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    • 1. 发明申请
    • Automatic gain control device, radio communication device and automatic gain control method
    • 自动增益控制装置,无线通信装置及自动增益控制方式
    • US20050153672A1
    • 2005-07-14
    • US10516366
    • 2003-07-04
    • Yasuhiro Adachi
    • Yasuhiro Adachi
    • H04B7/005H04W28/18H04W52/00H04W52/02H04W52/22H04W52/50H04W52/52H04W64/00H04B1/06
    • H04W52/223H04W28/18H04W52/0245H04W52/50H04W52/52H04W64/00Y02D70/164
    • An automatic gain control apparatus and method that acquires current position of its own station at the start of communication to calculate the communication distance from a communication partner station and sets an initial value for gain of its variable gain amplifier based on the calculated communication distance. The automatic gain control apparatus according to the present invention comprises a variable gain amplifier 101 that amplifies the received signal with set gain; a current position acquiring section that acquires current position of its own station at the start of communication; a receive power estimation circuit 105 that calculates the communication distance from the communication partner station based on the acquired current position of its own station and estimates the receive level of the received signal at the start of communication based on the calculated communication distance; and an initial value setting circuit 104 that sets an initial value for the gain based on the estimated receive level of the received signal.
    • 一种自动增益控制装置和方法,其在通信开始时获取其本站的当前位置,以计算与通信对方站的通信距离,并根据计算出的通信距离设置其可变增益放大器的增益初始值。 根据本发明的自动增益控制装置包括:可变增益放大器101,其利用设定增益放大接收信号; 当前位置获取部分,其在通信开始时获取其本站的当前位置; 接收功率估计电路105,其基于所获取的本站的当前位置来计算与通信对方站的通信距离,并且基于所计算的通信距离估计在通信开始时的接收信号的接收电平; 以及基于接收信号的估计接收电平来设定增益的初始值的初始值设定电路104。
    • 2. 发明授权
    • Spring product manufacturing line
    • 弹簧制品生产线
    • US08561279B2
    • 2013-10-22
    • US12678604
    • 2008-09-18
    • Kazuhiro KohnoYasuhiro AdachiHiroki WatanabeNorio Takahashi
    • Kazuhiro KohnoYasuhiro AdachiHiroki WatanabeNorio Takahashi
    • B21D39/03
    • B21D11/10
    • The invention provides a spring product manufacturing line comprising: a manufacturing area 2 at which a formation device 50 attached to a base mount 52 plastically processes a spring material into a spring product; a formation device switching area 3 at which one formation device 50 is removed from the mount 52 and switched with another forming device 50; and a formation device transport line 4 that conveys a formation device 50 attached to a base mount 52 at the device switching area 3 to a manufacturing area 2; wherein the formation device 50 is provided with a plurality of formation units 54 that perform a bending process on the spring material by fluid pressure; the base mount 52 is provided with a pressure fluid line 62 that supplies pressure fluid to the formation units 54 provided at the formation device 50, and that is removably connected to each of the formation units 54; and the attachment or removal of the pressure fluid line 62 with respect to the formation device 50 is performed at the device switching area 3.
