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    • 1. 发明申请
    • Copper electrolysis solution for production of electrolytic copper foil and process for producing electrolytic copper foil
    • 电解铜箔生产铜电解液及电解铜箔生产工艺
    • US20070017816A1
    • 2007-01-25
    • US10556464
    • 2004-11-11
    • Akiko Sugimoto
    • Akiko Sugimoto
    • C25D3/38
    • C25D3/38C25D1/04
    • This invention is for providing a copper electrolyte solution producing an electrolytic copper foil capable of providing a foil in which the shape and size of mountains of the rough surface of the deposited foil are uniform and which has low roughness, substantially without decrease of the yield of deposited foil by controlling the molecular weight and the concentration of protein, etc. and a method of producing an electrolytic copper foil using the same. In this copper electrolyte solution for producing an electrolytic copper foil, protein in the copper electrolyte solution preferably has a number average molecular weight Mn of 1000 to 2300 and the copper electrolyte solution preferably has a protein concentration of 2 to 4.5 ppm. The electrolyte solution preferably has Cu2+ concentration of 60 to 100 g/L. In addition, the electrolyte solution preferably has a free SO42− concentration of 60 to 250 g/L. Also the electrolyte solution preferably has Cl− concentration of 0.5 to 2.0 ppm. The method of producing the electrolytic copper foil employs the copper electrolyte solution therefor.
    • 本发明提供一种生产电解铜箔的铜电解液,该电解铜箔能够提供箔,其中沉积箔的粗糙表面的山脉的形状和尺寸是均匀的,并且具有低的粗糙度,基本上不降低产率 通过控制蛋白质的分子量和浓度等来制备电解铜箔的方法。 在用于制造电解铜箔的铜电解液中,铜电解质溶液中的蛋白质的数均分子量优选为1000〜2300,铜电解液的蛋白质浓度优选为2 至4.5ppm。 电解质溶液的Cu 2+浓度优选为60〜100g / L。 此外,电解质溶液优选具有60至250g / L的游离SO 4 - 2 - 2 - 浓度。 电解质溶液的浓度也优选为0.5〜2.0ppm。 电解铜箔的制造方法采用铜电解液。