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1. 发明授权

US4650777A Method for preparing aluminum nitride ceramics having superior thermal conductivities 失效
标题翻译：制备具有优异导热性的氮化铝陶瓷的方法
公开(公告)号：US4650777A
公开(公告)日：1987-03-17
申请号：US693105
申请日：1985-01-22
申请人： Yasuhiro Kurokawa , Kazuaki Utsumi , Hideo Takamizawa
发明人： Yasuhiro Kurokawa , Kazuaki Utsumi , Hideo Takamizawa
IPC分类号： C04B35/581 , C04B35/58
CPC分类号： C04B35/581
摘要： Aluminum nitride ceramics is prepared by mixing acetylide of calcium, strontium, barium or other material with raw aluminum nitride powder with a content between 0.02 and 10 wt %, forming the mixture into a predetermined shape and sintering the formed body in a non-oxidizing atmosphere such as nitrogen gas by pressureless and/or pressure sintering technique.
摘要翻译：通过将钙，锶，钡或其他材料的乙炔化物与含量为0.02至10重量％的原料氮化铝粉末混合制备氮化铝陶瓷，将混合物形成预定形状，并在非氧化性气氛中烧结成形体例如通过无压和/或加压烧结技术的氮气。

2. 发明授权

US4724283A Multi-layer circuit board having a large heat dissipation 失效
标题翻译：散热大的多层电路板
公开(公告)号：US4724283A
公开(公告)日：1988-02-09
申请号：US912537
申请日：1986-09-29
申请人： Yuzo Shimada , Yasuhiro Kurokawa , Kazuaki Utsumi
发明人： Yuzo Shimada , Yasuhiro Kurokawa , Kazuaki Utsumi
IPC分类号： H05K3/46 , H01L23/15 , H01L23/538 , H05K1/03 , H05K1/09 , H05K1/00
CPC分类号： H01L23/5383 , H01L23/15 , H01L2924/0002 , H05K1/092 , H05K3/4611 , H05K3/4629
摘要： A multi-layer circuit board is disclosed which includes a plurality of AlN ceramic layers stocked and combined as an integrated form and wiring layers interposed at different levels between the AlN ceramic layers. The wiring layers are made of a mixture of tungsten and AlN ceramic particles, the content of the AlN ceramic particles being 0.5 to 2.0 wt. %. A plurality of through-holes are formed in the AlN ceramic layers to interconnect the wiring layers formed at different levels.
摘要翻译：公开了一种多层电路板，其包括存储并组合为集成形式的多个AlN陶瓷层和插入在AlN陶瓷层之间的不同层次的布线层。布线层由钨和AlN陶瓷颗粒的混合物制成，AlN陶瓷颗粒的含量为0.5-2.0wt。％。在AlN陶瓷层中形成多个通孔以使形成在不同层次的布线层互相连接。

3. 发明授权

US07568690B2 Paper supply device and image forming apparatus using the paper supply device 有权
标题翻译：供纸装置和使用供纸装置的成像装置
公开(公告)号：US07568690B2
公开(公告)日：2009-08-04
申请号：US11405574
申请日：2006-04-18
申请人： Yasuhiro Kurokawa , Satoru Shiraishi
发明人： Yasuhiro Kurokawa , Satoru Shiraishi
IPC分类号： B65H3/44
CPC分类号： B65H3/44 , B65H1/266 , B65H2220/09 , B65H2301/13 , B65H2405/313 , B65H2405/33
摘要： A paper supply device includes: a paper supply cassette that is loaded into an image forming apparatus body, such that the paper supply cassette can be freely pulled out, and is disposed with a first sheet housing for supplying sheets to an image forming section of the image forming apparatus body; and a second sheet supply mechanism that is disposed in the paper supply cassette and is for supplying, to the image forming section of the image forming apparatus body, sheets housed in a second sheet housing different from the first sheet housing, wherein a recessed portion, through which paper supplying means that is disposed in the image forming apparatus body and supplies sheets to the image forming apparatus body from the second sheet housing passes when the paper supply cassette is loaded into and unloaded from the image forming apparatus body, is formed in the paper supply cassette.
摘要翻译：供纸装置包括：装载到图像形成装置主体中的供纸盒，使得供纸盒可以自由地拉出，并且设置有用于将纸张供应到图像形成部分的第一纸张壳体图像形成装置主体; 以及第二供纸机构，其设置在所述供纸盒中，并且用于向所述图像形成设备主体的图像形成部分提供容纳在与所述第一纸张外壳不同的第二纸张外壳中的纸张，其中凹部，在供纸盒被装载到图像形成装置主体中并从其卸载时，通过该纸供给装置设置在图像形成装置主体中并且从第二纸张壳体向图像形成装置主体供应纸张，供纸盒

