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1. 发明授权

US5174853A Forsterite single crystal and method for the manufacture of the same 失效
标题翻译：用于制造其的单体晶体和方法
公开(公告)号：US5174853A
公开(公告)日：1992-12-29
申请号：US750457
申请日：1991-08-27
申请人： Yasuhide Yamaguchi , Yukio Nobe , Akiko Sugimoto
发明人： Yasuhide Yamaguchi , Yukio Nobe , Akiko Sugimoto
IPC分类号： C30B29/34 , C30B15/00 , H01S3/16
CPC分类号： H01S3/16 , C30B15/00 , C30B29/34 , H01S3/1623 , H01S3/1658
摘要： In a method for manufacturing forsterite single crystals containing tetravalent chromium as luminescent ions, the method which comprises the use of chromium dioxide or comprises the use of a sintered body obtained either by sintering in a non-reducing atmosphere chromium trioxide or a mixture of at least 30 wt. % of chromium trioxide with up to 70 wt. % of dichromium trioxide, together with other oxide materials for forsterite, or by firing in an oxidizing atmosphere a mixture of more than 70 wt. % of dichromium trioxide with less than 30 wt. % of chromium trioxide, together with other oxide materials for forsterite. This invention also relates to forsterite single crystals obtained by each of the above methods.

2. 发明授权

US06610418B1 Electolytic copper foil with carrier foil and method for manufacturing the same 失效
标题翻译：带载体箔的电解铜箔及其制造方法
公开(公告)号：US06610418B1
公开(公告)日：2003-08-26
申请号：US10031279
申请日：2001-11-07
申请人： Junshi Yoshioka , Akiko Sugimoto , Makoto Dobashi , Ken-ichiro Iwakiri , Yutaka Hirasawa
发明人： Junshi Yoshioka , Akiko Sugimoto , Makoto Dobashi , Ken-ichiro Iwakiri , Yutaka Hirasawa
IPC分类号： B32B1508
CPC分类号： H05K3/025 , C25D1/04 , C25D1/22 , Y10S428/935 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/254 , Y10T428/31678
摘要： The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.
摘要翻译：本发明提供具有载体的电沉积铜箔，其具有允许控制载体箔和电解铜箔之间的剥离强度的下限的有机粘合界面层以及用载体制造电沉积铜箔的方法。在具有载体箔的载体的电沉积铜箔中，形成在载体箔上的粘合界面层和形成在粘合界面层上的电沉积铜箔，载体箔由铜箔形成，粘合界面层包含有机试剂和金属颗粒，有机试剂和金属颗粒处于混合状态。

3. 发明授权

US4517189A 2,6,7,8-Substituted quinazolines, process for production thereof, and use thereof 失效
标题翻译： 2,6,7,8-取代的喹唑啉，其制备方法及其用途
公开(公告)号：US4517189A
公开(公告)日：1985-05-14
申请号：US519235
申请日：1983-08-02
申请人： Masayuki Ishikawa , Hiroshi Azuma , Akiko Sugimoto , Noriko Takahashi , Yoshimi Takashima
发明人： Masayuki Ishikawa , Hiroshi Azuma , Akiko Sugimoto , Noriko Takahashi , Yoshimi Takashima
IPC分类号： C07D239/74 , A61K31/505
CPC分类号： C07D239/74
摘要： A 2,6,7,8-substituted quinazoline represented by the following formula ##STR1## wherein R.sub.1 and R.sub.3 each represent a lower alkyl group, R.sub.2 represents a lower alkoxy-carbonyl group, and A represents a lower alkyl group, or a phenyl or benzyl group which is unsubstituted or substituted by a substituent selected from the class consisting of halogen atoms, a trifluoromethyl group and lower alkyl groups, or its acid addition salt. The said compound can be prepared by reacting a compound represented by the following formula ##STR2## wherein R.sub.1, R.sub.2, R.sub.3 and A are as defined, with ammonia. A pharmaceutical composition comprising the said compound as an active ingredient is useful for the treatment of disorders of the circulatory system.
摘要翻译：由下式[IMAGE]表示的2,6,7,8-取代喹唑啉其中R1和R3各自表示低级烷基，R2表示低级烷氧基 - 羰基，A表示低级烷基或苯基或未取代或被选自卤素原子，三氟甲基和低级烷基的取代基取代的苄基或其酸加成盐。所述化合物可以通过使下式（其中R 1，R 2，R 3和A如上所定义）与氨反应的化合物制备。包含所述化合物作为活性成分的药物组合物可用于治疗循环系统疾病。