    • 本发明提供了一种弹簧制品生产线,包括:制造区域2,附接到基座52的成形装置50将弹簧材料塑性地加工成弹簧产品; 形成装置切换区域3,其中一个形成装置50从安装件52移除并与另一成形装置50切换; 以及将装置切换区域3上安装有基座52的地层装置50输送到制造区域2的地层装置输送路线4; 其中,形成装置50设置有多个形成单元54,其通过流体压力对弹簧材料进行弯曲加工; 基座52设置有压力流体管线62,其将压力流体供应到设置在形成装置50处的形成单元54,并且可移除地连接到每个形成单元54; 并且在设备切换区域3处执行压力流体管线62相对于形成装置50的附接或移除。
    • 5. 发明申请
    • SPRING PRODUCT MANUFACTURING LINE
    • 弹簧制品生产线
    • US20100212134A1
    • 2010-08-26
    • US12678604
    • 2008-09-18
    • Kazuhiro KohnoYasuhiro AdachiHiroki WatanabeNorio Takahashi
    • Kazuhiro KohnoYasuhiro AdachiHiroki WatanabeNorio Takahashi
    • B21B15/00
    • B21D11/10
    • The invention provides a spring product manufacturing line comprising: a manufacturing area 2 at which a formation device 50 attached to a base mount 52 plastically processes a spring material into a spring product; a formation device switching area 3 at which one formation device 50 is removed from the mount 52 and switched with another forming device 50; and a formation device transport line 4 that conveys a formation device 50 attached to a base mount 52 at the device switching area 3 to a manufacturing area 2; wherein the formation device 50 is provided with a plurality of formation units 54 that perform a bending process on the spring material by fluid pressure; the base mount 52 is provided with a pressure fluid line 62 that supplies pressure fluid to the formation units 54 provided at the formation device 50, and that is removably connected to each of the formation units 54; and the attachment or removal of the pressure fluid line 62 with respect to the formation device 50 is performed at the device switching area 3.
    • 本发明提供了一种弹簧制品生产线,包括:制造区域2,附接到基座52的成形装置50将弹簧材料塑性地加工成弹簧产品; 形成装置切换区域3,其中一个形成装置50从安装件52移除并与另一成形装置50切换; 以及将装置切换区域3上安装有基座52的地层装置50输送到制造区域2的地层装置输送路线4; 其中,形成装置50设置有多个形成单元54,其通过流体压力对弹簧材料进行弯曲加工; 基座52设置有压力流体管线62,其将压力流体供应到设置在形成装置50处的形成单元54,并且可移除地连接到每个形成单元54; 并且在设备切换区域3处执行压力流体管线62相对于形成装置50的附接或移除。
    • 6. 发明申请
    • Laminate for wiring board
    • 接线板层压板
    • US20080057299A1
    • 2008-03-06
    • US11891630
    • 2007-08-10
    • Yasuhiro AdachiHironori NagaokaHongyuan WangNaoko OsawaMasahiko TakeuchiHironobu Kawasato
    • Yasuhiro AdachiHironori NagaokaHongyuan WangNaoko OsawaMasahiko TakeuchiHironobu Kawasato
    • B32B15/08B32B27/06
    • H05K1/0346C08G73/1042H05K1/036H05K2201/0154Y10T428/264Y10T428/31681
    • The present invention aims to provide a polyimide resin excellent in heat resistance, dimensional stability, and toughness as an insulating layer, and to obtain a laminate suitable for a flexible wiring board by using the polyimide resin, the laminate being excellent in resistance to rupture and flexibility even when the thickness of a polyimide resin layer is small. Provided is a laminate for a wiring board having a metal layer on at least one surface of a polyimide resin layer, in which a polyimide resin layer (A) obtained by imidating a polyimide precursor resin having a weight average molecular weight of 150,000 to 800,000 is a main polyimide resin layer, and a polyimide resin of which the main polyimide resin layer is constituted has structural units represented by the following general formulae (1) and (2) where R represents a lower alkyl group, a phenyl group, or a halogen atom, and Ar1 represents a residue of bis(aminophenoxy)benzene or bis(aminophenoxy)naphthalene.
    • 本发明旨在提供一种作为绝缘层的耐热性,尺寸稳定性和韧性优异的聚酰亚胺树脂,并且通过使用聚酰亚胺树脂获得适用于柔性布线板的层压体,该层压板具有优异的抗断裂性和 即使当聚酰亚胺树脂层的厚度小时也是灵活的。 本发明提供一种在聚酰亚胺树脂层的至少一个表面上具有金属层的布线基板的叠层体,其中通过酰亚胺化重均分子量为150,000〜800,000的聚酰亚胺前体树脂得到的聚酰亚胺树脂层(A)为 主要聚酰亚胺树脂层和主要聚酰亚胺树脂层构成的聚酰亚胺树脂具有由以下通式(1)和(2)表示的结构单元,其中R表示低级烷基,苯基或卤素 原子和Ar 1表示双(氨基苯氧基)苯或双(氨基苯氧基)萘的残基。