4. 发明授权

US07546061B2 Image forming device 有权
标题翻译：图像形成装置
公开(公告)号：US07546061B2
公开(公告)日：2009-06-09
申请号：US11607955
申请日：2006-12-04
申请人： Yasuhiro Kurokawa , Toshimitsu Kobayashi
发明人： Yasuhiro Kurokawa , Toshimitsu Kobayashi
IPC分类号： G03G15/00 , B41F17/00
CPC分类号： B41J13/103 , B41J29/54 , B65H1/26 , B65H2407/10 , B65H2801/09 , B65H2801/12 , E05B73/0005 , E05B73/0082
摘要： An image forming device has: a cassette that accommodates a recording medium and that can be pulled out from a front surface of a device main body; and a lock unit locking the cassette to a rear surface of the device main body. The lock unit may have: a lock hole formed in a peripheral wall of the cassette; a bracket mounted to a rear surface side of the device main body; a lock having a rod, that passes through a hole formed in the bracket and that is inserted in the lock hole, and a hook, that is formed at the rod and that hooks on the lock hole; and a wire connecting the lock and a heavy object.
摘要翻译：图像形成装置具有：容纳记录介质并且可以从装置主体的前表面拉出的盒; 以及锁定单元，其将所述盒锁定到所述装置主体的后表面。锁定单元可以具有：形成在盒的周壁中的锁定孔; 安装到所述装置主体的后表面侧的支架; 具有杆的锁具，其穿过形成在所述支架中并插入所述锁定孔中的孔，以及形成在所述杆处并钩在所述锁定孔上的钩; 以及连接锁和重物的电线。

5. 发明授权

US4642287A Process for pretreating biomasses in advance of their enzymatic treatment 失效
标题翻译：在其酶处理之前预处理生物质的方法
公开(公告)号：US4642287A
公开(公告)日：1987-02-10
申请号：US596937
申请日：1984-04-05
申请人： Takeshi Inoi , Toshiaki Akabane , Yasuhiro Kurokawa , Shingo Matsuoka
发明人： Takeshi Inoi , Toshiaki Akabane , Yasuhiro Kurokawa , Shingo Matsuoka
IPC分类号： C12P19/14 , C13K1/02 , B01J3/00 , C12P19/02
CPC分类号： C13K1/02 , C12P19/14 , C12P2201/00
摘要： An improved process for pretreating biomasses in advance of their enzymatic treatment is provided which process comprises subjecting a biomass together with an aqueous solution of an alkaline compound to kneading and reaction in a biaxial extruder, and which process has advantages that a continuous treatment in a very short time is possible, and the heat quantity required for the pretreatment is greatly reduced.
摘要翻译：提供了在其酶处理之前预处理生物质的改进方法，该方法包括使生物质与碱性化合物的水溶液一起在双轴挤出机中捏和和反应，并且该方法具有以下优点：时间短，预处理所需的热量大大降低。

