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    • 5. 发明申请
    • IMAGING APPARATUS
    • 成像设备
    • US20120242884A1
    • 2012-09-27
    • US13421295
    • 2012-03-15
    • Hideto ISHIGUROHitoshi TSUCHIYATsukasa EGUCHI
    • Hideto ISHIGUROHitoshi TSUCHIYATsukasa EGUCHI
    • H04N5/225
    • H01L27/14623H01L27/14627
    • An imaging apparatus includes light-transmitting substrate; a plurality of lenses which faces a first surface of the substrate; a light shielding layer which is formed on the second surface of the substrate and has an opening section through which optical axes of each lens pass; and a plurality of light sensing elements which is placed so that the optical axes of the lenses pass through a light sensing surface facing the second surface at an interval. An efficient diameter of the lens, a diameter of the opening section, a distance between the light sensing surfaces and the light shielding layer, a diameter of the light sensing surface, and a distance between the light sensing surface and center of the lens satisfy a sin−1(1/n).
    • 成像装置包括透光基板; 面对基板的第一表面的多个透镜; 遮光层,其形成在所述基板的第二表面上,并且具有开口部,每个透镜的光轴穿过所述开口部; 以及多个光感测元件,其被放置成使得透镜的光轴以一定间隔穿过面对第二表面的感光表面。 透镜的有效直径,开口部分的直径,光感测表面和遮光层之间的距离,光感测表面的直径以及光感测表面和透镜中心之间的距离满足 sin(1 / n)<(h·D + h·d-s·d)/ s和tan-1 {(p-a / 2-d / 2)/ h}
    • 6. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE, ELECTRO-OPTIC DEVICE, AND ELECTRONIC DEVICE
    • 光电转换装置,电光装置和电子装置
    • US20100171122A1
    • 2010-07-08
    • US12635358
    • 2009-12-10
    • Tsukasa EGUCHI
    • Tsukasa EGUCHI
    • H01L31/0368
    • H01L27/14603H01L27/14634H01L27/14665
    • The photoelectric conversion device includes: a photoelectric conversion element in which a first electrode, a photoelectric conversion layer, and a second electrode are stacked in this order; and a thin film transistor (TFT) connected to the first electrode of the photoelectric conversion element via a contact hole, wherein the photoelectric conversion layer including a first photoelectric conversion layer disposed at a location which does not overlap with the contact hole and a second photoelectric conversion layer disposed at a location which overlaps with the contact hole, the first photoelectric conversion layer and the second photoelectric conversion layer are separated from each other by a separation groove, and the second electrode is selectively formed on the first photoelectric conversion layer, and the photoelectric conversion element is formed by the first electrode, the first photoelectric conversion layer, and the second electrode.
    • 光电转换装置包括:依次层叠第一电极,光电转换层和第二电极的光电转换元件; 以及薄膜晶体管(TFT),其经由接触孔与所述光电转换元件的第一电极连接,其中所述光电转换层包括设置在与所述接触孔不重叠的位置处的第一光电转换层和第二光电转换层 转换层设置在与接触孔重叠的位置处,第一光电转换层和第二光电转换层通过分隔槽彼此分离,并且第二电极选择性地形成在第一光电转换层上,并且 光电转换元件由第一电极,第一光电转换层和第二电极形成。
    • 7. 发明申请
    • LIGHT EMITTING DEVICE, METHOD OF DRIVING THE SAME, AND ELECTRONIC APPARATUS
    • 发光装置,其驱动方法和电子装置
    • US20090140658A1
    • 2009-06-04
    • US12325500
    • 2008-12-01
    • Hiroaki JOTsukasa EGUCHIEiji KANDAToshiyuki KASAI
    • Hiroaki JOTsukasa EGUCHIEiji KANDAToshiyuki KASAI
    • H05B37/02
    • H05B33/0854H05B33/0851
    • There is provided a method of driving a light emitting device including a light emitting element and a unit circuit that is disposed in correspondence with the light emitting element and drives the tight emitting element in accordance with emission control data generated based on image data, wherein the light emitting device has a temperature sensor and a light receiving sensor. The method includes detecting the temperature of the light emitting device by using the temperature sensor, detecting light emitted from the light emitting element by using the light receiving sensor, and generating the emission control data by correcting the image data in response to the temperature of the light emitting device which is detected by the temperature sensor and the detected value of light which is detected by the light receiving sensor.
    • 提供了一种驱动包括发光元件和单元电路的发光器件的方法,该发光元件和单元电路相对于发光元件设置并且根据基于图像数据产生的发射控制数据驱动紧密发射元件,其中, 发光装置具有温度传感器和光接收传感器。 该方法包括使用温度传感器检测发光器件的温度,通过使用光接收传感器来检测从发光元件发射的光,并且通过响应于温度传感器的温度校正图像数据来产生发射控制数据 由温度传感器检测的发光装置和由光接收传感器检测到的光的检测值。