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1. 发明申请

US20080057299A1 Laminate for wiring board 审中-公开
标题翻译：接线板层压板
公开(公告)号：US20080057299A1
公开(公告)日：2008-03-06
申请号：US11891630
申请日：2007-08-10
申请人： Yasuhiro Adachi , Hironori Nagaoka , Hongyuan Wang , Naoko Osawa , Masahiko Takeuchi , Hironobu Kawasato
发明人： Yasuhiro Adachi , Hironori Nagaoka , Hongyuan Wang , Naoko Osawa , Masahiko Takeuchi , Hironobu Kawasato
IPC分类号： B32B15/08 , B32B27/06
CPC分类号： H05K1/0346 , C08G73/1042 , H05K1/036 , H05K2201/0154 , Y10T428/264 , Y10T428/31681
摘要： The present invention aims to provide a polyimide resin excellent in heat resistance, dimensional stability, and toughness as an insulating layer, and to obtain a laminate suitable for a flexible wiring board by using the polyimide resin, the laminate being excellent in resistance to rupture and flexibility even when the thickness of a polyimide resin layer is small. Provided is a laminate for a wiring board having a metal layer on at least one surface of a polyimide resin layer, in which a polyimide resin layer (A) obtained by imidating a polyimide precursor resin having a weight average molecular weight of 150,000 to 800,000 is a main polyimide resin layer, and a polyimide resin of which the main polyimide resin layer is constituted has structural units represented by the following general formulae (1) and (2) where R represents a lower alkyl group, a phenyl group, or a halogen atom, and Ar1 represents a residue of bis(aminophenoxy)benzene or bis(aminophenoxy)naphthalene.
摘要翻译：本发明旨在提供一种作为绝缘层的耐热性，尺寸稳定性和韧性优异的聚酰亚胺树脂，并且通过使用聚酰亚胺树脂获得适用于柔性布线板的层压体，该层压板具有优异的抗断裂性和即使当聚酰亚胺树脂层的厚度小时也是灵活的。本发明提供一种在聚酰亚胺树脂层的至少一个表面上具有金属层的布线基板的叠层体，其中通过酰亚胺化重均分子量为150,000〜800,000的聚酰亚胺前体树脂得到的聚酰亚胺树脂层（A）为主要聚酰亚胺树脂层和主要聚酰亚胺树脂层构成的聚酰亚胺树脂具有由以下通式（1）和（2）表示的结构单元，其中R表示低级烷基，苯基或卤素原子和Ar 1表示双（氨基苯氧基）苯或双（氨基苯氧基）萘的残基。

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