4. 发明授权

US08795073B2 Game apparatus, storage medium, game system, and game method 有权
标题翻译：游戏装置，存储介质，游戏系统和游戏方法
公开(公告)号：US08795073B2
公开(公告)日：2014-08-05
申请号：US13282890
申请日：2011-10-27
申请人： Akira Otani , Toshiharu Izuno , Hiroyuki Kubota , Akiko Sugimoto
发明人： Akira Otani , Toshiharu Izuno , Hiroyuki Kubota , Akiko Sugimoto
IPC分类号： A63F9/24 , A63F13/00 , G06F17/00 , G06F19/00
CPC分类号： A63F13/26 , A63F13/426 , A63F13/52 , A63F2300/1075 , A63F2300/204 , A63F2300/30
摘要： A first display section is caused to perform stereoscopic display, and a second display section is caused to perform non-stereoscopic display. A pointed position within an image displayed on the second display section is detected on the basis of an input of a player, it is determined that a second object within the image displayed on the second display section is operated, on the basis of a result of the detection, and a first object displayed on the first display section is changed on the basis of the determination.
摘要翻译：使第一显示部分进行立体显示，并且使第二显示部分进行非立体显示。基于玩家的输入来检测显示在第二显示部分上的图像内的指向位置，根据第二显示部分的结果确定显示在第二显示部分上的图像内的第二对象被操作基于该确定来改变检测和显示在第一显示部分上的第一对象。

5. 发明授权

US07217464B2 Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method 有权
标题翻译：使用制造方法制造的具有用于高温耐热性的载体箔的电解铜箔和具有用于高温耐热性的载体箔的电沉积铜箔的方法
公开(公告)号：US07217464B2
公开(公告)日：2007-05-15
申请号：US10483612
申请日：2003-05-12
申请人： Akitoshi Takanashi , Kenichiro Iwakiri , Akiko Sugimoto , Junshi Yoshioka , Shinichi Obata , Makoto Dobashi
发明人： Akitoshi Takanashi , Kenichiro Iwakiri , Akiko Sugimoto , Junshi Yoshioka , Shinichi Obata , Makoto Dobashi
IPC分类号： B32B15/04 , B32B15/20 , B05D1/18 , B05D3/10 , C23G1/02
CPC分类号： B32B15/08 , C25D1/04 , C25D7/0614 , H05K3/025 , Y10T428/12438 , Y10T428/12556 , Y10T428/12569 , Y10T428/12903 , Y10T428/1291 , Y10T428/31678
摘要： The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose are adopted “a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed” and others.
摘要翻译：本发明提供一种制造具有用于高温耐热性的载体箔的电沉积铜箔的方法，其中即使在不低于200℃的温度下进行压制加工，载体箔的剥离也容易。为此，采用“使用有机试剂在载体箔的表面上形成有机粘合界面层的电解铜箔的高温耐热性的电解铜箔的制造方法和电沉积铜在有机粘合剂界面层上形成箔层，其特征在于，通过使用含有50ppm的酸洗液对载体箔的表面酸洗，在载体箔的表面上形成有机粘合界面层到2000ppm的用于形成粘合界面层的有机试剂，同时使有机试剂吸附，由此形成酸洗和吸附的有机膜“等。