6. 发明授权

US08382094B2 Recording medium feeding device and image forming apparatus 有权
标题翻译：记录介质供给装置和图像形成装置
公开(公告)号：US08382094B2
公开(公告)日：2013-02-26
申请号：US13271702
申请日：2011-10-12
申请人： Yuji Hayakawa , Yasuhiro Kurokawa , Teruki Naganuma
发明人： Yuji Hayakawa , Yasuhiro Kurokawa , Teruki Naganuma
IPC分类号： B65H5/00 , B65H3/06
CPC分类号： G03G15/6511 , B65H3/0607 , B65H3/0684 , B65H3/44 , B65H2511/20 , B65H2511/214 , B65H2511/414 , B65H2511/415 , B65H2513/412 , G03G2215/0132 , B65H2220/01 , B65H2220/02
摘要： A recording medium feeding device includes a first rotating member picking up a recording medium, a second rotating member transporting the picked-up recording medium, a driving gear unit rotating and transmitting a driving force, a first transmission mechanism having a first gear and transmitting the driving force in a first rotation direction to the first rotating member and the second rotating member, a second transmission mechanism having a second gear and transmitting the driving force in a second rotation direction to the first rotating member, and a transmission adjusting portion transmitting the driving force of either one of the first or second gear to either one of the first or second transmission mechanism, wherein the first gear rotates in the first rotation direction, the second gear rotates in the second rotation direction, and the driving gear unit engages with both the first and second gear within a predetermined range.
摘要翻译：记录介质供给装置包括拾取记录介质的第一旋转构件，传送拾取记录介质的第二旋转构件，旋转并传递驱动力的驱动齿轮单元，具有第一齿轮的第一传动机构，向第一旋转构件和第二旋转构件沿第一旋转方向的驱动力，具有第二齿轮并将驱动力沿第二旋转方向传递到第一旋转构件的第二传动机构，以及传递调节部，所述第一或第二齿轮中的任一个对第一或第二传动机构中的任一个的力，其中第一齿轮沿第一旋转方向旋转，第二齿轮沿第二旋转方向旋转，并且驱动齿轮单元与两者啮合第一和第二档位在预定范围内。

7. 发明授权

US07549630B2 Sheet supplying device and image forming device 有权
标题翻译：片材供应装置和图像形成装置
公开(公告)号：US07549630B2
公开(公告)日：2009-06-23
申请号：US10872540
申请日：2004-06-22
申请人： Naoto Sugimura , Yasuhiro Kurokawa
发明人： Naoto Sugimura , Yasuhiro Kurokawa
IPC分类号： B65H3/06
CPC分类号： B65H1/266 , B65H1/04 , B65H1/12 , B65H3/0607 , B65H2301/42344 , B65H2403/512 , B65H2405/1117
摘要： A sheet supplying device has: a base; a tray; a feed roller provided rotatably at the base and positioned above the tray. When the feed roller rotates while frictionally engaging with a topmost sheet of the stack of sheets, the feed roller can convey the sheet. The sheet supplying device further includes a driving mechanism able to drive the feed roller to rotate; an urging member urging the tray toward the feed roller; a first eccentric cam rotatably provided at the base, and including a large-radius outer peripheral portion and a small-radius outer peripheral portion, the first eccentric cam rotating interlockingly with rotation of the feed roller; and a second eccentric cam rotatably provided at the tray, and including a large-radius outer peripheral portion and a small-radius outer peripheral portion, the second eccentric cam being able to engage with the first eccentric cam.
摘要翻译：片材供应装置具有：基座; 一个托盘; 馈送辊，其可旋转地设置在基部并且位于托盘的上方。当进给辊旋转同时与纸张堆的最上面的片材摩擦接合时，进给辊可以输送片材。片材供给装置还包括能够驱动进给辊旋转的驱动机构; 推动构件将托盘朝向进给辊推动; 第一偏心凸轮可旋转地设置在基座处，并且包括大半径的外周部分和小半径的外周部分，第一偏心凸轮与进给辊的旋转互锁地旋转; 以及可旋转地设置在所述托盘处的第二偏心凸轮，并且包括大半径的外周部和小半径的外周部，所述第二偏心凸轮能够与所述第一偏心凸轮接合。

8. 发明申请

US20070057438A1 Paper supply device and image forming apparatus using the paper supply device 有权
标题翻译：供纸装置和使用供纸装置的成像装置
公开(公告)号：US20070057438A1
公开(公告)日：2007-03-15
申请号：US11405574
申请日：2006-04-18
申请人： Yasuhiro Kurokawa , Satoru Shiraishi
发明人： Yasuhiro Kurokawa , Satoru Shiraishi
IPC分类号： B65H1/22
CPC分类号： B65H3/44 , B65H1/266 , B65H2220/09 , B65H2301/13 , B65H2405/313 , B65H2405/33
摘要： A paper supply device includes: a paper supply cassette that is loaded into an image forming apparatus body, such that the paper supply cassette can be freely pulled out, and is disposed with a first sheet housing for supplying sheets to an image forming section of the image forming apparatus body; and a second sheet supply mechanism that is disposed in the paper supply cassette and is for supplying, to the image forming section of the image forming apparatus body, sheets housed in a second sheet housing different from the first sheet housing, wherein a recessed portion, through which paper supplying means that is disposed in the image forming apparatus body and supplies sheets to the image forming apparatus body from the second sheet housing passes when the paper supply cassette is loaded into and unloaded from the image forming apparatus body, is formed in the paper supply cassette.
摘要翻译：供纸装置包括：装载到图像形成装置主体中的供纸盒，使得供纸盒可以自由地拉出，并且设置有用于将纸张供应到图像形成部分的第一纸张壳体图像形成装置主体; 以及第二供纸机构，其设置在所述供纸盒中，并且用于向所述图像形成设备主体的图像形成部分提供容纳在与所述第一纸张外壳不同的第二纸张外壳中的纸张，其中凹部，在供纸盒被装载到图像形成装置主体中并从其卸载时，通过该纸供给装置设置在图像形成装置主体中并且从第二纸张壳体向图像形成装置主体供应纸张，供纸盒

