得与之前的抛光工艺相同或更好的蓝宝石衬底的抛光速度和光滑表面。 还公开了蓝宝石衬底抛光方法。 该浆料包括氧化铝研磨剂,并将pH调节至10.0-14.0的范围,并且通过施加所述浆料,通过CMP技术研磨蓝宝石。 上述氧化铝研磨剂更优选至少包含α-氧化铝,其含量更优选为0.01〜50重量%。 上述氧化铝研磨剂的平均粒径优选为0.05〜10μm。