6. 发明授权

US06984453B2 Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil 失效
标题翻译：具有载体箔的电解铜箔，其制造方法和使用具有载体箔的电解质铜箔的层压板
公开(公告)号：US06984453B2
公开(公告)日：2006-01-10
申请号：US10467670
申请日：2002-12-12
申请人： Akiko Sugimoto , Junshi Yoshioka , Makoto Dobashi
发明人： Akiko Sugimoto , Junshi Yoshioka , Makoto Dobashi
IPC分类号： B32B15/04 , C25D3/38
CPC分类号： C25D1/04 , B32B7/06 , B32B15/08 , B32B15/20 , H05K3/025 , Y10S428/926 , Y10S428/935 , Y10S428/938 , Y10T428/12903 , Y10T428/265 , Y10T428/31678
摘要： An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.
摘要翻译：目的是提供具有载体箔的可剥离的电沉积铜箔，其即使在需要在200℃的温度下压制的印刷线路板的制造中也能稳定载体箔和电沉积铜箔层之间的剥离强度。或更高。为了实现该目的，具有载体箔1的电沉积铜箔包括布置在载体箔2的一个表面上的粘合界面层4和布置在粘合界面层4上的电沉积铜箔层3，其特征在于粘合界面层4由金属氧化物层ML和有机材料层OL构成。

7. 发明申请

US20120157196A1 GAME APPARATUS, STORAGE MEDIUM, GAME SYSTEM, AND GAME METHOD 有权
标题翻译：游戏装置，存储媒体，游戏系统和游戏方法
公开(公告)号：US20120157196A1
公开(公告)日：2012-06-21
申请号：US13282890
申请日：2011-10-27
申请人： Akira OTANI , Toshiharu Izuno , Hiroyuki Kubota , Akiko Sugimoto
发明人： Akira OTANI , Toshiharu Izuno , Hiroyuki Kubota , Akiko Sugimoto
IPC分类号： A63F13/00 , A63F9/24
CPC分类号： A63F13/26 , A63F13/426 , A63F13/52 , A63F2300/1075 , A63F2300/204 , A63F2300/30
摘要： A first display section is caused to perform stereoscopic display, and a second display section is caused to perform non-stereoscopic display. A pointed position within an image displayed on the second display section is detected on the basis of an input of a player, it is determined that a second object within the image displayed on the second display section is operated, on the basis of a result of the detection, and a first object displayed on the first display section is changed on the basis of the determination.
摘要翻译：使第一显示部分进行立体显示，并且使第二显示部分进行非立体显示。基于玩家的输入来检测显示在第二显示部分上的图像内的指向位置，根据第二显示部分的结果确定显示在第二显示部分上的图像内的第二对象被操作基于该确定来改变检测和显示在第一显示部分上的第一对象。

8. 发明授权

US06291485B1 4,5-dihydro-[1H]-benz[g]indazole-3-carboxylic acid derivatives 失效
标题翻译： 4,5-二氢 - [1H] - 苯并[g]吲唑-3-羧酸衍生物
公开(公告)号：US06291485B1
公开(公告)日：2001-09-18
申请号：US09462413
申请日：2000-01-10
申请人： Hiroshi Azuma , Haruo Yamashita , Katsuyuki Keino , Shuji Ota , Takahisa Saito , Shuichiro Sato , Hidehisa Hamasaki , Katsura Suzuki , Akiko Sugimoto
发明人： Hiroshi Azuma , Haruo Yamashita , Katsuyuki Keino , Shuji Ota , Takahisa Saito , Shuichiro Sato , Hidehisa Hamasaki , Katsura Suzuki , Akiko Sugimoto
IPC分类号： A01N4340
CPC分类号： C07D401/14 , C07D403/12 , C07D403/14 , C07D405/14
摘要： 4,5-Dihydro-[1H]-benz[g]indazole-3-carboxylic acid derivatives represented by the following formula, or their salts, have excellent antagonism to endothelin receptors and are useful as preventives or remedies for diseases such as hypertension, angina pectoris, myocardial infarction, brain infarction, cerebrovascular contraction, renal insufficiency, hepatic dysfunction, arteriosclerosis and post-PTCA restenosis. wherein Ar represents an optionally substituted aryl group, and R1 represents a hydrogen atom, an optionally substituted lower alkyl group, an optionally substituted aryl group, an optionally substituted cycloalkyl group or an optionally substituted heterocyclic group.
摘要翻译：由下式表示的4,5-二氢 - [1H] - 苯并[g]吲唑-3-羧酸衍生物或其盐对内皮素受体具有优异的拮抗作用，可用作疾病如高血压，心绞痛，心肌梗塞，脑梗塞，脑血管收缩，肾功能不全，肝功能障碍，动脉硬化和PTCA后再狭窄。其中Ar表示任选取代的芳基，R 1表示氢原子，任选取代的低级烷基，任选地取代的芳基，任选取代的环烷基或任选取代的杂环基。