9. 发明授权

US06137170A Mount for semiconductor device 失效
标题翻译：安装半导体器件
公开(公告)号：US06137170A
公开(公告)日：2000-10-24
申请号：US908063
申请日：1997-08-11
申请人： Masato Ujiie , Yasuhiro Kurokawa
发明人： Masato Ujiie , Yasuhiro Kurokawa
IPC分类号： H01L23/12 , H01L23/13 , H01L23/367 , H01L23/48
CPC分类号： H01L24/32 , H01L23/13 , H01L23/3677 , H01L2224/27013 , H01L2224/29007 , H01L2224/32014 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195
摘要： A semiconductor device includes a semiconductor pellet (1), and a package having a pellet mount portion (21) on which a semiconductor pellet (1) is mounted. The semiconductor pellet (1) is mounted on the pellet mount portion (21) of the package through a joint material (6). The area of the surface of the pellet mount portion (21) on which the semiconductor pellet (1) is mounted is set to be smaller than the area of the surface of the semiconductor pellet (1) which is mounted on the pellet mount portion (21), thereby preventing the climb-up of the joint material (6) along the side surface of the semiconductor pellet (1).
摘要翻译：半导体器件包括半导体颗粒（1）和具有安装有半导体颗粒（1）的颗粒安装部分（21）的封装。半导体颗粒（1）通过接头材料（6）安装在包装的颗粒安装部分（21）上。安装有半导体颗粒（1）的颗粒安装部分（21）的表面的面积被设定为小于安装在颗粒安装部分上的半导体颗粒（1）的表面的面积 21），从而防止接合材料（6）沿着半导体颗粒（1）的侧表面的爬升。

10. 发明授权

US5291064A Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing 失效
标题翻译：具有与封装壳体间隔开的柔性布线电路部件的半导体器件的封装结构
公开(公告)号：US5291064A
公开(公告)日：1994-03-01
申请号：US870033
申请日：1992-04-16
申请人： Yasuhiro Kurokawa
发明人： Yasuhiro Kurokawa
IPC分类号： H01L23/057 , H01L23/473 , H01L23/498 , H01L23/538 , H01L23/02 , H01L23/12 , H01L25/04 , H01L39/02
CPC分类号： H01L23/5385 , H01L23/057 , H01L23/473 , H01L23/49816 , H01L2224/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/01004 , H01L2924/01079 , H01L2924/09701 , H01L2924/15174 , H01L2924/15192 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/3011
摘要： A packaged semiconductor device has a wiring substrate. A plurality of semiconductor device chips are connected to the wiring substrate by a use of bumps. A heat sink is bonded through a high heat conductive bonding layer to a surface of each of the semiconductor device chips. In addition, a package casing which accommodates the semiconductor device chips and the wiring substrate, has internal conductors which are positioned in the inside of the package casing. External connection pins extend outwardly from the package casing and are connected to corresponding internal conductors. The wiring substrate is connected to the internal conductors of the package casing via a flexible wiring circuit member. The flexibility of this wiring permits the thermal expansion and contraction to occur without breaking the connections to the bumps.
摘要翻译：封装的半导体器件具有布线基板。通过使用凸块将多个半导体器件芯片连接到布线基板。散热器通过高导热接合层粘接到每个半导体器件芯片的表面。此外，容纳半导体器件芯片和布线基板的封装壳体具有位于封装壳体内部的内部导体。外部连接引脚从封装外壳向外延伸，并连接到相应的内部导体。布线基板经由挠性布线电路部件与封装壳体的内部导体连接。该布线的灵活性允许发生热膨胀和收缩而不破坏与凸块的连接。

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