9. 发明申请

US20070017816A1 Copper electrolysis solution for production of electrolytic copper foil and process for producing electrolytic copper foil 审中-公开
标题翻译：电解铜箔生产铜电解液及电解铜箔生产工艺
公开(公告)号：US20070017816A1
公开(公告)日：2007-01-25
申请号：US10556464
申请日：2004-11-11
申请人： Akiko Sugimoto
发明人： Akiko Sugimoto
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , C25D1/04
摘要： This invention is for providing a copper electrolyte solution producing an electrolytic copper foil capable of providing a foil in which the shape and size of mountains of the rough surface of the deposited foil are uniform and which has low roughness, substantially without decrease of the yield of deposited foil by controlling the molecular weight and the concentration of protein, etc. and a method of producing an electrolytic copper foil using the same. In this copper electrolyte solution for producing an electrolytic copper foil, protein in the copper electrolyte solution preferably has a number average molecular weight Mn of 1000 to 2300 and the copper electrolyte solution preferably has a protein concentration of 2 to 4.5 ppm. The electrolyte solution preferably has Cu2+ concentration of 60 to 100 g/L. In addition, the electrolyte solution preferably has a free SO42− concentration of 60 to 250 g/L. Also the electrolyte solution preferably has Cl− concentration of 0.5 to 2.0 ppm. The method of producing the electrolytic copper foil employs the copper electrolyte solution therefor.
摘要翻译：本发明提供一种生产电解铜箔的铜电解液，该电解铜箔能够提供箔，其中沉积箔的粗糙表面的山脉的形状和尺寸是均匀的，并且具有低的粗糙度，基本上不降低产率通过控制蛋白质的分子量和浓度等来制备电解铜箔的方法。在用于制造电解铜箔的铜电解液中，铜电解质溶液中的蛋白质的数均分子量优选为1000〜2300，铜电解液的蛋白质浓度优选为2 至4.5ppm。电解质溶液的Cu 2+浓度优选为60〜100g / L。此外，电解质溶液优选具有60至250g / L的游离SO 4 - 2 - 2 - 浓度。电解质溶液的浓度也优选为0.5〜2.0ppm。电解铜箔的制造方法采用铜电解液。

10. 发明授权

US06541126B1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil 失效
标题翻译：电解铜箔带有载体箔和覆铜层压板，采用电解铜箔
公开(公告)号：US06541126B1
公开(公告)日：2003-04-01
申请号：US09830122
申请日：2001-04-23
申请人： Junshi Yoshioka , Akiko Sugimoto , Sakiko Taenaka , Makoto Dobashi , Tsutomu Higuchi , Takuya Yamamoto , Ken-ichiro Iwakiri
发明人： Junshi Yoshioka , Akiko Sugimoto , Sakiko Taenaka , Makoto Dobashi , Tsutomu Higuchi , Takuya Yamamoto , Ken-ichiro Iwakiri
IPC分类号： B32B1504
CPC分类号： H05K3/025 , C25D1/04 , C25D1/22 , Y10T428/12556 , Y10T428/12903 , Y10T428/1291 , Y10T428/24851 , Y10T428/2495 , Y10T428/31678
摘要： To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.
摘要翻译：为了提供具有载体的电沉积铜箔，其中可以容易地形成诸如通孔（PTH），间隙通孔（IVH）和盲孔（BVH）的电连接孔。本发明提供了一种电沉积铜箔，其载体包括载体箔，形成在载体箔表面上的有机释放界面层和沉积在释放界面层上的电沉积铜箔层，其中铜微粒沉积在其上形成有机释放界面层和电沉积铜层的载体箔。

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